DLA SMD-5962-94562 REV A-2009 MICROCIRCUIT LINEAR HIGH FREQUENCY VIDEO SWITCH MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Update drawing to current requirements. drw 09-08-03 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS COLU

2、MBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Rajesh R. Pithadia APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, HIGH FREQUENCY VIDEO SWITCH, MONOLITHIC SILICON DR

3、AWING APPROVAL DATE 94-03-31 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-94562 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E410-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY C

4、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead fin

5、ishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94562 01 M C A Federal stock class designator RHA designator (se

6、e 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Devic

7、e class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 0

8、1 HI-0222 High frequency video switch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN cl

9、ass level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 1

10、4 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

11、-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Voltage between +VCCand VCCterminals 36 V Supply voltage to ground (+VCC, VCC) 18 V Digital and analog input volta

12、ge (VA, VS, VD) +VCC+ 2 V -VCC 2 V Peak current (source to drain), (pulse at 0.8 ms, 10% duty cycle maximum) 100 mA Peak current (any pin, 50% duty cycle) 28 mA Continuous current (any pin) 15 mA Junction temperature (TJ) . +175C Storage temperature range -65C to +150C Lead temperature (soldering, 1

13、0 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C . 75C/W Case 2 76C/W 1.4 Recommended operating conditions. Operating supply voltage (VCC) 15 V Analog input voltage (VS) . VCCAddress low level (VAL) 0 V to 0.8 V Addr

14、ess high level (VAH) . 2.0 V to 5.0 V Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherw

15、ise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1

16、835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Sta

17、ndardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, superse

18、des applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reprod

19、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class

20、es Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M s

21、hall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF

22、-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits.

23、Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups

24、specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space l

25、imitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-

26、PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For devic

27、e classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved

28、source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for

29、 device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivere

30、d to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For dev

31、ice class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device

32、 class M devices covered by this drawing shall be in microcircuit group number 094 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

33、, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Source “OFF” leakage current ISOFFVS= 5 V, VD= -5 V, S1/S2 1 01 -2.

34、5 +2.5 nA 2, 3 -200 +200 VS= -5 V, VD= 5 V, S1/S2 1 -2.5 +2.5 2, 3 -200 +200 Drain “OFF” leakage current IDOFFVS= 5 V, VD= -5 V, S1/S2 1 01 -2.5 +2.5 nA 2, 3 -200 +200 VS= -5 V, VD= 5 V, S1/S2 1 -2.5 +2.5 2, 3 -200 +200 Channel “ON” leakage current IDONVD= VS= 5 V, S1/S2 1 01 -2.5 +2.5 nA 2, 3 -200

35、+200 VD= VS= -5 V, S1/S2 1 -2.5 +2.5 2, 3 -200 +200 Low level address current IALVA= 0.8 V, A1, A2 1, 2, 3 01 1.0 A High level address current IAHVA= 2.0 V, A1, A2 1, 2, 3 01 1.0 A Positive supply current +ICCVA= 0.8 V, 2.0 V, A1, A2 1 01 4.0 mA 2, 3 6.0 Negative supply current -ICCVA= 0.8 V, 2.0 V,

36、 A1, A2 1 01 -4.0 mA 2, 3 -6.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM

37、2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Switch “ON” resistance RDSVD= 5 V, IS= 7.5 mA, S1, S2 4 01 60 5, 6 75 VD= -5 V, IS= -7.5 mA, S1, S2 4 60 5,

38、6 75 “ON” resistance match (channel to channel) RONmatch VD= 5 V, ID= 7.5 mA, 3/ TA= +25C 4 01 5 Address capacitance CAVA= 2.0 V, 0.8 V, 3/ TA= +25C 4 01 10 pF Switch input capacitance CSOFFSwitch off: VA= 2.0 V, 3/ TA= +25C 4 01 25 pF Switch output capacitance CDOFFSwitch off: VA= 2.0 V, 3/ TA= +25

39、C 4 01 60 pF CDONSwitch on: VA= 0.8 V, 3/ TA= +25C 150 Drain to source capacitance CDSOFFSwitch off: VA= 2.0 V, 3/ TA= +25C 4 01 2.0 pF Off isolation VISOVS= 300 mVPPat f = 10 MHz, RL= 50, TA= +25C 3/ 4 01 -60 dB Turn “ON” time tONVS= 5 V, CL= 35 pF, RL= 2 k 9 01 150 ns 10, 11 200 Turn “OFF” time tO

40、FFVS= 5 V, CL= 35 pF, RL= 2 k 9 01 150 ns 10, 11 200 1/ Supply voltage (VCC) = 15 V, high level address voltage (VAH) = 2.0 V, and low level address voltage (VAL) = 0.8 V. Ground all nonconnected pins. See figures 2 and 3. 2/ The algebraic convention, whereby the most negative value is a minimum and

41、 the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of the device terminal. 3/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

42、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines C 2 Terminal number Terminal symbol 1 NC NC 2 VIN1NC 3 GND VIN14 +VCCGND 5 NC NC 6 VIN2+VCC7

43、NC NC 8 VOUT2NC 9 NC VIN210 VA2NC 11 -VCCNC 12 VA1VOUT213 NC NC 14 VOUT1VA215 - - - NC 16 - - - -VCC17 - - - NC 18 - - - VA119 - - - NC 20 - - - VOUT1NC = No connection. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

44、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Logic “0” = switch on FIGURE 3. Timing waveforms. VO= VINRL, CLincludes CFIXTURE+ CPROBERL+ RONFIGURE 2. Switching test circuit Provided by IHSNot f

45、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and

46、V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection proced

47、ures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in ac

48、cordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the in