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本文(DLA SMD-5962-94663 REV K-2013 MICROCIRCUIT DIGITAL CMOS RADIATION HARDENED SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL AND TRANSCEIVER MONOLITHIC SILICON .pdf)为本站会员(bowdiet140)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-94663 REV K-2013 MICROCIRCUIT DIGITAL CMOS RADIATION HARDENED SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL AND TRANSCEIVER MONOLITHIC SILICON .pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 04, 05, and 06. Modify boilerplate to include rad hard requirements. Editorial changes throughout. 96-03-13 Monica L. Poelking B Add device types 07, 08, and 09. Update boilerplate. Editorial changes throughout. TVN 98-08-27 Moni

2、ca L. Poelking C In table I, change IINlimits; add footnote to IDDQ; add tcin power-up master reset timing section; add footnote to VOSand VDIS. Correct the JTAG timing waveforms. Change footnote 3/ in table III. TVN 99-04-28 Monica L. Poelking D Add device types 10 and 11. Editorial changes through

3、out. - TVN 00-06-27 Monica L. Poelking E Add notes to memory write and memory read waveforms. Editorial changes throughout. TVN 01-03-13 Thomas M. Hess F Correct dimension L for case outline Y in figure 1. Also, correct footnote 1/ for radiation exposure connections in figure 6. TVN 01-07-27 Thomas

4、M. Hess G Specify PDA criteria in table IIA footnotes and in paragraph 4.2.2b. CFS 03-10-28 Thomas M. Hess H Update boilerplate paragraphs to current MIL-PRF-38535 requirements. CFS 09-03-16 Thomas M. Hess J Add detail B for figure 1, case outline Y. - PHN 11-03-22 David J. Corbett K Update radiatio

5、n features in section 1.5 and SEP table IB per GIDEP. Delete class M requirements throughout. - MAA 13-05-20 Thomas M. Hess REV K K K SHEET 35 36 37 REV K K K K K K K K K K K K K K K K K K K K SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS OF SHEETS REV K K K K K K K K

6、K K K K K K SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thomas M. Hess DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECK

7、ED BY Thomas M. Hess APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CMOS, RADIATION HARDENED, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL AND TRANSCEIVER, MONOLITHIC SILICON. DRAWING APPROVAL DATE 95-03-31 REVISION LEVEL K SIZE A CAGE CODE 67268 5962-94663 SHEET 1 OF 37 DSCC FORM 2233 A

8、PR 97 5962-E359-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94663 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documen

9、ts two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance

10、(RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 H 94663 01 V X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number

11、 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Gener

12、ic number Circuit function 01 69151-LX15 Serial microcoded multi-mode intelligent terminal with 15-volt transceiver 02 69151-DX Serial microcoded multi-mode intelligent terminal with 5-volt transceiver 03 69151-LX12 Serial microcoded multi-mode intelligent terminal with 12-volt transceiver 04 69151-

13、LXE15 Enhanced serial microcoded multi-mode intelligent terminal with 15-volt transceiver radiation hardened 05 69151-DXE Enhanced serial microcoded multi-mode intelligent terminal with 5-volt transceiver radiation hardened 06 69151-LXE12 Enhanced serial microcoded multi-mode intelligent terminal wi

14、th 12-volt transceiver 07 69151-LXE15 Enhanced serial microcoded multi-mode intelligent terminal with 15-volt transceiver 08 69151-DXE Enhanced serial microcoded multi-mode intelligent terminal with 5-volt transceiver 09 69151-LXE12 Enhanced serial microcoded multi-mode intelligent terminal with 12-

15、volt transceiver 10 69151-LXE15 Enhanced serial microcoded multi-mode intelligent terminal with 15-volt transceiver radiation hardened 11 69151-DXE Enhanced serial microcoded multi-mode intelligent terminal with 5-volt transceiver radiation hardened Provided by IHSNot for ResaleNo reproduction or ne

16、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94663 REVISION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 1.2.3 Device class designator. The device class designator is a single letter identifying the product assuran

17、ce level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 100 Pi

18、n grid array 1/ Y See figure 1 100 Leaded chip carrier with nonconductive tier bar 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. 1.3 Absolute maximum ratings. 2/ Storage temperature range (TSTG) . -65C to +150C Operating case temperature range (TC) .

19、 -55C to +125C Transceiver supply voltage (VEE): Device types 01, 03, 04, 06, 07, 09, 10 . -22 V dc Transceiver supply voltage range (VCC): Device types 02, 05, 08, 11 . -0.3 V dc to +7.0 V dc Logic supply voltage range (VDD) . -0.3 V dc to +7.0 V dc Input voltage range (VDR): Device types 01, 03, 0

20、4, 06, 07, 09, 10 . 42 VP,L-LDevice types 02, 05, 08, 11 . 10 VP,L-LMaximum power dissipation (PD) . 5 W Logic voltage on any pin range (VI/O) . -0.3 V dc to VDD+ 0.3 V dc Logic latch-up immunity (ILU) . 150 mA Logic input current (II) 10 mA Output current (IO): Device types 01, 03, 04, 06, 07, 09,

21、10 . 190 mA Device types 02, 05, 08, 11 . 1000 mA Maximum junction temperature (TJ) . +150C Receiver common mode input voltage range (VIC): Device types 01, 03, 04, 06, 07, 09, 10 . -11 V dc to +11 V dc Device types 02, 05, 08, 11 . -5 V dc to +5 V dc Lead temperature (soldering, 5 seconds) +300C Th

22、ermal resistance junction-to-case (JC): 3/ Cases X and Y . 7C/W _ 1/ This package contains 96 terminals on the bottom and 4 terminals on top of the package, see figure 1. 2/ Stresses above the listed absolute maximum rating may cause permanent damage to the device. This is a stress rating only, and

23、functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ Per MIL-STD-883, Method 1012. Provided by IHSN

24、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94663 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Transceiver supply voltage range (VCC

25、): Device types 01, 03, 04, 06, 07, 09, 10 . +4.75 V dc to +5.5 V dc Device type 02 . +4.75 V dc to +5.25 V dc Device types 05, 08, 11 . +4.5 V dc to +5.5 V dc Logic supply voltage range (VDD) . +4.5 V dc to +5.5 V dc Transceiver supply voltage range (VEE): Device types 01, 04, 07, 10 . -15 V dc Dev

26、ice types 03, 06, 09 . -12 V dc Receiver differential voltage (VDR): Device types 01, 03, 04, 06, 07, 09, 10 . 40 VP-PDevice types 02, 05, 08, 11 . 8.0 VP-PLogic dc input voltage range (VIN) 0 V dc to VDDReceiver common mode input voltage (VIC): Device types 01, 03, 04, 06, 07, 09, 10 . 10 V dc Devi

27、ce types 02, 05, 08, 11 . 5.0 V dc Driver peak output current (IO): Device types 01, 03, 04, 06, 07, 09, 10 . 180 mA Device types 02, 05, 08, 11 . 700 mA Serial data rate range (SD) . 0 to 1 MHz Clock duty cycle (DC) . 50 5% Case operating temperature range (TC) . -55C to +125C Operating frequency (

28、FIN) 24 MHz 0.01% 1.5 Radiation features. Maximum total dose available dose rate = 50 300 rads (Si)/s): Device types 04, 10 . 100 Krads (Si) Device type 05 . 1 Mrads (Si) Device type 11 . 300 Krads (Si) Single event phenomenon (SEP) : For device type 04: No SEL occurs at effective LET (see 4.4.4.2)

29、. 60 MeV-cm2/mg 1/ No SEU occurs at effective LET . 36 MeV-cm2/mg 1/ For device type 05: No SEL occurs at effective LET (see 4.4.4.2) . 60 MeV-cm2/mg 1/ No SEU occurs at effective LET . 36 MeV-cm2/mg 1/ For device type 10: No SEL occurs at effective LET (see 4.4.4.2) . 80 MeV-cm2/mg 1/ No SEU occurs

30、 at effective LET . 16 MeV-cm2/mg 1/ For device type 11: No SEL occurs at effective LET (see 4.4.4.2) . 99 MeV-cm2/mg 1/ No SEU occurs at effective LET . 16 MeV-cm2/mg 1/ 1.6 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, metho

31、d 5012) 95.12 percent _ 1/ Contact the manufacturer for SEP data. The SEP response is dependent upon the combination of protocol devices and transceiver devices. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND A

32、ND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94663 REVISION LEVEL K SHEET 5 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unl

33、ess otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Methods Standard Microcircuits

34、. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil/ or from the Stan

35、dardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the docume

36、nts cited in the solicitation or contract. THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Copies of these documents are available online at http:/www.ieee.org or from the IEEE Service Center, 445 Hoe

37、s Lane, P.O. Box 1331, Piscataway, NJ 088551331. ASTM INTERNATIONAL (ASTM) ASTM F 1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org or from ASTM Inter

38、national, P. O. Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicabl

39、e laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM

40、) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. Provided by IHSN

41、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94663 REVISION LEVEL K SHEET 6 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 he

42、rein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4. 3.2.5 Tim

43、ing waveforms. The timing waveforms shall be as specified on figure 5. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3

44、Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical

45、test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packa

46、ges where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance wi

47、th MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer

48、 in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 IEEE 1149.1 co

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