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本文(DLA SMD-5962-95550 REV A-2006 MICROCIRCUIT LINEAR QUAD MICROPOWER COMPARATORS MONOLITHIC SILICON《四重比较电路硅单片电路线型微电路》.pdf)为本站会员(dealItalian200)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-95550 REV A-2006 MICROCIRCUIT LINEAR QUAD MICROPOWER COMPARATORS MONOLITHIC SILICON《四重比较电路硅单片电路线型微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make correction to the “E” minimum inch dimension as specified under figure 1. Add note 9 under figure 1. - ro 06-01-26 R. MONNIN REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY

2、RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, QUAD MICROPOWER COMPARATORS, MONOLITHIC SILICON AN

3、D AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-12-27 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95550 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E111-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

4、DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q

5、), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class N, the

6、user is cautioned to assure that the device is appropriate for the application environment. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95550 01 N X D Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Le

7、ad finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ide

8、ntify the circuit function as follows: Device type Generic number Circuit function 01 TLC139M Quad differential comparators 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation

9、 M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A 1/ N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) 2/ Q or V Certifi

10、cation and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, JEDEC Publication 95, and as follows: Outline letter Descriptive designator Terminals Package style Document X MS-012 AB 14 Plastic small outline JEP 95 _ 1/ For this drawing devic

11、e class M shall not apply. See 6.1.2 herein, 6.6 herein and SMD 5962-87659 for MIL-STD-883 compliant, non-JAN class level B devices. 2/ Any device outside the traditional performance environment (i.e., an operating temperature range of -55C to +125C and which requires hermetic packaging). Provided b

12、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PR

13、F-38535 for device classes N, Q, and V. 1.2.5.1 Lead finish D. Lead finish D shall be designed by a single letter as follows: Finish letter Process D Palladium 1.2.6 Device class N manufacturer PIN. For device class N, plastic encapsulated microcircuits (PEMs) the following manufacturer PIN (see 3.5

14、.1 herein) shall be marked: Standard Microcircuit 3/ Drawing PIN Manufacturer PIN 5962-9555001NXD TLC139M 1.3 Absolute maximum ratings. 4/ Supply voltage range (VDD) 5/ . -0.3 V dc to +18 V dc Differential input voltage (VID) 6/ . 18 V dc Input voltage range (VIN) . -0.3 V dc to +VDDOutput voltage (

15、VOUT) . -0.3 V dc to VDDInput current (IIN) . 5 mA Output current (IOUT) (each output) . +20 mA Total supply current into VDDterminal . +40 mA Total current out of ground terminal . +60 mA Continuous total power dissipation (PD) 7/ 950 mW Storage temperature range -65C to +150C Lead temperature (sol

16、dering, 10 seconds) +260C 1.4 Recommended operating conditions. Supply voltage (VDD) +4 V dc minimum to +16 V dc maximum Common mode input voltage (VIC) . 0 V dc minimum to VDD- 1.5 V dc maximum Low level output current (IOL) . +20 mA Operating free-air temperature range (TA) -55C to +125C _ 3/ The

17、SMD PIN is provided for cross reference information, see 3.5.1 herein. 4/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 5/ All voltage values except differential voltages a

18、re with respect to network ground. 6/ Differential voltages are at the noninverting input terminal with respect to the inverting input terminal. 7/ Above +25C, derate at a factor of 7.6 mW/C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

19、CROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawi

20、ng to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883

21、 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/

22、assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless o

23、therwise specified, the issues of these documents are those cited in the solicitation. ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEP 95 - Registered and Standard Outlines for Semiconductor Devices (Copies of this document are available online at www.jedec.org/ or from the Electronics Industries Alliance

24、, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

25、specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in

26、the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions for device classes N, Q, and V shall be as specified in MIL-PRF-38535 and herein. 3.2.1 Case outline. The case outline sha

27、ll be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics a

28、nd postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in ta

29、ble I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteris

30、tics. Test Symbol Conditions 1/ -55C TA +125C Group A 2/ subgroups Device type Limits 3/ Unit unless otherwise specified Min Max Input offset voltage 4/ VIOVICR= 0 V to VDD 1 V, VDD= 5 V to 10 V 1 01 5 mV VICR= 0 V to VDD 1.5 V, VDD= 5 V to 10 V 2,3 10 Input offset current IIOVIC= 2.5 V, TA= +125C 2

31、 01 15 nA Input bias current IIBVIC= 2.5 V, TA= +125C 2 01 30 nA Common mode input voltage range VICR1 01 0 to VDD- 1 V 2,3 0 to VDD- 1.5 High level output current IOHVID= 1 V, VOH= 5 V, 1 01 40 nA TA= +25C, -55C 2 1 A Low level output voltage VOLVID= 1 V, IOL= 6 mA, 1 01 400 mV TA= +25C, -55C 2 800

32、 Supply current IDDNo load, outputs low 1 01 80 A (four comparators) 2,3 175 1/ Unless otherwise specified, VDD= 5 V and VICR= 0 V. 2/ All group A subgroup 3 (TA= -55C) test limits are guaranteed but not tested. 3/ The algebraic convention, whereby the most negative value is a minimum and the most p

33、ositive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 4/ The offset voltage limits given are the maximum values required to drive the output above 4.5 V or down 0.3 mV with a 2.5 k load to VDD. Provided by IHSNot for Res

34、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 FIGURE 1. Case outline X. Provided by IHSNot for ResaleNo reproduction or ne

35、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Dimensions Symbol Inches Millimeters Note Min Max Min Max A .053 .068 1.35 1.75 A1 .003 .008 0.10 0.

36、21 b .014 .020 0.36 0.51 8 c .007 .009 0.19 0.25 D .336 .344 8.55 8.75 2 E .228 .244 5.80 6.20 E1 .149 .157 3.80 4.00 3 e .049 BSC 1.27 BSC h .009 .019 0.25 0.50 4 0 8 0 8 L .019 .045 0.50 1.15 5 N 14 14 6 Note 1, 7, 9 NOTES: 1. The controlling dimensions are in millimeters. Inch dimensions are for

37、reference only. 2. Dimension “D“ does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed 0.25 mm ( .009 inch )per side. 3. Dimension “E1“ does not include inter-lead flash or protrusions. Inter-lead flash or protrusions shall not exceed 0.25 mm

38、 ( .009 inch ) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. “L“ is the length of terminal for soldering to a substrate. 6. N is the number of terminal positions. 7. Terminal numbers are shown for refer

39、ence only. 8. The lead width “b“, as measured 0.36 mm ( .014 inch ) or greater above the seating plane, shall not exceed a maximum value of 0.61 mm ( .024 inch ). 9. Falls within JEDEC MS-012 variation AB. FIGURE 1. Case outline X Continued. Provided by IHSNot for ResaleNo reproduction or networking

40、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 OUTPUT 1 2 OUTPUT 2 3 VDD4 -INPUT 2 5 +INPUT

41、 2 6 -INPUT 1 7 +INPUT 1 8 -INPUT 3 9 +INPUT 3 10 -INPUT 4 11 +INPUT 4 12 GND 13 OUTPUT 4 14 OUTPUT 3 FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95550 DEFENSE SUPPLY CENTE

42、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class N Device class Q Device class V Interim electrical parameters (see 4.2) - - - Final elect

43、rical parameters (see 4.2) 1,2,3 1/ 1,2,3 1/ 1,2,3 1/ Group A test requirements (see 4.4) 1,2,3 1,2,3 1,2,3 Group C end-point electrical parameters (see 4.4) - 1 1 Group D end-point electrical parameters (see 4.4) - 1 1 Group E end-point electrical parameters (see 4.4) - - - 1/ PDA applies to subgro

44、up 1. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the de

45、vice. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. 3.5.1 Marking for device class N. For PEM packages the SMD PIN in 1.2 herein and the MIL-PRF-38535 marking is not required. Marking on

46、the device shall include; a traceable date code, country of origin, pin one indicator, and manufacturers identification. In addition, the QML certification mark and the manufacturer PIN as shown in 1.2.6 herein shall be marked on the topside of the package. Manufacturer may at their option place the

47、 QML certification mark adjacent to the manufacturer PIN. In all cases, the purchase order shall reflect the SMD PIN as shown in 1.2 herein. 3.5.2 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificat

48、e of compliance. A certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535 shall be

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