DLA SMD-5962-95821-1996 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS HIGH PERFORMANCE PROGRAMMABLE DMA CONTROLLER MONOLITHIC SILICON《抗辐射互补金属氧化物半导体高度可编程直接存储器存取控制器硅单片电路线型微电路》.pdf

1、SMD-59b2-95821 9999%9b 0083950 376 m LTR DESCRIPTION DATE CIR-MQDA) APPROVED REV I I I CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-01-10 REV I I I MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HIGH PERFORMANCE PROGRAMMABLE DMA CONTROLLER, MONOLITHIC SILICON I

2、 I SHEET REV STATUS OF SHEETS REVISION LEVEL PMIC NIA 596 2-958 2 I SIZE CAGE CODE A 67268 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA 1 OF 24 I SHEET ESC FORM 193 JUL 94 DISTRIBUTION STATEMENT A ADoroved for p

3、ublic release: distribution is unlimited 5962-E217-96 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - - SND-sqb2-q5823 9999996 0083953 202 1. SCWF 1.1 m. This drawing forms a part of a one part - one part nunber docunentation system (see 6.6 herei

4、n). Two product assurance classes consisting of military high reliability (device classes (3 and M) and space application (device class V), and a choice of case outlines and led finishes are available and are reflected in the Part or Identifying Nurber (PIN). Device class M microcircuits represent n

5、on-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, HProvisiaw for the use of MIL-STO-883 in conjvrtion with coipliant non-JAN eviUrr. Hen vaflbble, a choice of Radiation Hardness Assurance (RHA) Ievels are reflected in the PIN. I 1.2 m. The PIN shall be as shorn in the following e

6、xanple: Ilzr-=L_rfr Federal RHA Device Device Case Lead stock class designator type c 1 ass out 1 ine finish designator (see 1.2.1) (see 1.2.2) des i gnator (see 1.2.4) (see 1.2.5) Lu (see 1.2.3) / Drawing Mmber 1.2.1 udesia . Device class M RHA marked devices shall meet the MIL-1-3535 appendix A sp

7、ecified RHA levels and shall be mrked with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes O and V RHA marked devices shall meet the A dash (-1 indicates a 1.2.2 Device tvwm . lhe device typeCs)

8、shall identify the circuit function as follows: v 2. APPLICABLE DOCUMENTS . Unless otherwise specified, the following -. . 2.1 -on. s- bulletin. and specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards s

9、pecified in the solicitation, form a part of this drauing to the extent specified herein. SPECIFICATION MIL I TARY MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS MIL I TARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configura

10、tion Management. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN Mi LI TARY MIL-BUL-103 - List of Standardized Military Drawings (SMDIS) HAMDBOOK DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-9521 9999946 O083953

11、085 W STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 (Copies of the specification, standards, bulletin, end hendbook rcquired by nianufacturera in canaction with specific acquisition fmctions should be obtained from the contracting activity or as directed by the c

12、ontracting activity.) In the event of a conflict between the text of this drawing end the references cited 2.2 Qr+r of or-. herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 . The individuel item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-8

13、83, “Provisions for the use of MIL-STD-883 in conjunction with conpliant non-JAN devicesnn and as specified herein. The individual item requirements for device classes P and V shall be in accordance with MIL-1-38535 and as specified herein or as modified in the device nmnufacturerns Quality Manageme

14、nt (QII) plan. plan shall not effect the form, fit, or finction as described herein. specified in MIL-STD-883 (see 3.1 herein) for device class M and MIL-1-38535 for device classes Q and V and herein. The modification in the QII 3.2 Desian. mtruction.ical diipensions . 3.2.1 Case. 3.2.2 3.2.3 Block

15、diaaram . 3.2.4 3.2.5 bdiation exwsure c ircuit. 3.3 -racteristics and wstirradiation -ter The design, construction, and physical dimensions shall be as The case outlinc(s) shall be in accordance with 1.2.4 herein and figure 1. . The terminal connections shall be as specified on figure 2. The block

16、diagram shall be as specified on figure 3. wavefm test c ircuit The switching waveform shall be as specified on figure 4. The radiation exposure circuit shall be as specified on figure 5. . Unless otherwise specified - -. herein, the electrical performance characteristics and postirradiation paramet

17、er limits are as specified in table I and shall apply over the full dient operating tenperature range. 3.4 utrical test r- . The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 w. The part shall be marked

18、with the PIN listed in 1.2 herein. Marking for device classes P and V shall be in accordance with MIL-1-38535. Marking for device class M shall be in accordance with MIL-ST3-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in MIL-BUL-103. . 3.5.1 SprtificilfiPOLE

19、PmeCiBaCe mark The conpliance mark for device class M shall be a ltCl as required in . MIL-STD-883 (see 3.1 herein). in MIL-1-38535. The certification mark for device classes P and V shall be a alPMLaa or tnP1l as required . 3.6 Certificate of comliancc For device class M, a certificate of carplianc

20、e shall be required from a ._ manufacturer in order to be listed as an approved source of supply in MIL-WJL-103 (see 6.7.2 herein). classes a and V, a certificate of compliance shell be required froin a ML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 he

21、rein). The certificate of carpliance submitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes P and V, the requirements of MIL-

22、1-38535 and the requirements herein. For device . 3.7 mtificate of conformance A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or for device classes P and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Ilpt

23、ification of champ for device class I4 . For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. 3.9 yerification and review for device class y . For device class M, DESC, DESCs

24、 agent, and the acquiring activity Offshore docwntation retain the option to review the manufacturers facility and applicable required docmentation. shall be made available onshore at the option of the reviewer. 3.10 Lljcrocircuit wouD assiqwnt for device class . Device class M devices covered by th

25、is drawing shall be in microcircuit group nvnber 105 (see MIL-1-38535, appendix A). SIZE A 5962-95821 SEVISION LEVEL SHEET 4 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SND-5962-9582L 9999996 0083954 TLL Limits Unit s-1 Cond

26、itions 1/ -55C s TA s +125C wless otherwise specified Input leakage current IIL or pD f 5.5 V, - O V or 5.5 V, DIE Pins: 6, 7, 11-13, 16-19 IIH IDDOP VDD = 5.5 v, Io = o mA, ;I! = GND or VDD, - 5 HHZ OUT See 4.4.1 = Open, f 1 MHz, measurements referenced to device ground I/O capacitance Functional t

27、est See 4.4.1 App = Open, f = 1 MHz, to device ground See 4.4.lb VDD 4.5 V and 5.5 V, vs = GND Or VQQ, f = I MH CI/O measurements referenced Noise imnunity functional test See 4.4.lb VDD = 4.5 V and 5.5 V, VIN I GND or VDD - vDD - 4.5 v, VIN = v ad v or I I - Device tvpc Group A subgrorps Test Al 1

28、- A1 1 - Al 1 - A1 1 - AL 1 VDD = 4.5 V, 10 = -2.5 II 1 DB float delay from IOU DESC FORM 193A JUL 94 tlRHDZ VDD = 4.5 V and 5.5 V 41 9,10,11 All 10 STANDARD MICROCIRCUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 A 5962-95821 REVISION LEVEL SHEET 9 Provided by IHSNot for ResaleNo rep

29、roduction or networking permitted without license from IHS-,-,-l-“I + 1 = t-Ll,-,r , A I I i Y O LE4 T SMD-5962-95821 W 9999996 0083959 5T3 W Case X s1 Figure 1. Case outline. SIZE A 5962-95821 STANDARD MICROCIRCUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET 10 DE

30、SC FORM 193A JUL 94 rLEAD FINISH 7- 7 i i SECTION A-A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Case X El 17.27 0.680 E2 13.46 13.97 0.530 0.560 e 11 0.050 BSC 1.27 ESC L 8.13 8.89 0.320 0.350 Q 1.14 1.65 O. 045 O. O65 8 si o o 6 M 0.04 O. O015

31、 Figure 1. Case outling. - Continued JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-9999996 0084105 Tb2 Devi ce type o1 Case outlines Q Terminal Terminal Terminal Termina nunber symbol nunber symbol - 1 I OR 21 DB7 2 I ou 22 D6 - 3 HEUR 23 DB

32、5 4 MEU 24 DACK1 5 N.C. 25 DACKO 6 READY 26 D4 7 HLDA 27 DE3 - 8 ADSTB 28 DE2 9 AEN 29 DB 1 10 HRQ 30 DBO T I “00 31 - 11 cs I FIGURE 2. Terminal connections. 5962-95821 REVISION LEVEL SHEET STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 94 Prov

33、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ Device type o1 Case outlines X Terminal nuher 1 I l I l - 2 I ow 24 D5 I Terminal Terminal Termi na L syinbol nunber syinbol - I OR 23 DB6 1 3 lm125 I DACK1 I 4 5 6 MEMW 26 DACKO N.C. 27 NC READY 28 DB4 7

34、 HLDA 8 ADSTB I 9 I AEN I 31 I 29 DB3 30 DBZ D 1 11 12 13 I I I 10 I HRQ I 32 I DBO I - cs 33 VDD CiK 34 AO RESET 35 Al 14 15 DACKZ 36 A2 DACK3 37 A3 I I I 16 I NC I 38 1 EOP I I - 19 20 I I I 17 I DRE3 I 39 I A4 I I DREP1 41 A6 DREQO 42 A7 I 18 1 ORE92 I 40 I A5 I 22 D7 1 I STANDARD MICROCIRCUIT DR

35、AWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Figure 2. Terminal connections. - Continued SIZE A 5962-95821 REVISION LEVEL SHEET 13 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Provided by IHSNot for ResaleNo rep

36、roduction or networking permitted without license from IHS-,-,- IUL IUH I DU AO-A3 INPUT VALID 080-087 INPUT VALID SLAVE HOOE TIHING NOTEI HOST SYSTH HUST ALLOU AT LEAST TCLCL AS RECOVERY TIME BETWEEN SUCCESSIVE WRITE ACCESSES. - cs I I AO-A3 AOORESS HUST BE VALID -I AVIRL )c I RHAX - I OR 080-087 D

37、ATA OUT VALID SLAVE HODE TIHING NOTE: HOST SYSTEH HUS1 ALLOW AT LEAST TCLCL AS RECOVERY TIM EETUEEN SUCCESSIVE WRITE ACCESSES. RYVCL -4 I- I -i I- RYVCL - READY READY - - NDTE: READ REFERS TO BOTH FR AND MEHR OUTPUTS. WRITE REFERS TO BOTH AND OUTPUTS Figure 4. Timins waveforms test circuit. 5962-958

38、21 REVISION LEVEL SHEET STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I I 1 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-v1 DEVICE UNDER TEST O* :iT OUTPUT FROH INCLUDES STRAY I AND JIG CA

39、PACITANCE - AC TEST CIRCUII VDD -1.5 v VIL -0.4 v INPUT “OL AC TESTING INPUT AND OUTPUT WAVEFORMS VI RI Cl Pins ALL output except EOP 1.7 V 510n 100 pF I - I I I I I I Voo I 1.6 kn 1 50 pF EOP JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SI

40、D-59b2-95821 9999996 O083965 8T7 STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 OREO AOSTE -5 000-007 -y- ADDRESS VALID - - READ -$ SEE NDTE URITE I_II N II IN1 KP FOR EXTENDED URITE SIZE A 5962-95821 REVISION LEVEL SHEET 17 CHCL -s EXT EOP OMA TRANSFER Figure 4.

41、Timins waveforms test circuit. - Continued DECC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-95821 9999996 0083966 733 W SIZE A STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 CLK t C AD

42、ST6 AO-A? 060-O67 MEHR ME” INT OP EXT OP 5962-95821 REVISION LEVEL SHEET 18 ?(/y-/,/,/, MEMORY-TO-HEMORY TRANSFERS IC ,a DO Figure 4. Tirninq naveforms test circuit. - Continued Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1 s2 1 s4 I s2 1 s4 I CL

43、K I AO-A7 - READ SEE NOTE WRITE SEE NOTE . READY COHPRESSED TRANSFER - - Note: READ refers to both and E outputs. WRITE refers to both and E outputs. . - Continued Jiminq waveforms test circuit Figure 4. 5962-95821 REVISION LEVEL SHEET STANDARD MICROCIRCUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAY

44、TON, OHIO 45444 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-R - 1 IC “R7- LOAO LOAO 4 w 5 R I SIZE A STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL W 5962-95821 SHEET 20 - L

45、OAO LOAO LOAO R R 55J-w- %J-w+ EJ-v%+ a TOGGLE CLOCK RESET TOGGLE I - LOAD OUT tes: I. R = 47kn 2. Pins with Load: 3, 4, a, 9, 10, 37-40 Pins with Load2: 14, 15, 21-30 Pins brought out: 12 (Clock), 13 (Reset) Voo 5.5 V I 0.5 V 3. Provided by IHSNot for ResaleNo reproduction or networking permitted w

46、ithout license from IHS-,-,- SMD-5962-95821 9999996 0083967 442 STANDARD MICROCIRCUIT DRAWING * DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 , A 596 2-95 8 2 1 REVISION LEVEL SHEET 21 4. WALITY ASWRANCE PRWISIOIIS 4.1 SnppDlina and Uwct ipn. MIL-STD-883 (see 3.1 herein). For device classes P

47、 and V, sampling and inspection procedures shall be in accordance with MIL-1-38535 or as modified in the device manufacturers Quality Management (Cm) plan. lhe dification in the W plan shall not effect the form, fit, or function as described herein. For device class M, sampling and inspection proced

48、ures shall be in sccordencc With 4.2 m. For device class M, screening shall be in accordance with method 5004 of MIL-Sl-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes 4 and V, screening shall be in accordance with MIL-1-38535, and shall be cwducted on all devices prior to qualification and technology conformance inspect i on. -. 4.2.1 -1 criteria for device clasu. a. Burn-in test, method 1015 of MIL-STO-883. (1)