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本文(DLA SMD-5962-96658 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL HEX SCHMITT-TRIGGER INVERTERS MONOLITHIC SILICON.pdf)为本站会员(syndromehi216)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96658 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL HEX SCHMITT-TRIGGER INVERTERS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to Table I, VOH, VOL, and Propagation delay time, and changes to Figure 4. -tdn 96-08-09 Raymond Monnin B Change document to new boilerplate. Changes to Table I, VOHand VOL. Editorial changes throughout. -les 97-12-17 Raymond Monnin C Upd

2、ate to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-12-16 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-10-02 Charles F. Saffle REV SHET REV SHET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4

3、 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tom M. Hess APPROVED BY Monica

4、 L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, HEX SCHMITT-TRIGGER INVERTERS, MONOLITHIC SILICON DRAWING APPROVAL DATE 95-11-06 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-96658 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E249-09 Provided by IHSNot for ResaleNo reproduct

5、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of

6、 high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 P

7、IN. The PIN is as shown in the following example: 5962 - 96658 01 Q C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V

8、 RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2

9、.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS14 Hex schmitt-trigger inverters 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device

10、 class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are

11、as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C CDIP2-T14 or GDIP1-T14 14 dual-in-line package D CDFP2-F14 or GDFP1-F14 14 flat package 2 CQCC1-N20 20 square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535

12、 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHE

13、ET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0V dc Storage temperature -65C to +150C Power dissipation (PD) 2/ 115 mW maximum Lead temperature (soldering, 10 seconds) +300C Thermal resist

14、ance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum High level output current (IOH) . -0.4 mA minimum Low level output current (IOL) . 4 mA maximum Input clamp current

15、 (IIK) . -1.5 V maximum Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, th

16、e issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface S

17、tandard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Docu

18、ment Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable la

19、ws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test

20、 e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements.

21、 The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The

22、 individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-3853

23、5 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth ta

24、ble shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and timing waveforms. Test circuit and timing waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limi

25、ts. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups

26、 specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space

27、limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL

28、-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For devi

29、ce classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved

30、 source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or fo

31、r device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits deliver

32、ed to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For de

33、vice class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Devic

34、e class M devices covered by this drawing shall be in microcircuit group number 8 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

35、, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, VIN= 0.5 V, IOH= -0.4 mA 1, 2, 3 2.5 V Low l

36、evel output voltage VOLVCC= 4.5 V, VIN= 1.9 V, IOL= 4 mA 1, 2, 3 0.4 V Hysteresis high 1/ VT+VCC= 5.0 V 1, 2, 3 1.4 1.9 V Hysteresis low 1/ VT-VCC= 5.0 V 1, 2, 3 0.5 1 V Hysteresis high to low 1/ VT+-VT-VCC= 5.0 V 1, 2, 3 0.4 V Input clamp voltage VIKVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V High level

37、 input current IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7.0 V 0.1 mA Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -0.4 mA Supply current ICCHVCC= 5.5 V 1, 2, 3 16 mA ICCL21 Short circuit output current 2/ IOSVCC= 5.5 V 1, 2, 3 -20 -100 mA Functional tests See 4.4.1b,

38、 VCC= 4.5 V, 5.5 V 7, 8 Propagation delay time A to Y tPLH, tPHLVCC= 5.0 V RL= 2 k 9 22 ns CL= 15 pf 10, 11 29 1/ 1/ This parameter is guaranteed but not tested. 2/ Not more than one output should be shorted at a time and the duration of the short circuit conditions shall not exceed one second. Prov

39、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number

40、 Terminal symbol 1 1A NC 2 1Y 1A 3 2A 1Y 4 2Y 2A 5 3A NC 6 3Y 2Y 7 GND NC 8 4Y 3A 9 4A 3Y 10 5Y GND 11 5A NC 12 6Y 4Y 13 6A 4A 14 VCC5Y 15 NC 16 5A 17 NC 18 6Y 19 6A 20 VCCFIGURE 1. Terminal connections. Input Output A Y L H H L H = High logic level L = Low logic level FIGURE 2. Truth table. Provide

41、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo

42、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. RL= 2 k. 2. CL= Load capacitance includes jig and probe capacitance. 3.

43、All input pulses have the following characteristics: PRR 1 Mhz, ZOUT50 , tr 1.5 ns, tf 2.6 ns. 4. The outputs are measured one at a time with one input transition per measurement. 5. All diodes are 1N3064 or equivalent. FIGURE 4. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo rep

44、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and

45、 inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be i

46、n accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with m

47、ethod 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under docume

48、nt revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or appro

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