DLA SMD-5962-96699 REV B-2009 MICROCIRCUIT LINEAR DC MOTOR PULSE WIDTH MODULATOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 02-04-16 R. MONNIN B Make changes to IIB, VSW, VLT, VOL, and IOStests as specified under Table I. Delete case outline 2 information from figure 1. - ro 09-07-21 C. SAFFLE REV SHET REV SHET REV

2、 STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMEN

3、T OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, DC MOTOR PULSE WIDTH MODULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-04-23 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96699 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E251-09 Provided by IHSNot for

4、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class l

5、evels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflecte

6、d in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96699 01 M E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Devi

7、ce classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a n

8、on-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SG1731 DC motor pulse width modulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level

9、 as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The c

10、ase outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for devi

11、ce class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Suppl

12、y voltage (VS) 18 V Analog inputs VSOutput driver supply voltage (VO) . 25 V Digital inputs ( SHUTDOWN ) . -VS- 0.3 V to -VS+ 18 V Source/sink output current (continuous) . 200 mA Source/sink output current (peak, 500 ns) 400 mA Output driver diode current (continuous) 200 mA Output driver diode cur

13、rent (peak, 500 ns) . 400 mA Power dissipation (PD) . 1560 mW Junction temperature (TJ) . +150C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 80C/W 1

14、.4 Recommended operating conditions. Supply voltage range (VS) 3.5 V to 15 V Error amp common-mode range . -VS+ 3 V to -VS- 3 V Output driver supply voltage range . 2.5 V to 22 V Source/sink output current (continuous) . 100 mA Source/sink output current (peak, 500 ns) 200 mA Output driver diode cur

15、rent (continuous) 100 mA Output driver diode current (peak, 500 ns) . 200 mA Oscillator frequency range 10 Hz to 350 kHz Oscillator voltage (peak-to-peak) 1 V to 10 V Oscillator timing capacitor (CT) . 200 pF to 2.5 F Ambient operating temperature range (TA) -55C to +125C _ 1/ Stresses above the abs

16、olute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DE

17、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unle

18、ss otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits.

19、MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or fro

20、m the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however

21、, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers

22、Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Desi

23、gn, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4

24、 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrica

25、l performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for

26、each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the option of not mark

27、ing the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance m

28、ark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

29、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type

30、Limits Unit Min Max Oscillator section Timing capacitor charging current ICT1,2,3 01 400 600 A 2 V input bias current IIBVCM= 5 V 1,2,3 01 -20 A Initial oscillator frequency fIOCT= 1000 pF, TA= +25C, 2 V = 5 V 4 01 22.5 27.5 kHz Temperature stability tSCT= 1000 pF, 2/ 2 V = 5 V 1,2,3 01 10 % Error a

31、mplifier section 3/ Input offset voltage VIO1,2,3 01 10 mV Input bias current IIB1,2,3 01 3 A Input offset current IOS1,2,3 01 600 nA Open loop voltage gain AVOLRL= 2 k 4,5,6 01 70 dB Output voltage swing VSWRL= 2 k 1,2,3 01 10 V Common mode rejection ratio CMRR 4,5,6 01 70 dB Slew rate 2/ SR Measur

32、ed at 10 % and 90 % points, TA= +25C 4 01 5 V/s Unity gain bandwidth UGBW TA= +25C 2/ 4/ 4,5,6 01 0.7 MHz Pulse width modulator comparators section Input bias current IIBVT= 3 V 1,2,3 01 6 A SHUTDOWN section Logic threshold voltage VLTVS= -3.5 V to -15 V 1,2,3 01 VS+ 0.8 VS+ 2.0 V SHUTDOWN high curr

33、ent IHSDVSD= -VS+ 2.4 V 1,2,3 01 400 A SHUTDOWN low current ILSDVSD= -VS1,2,3 01 -1 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUM

34、BUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output drivers (each output) section High output voltage

35、VOHISOURCE= 20 mA 1 01 19.2 V ISOURCE= 100 mA 2,3 19.0 Low output voltage VOLISINK= 20 mA 1 01 -19.2 V ISINK= 100 mA 2,3 -19.0 Driver rise time tRCL= 1000 pF 9,10,11 01 300 ns Driver fall time tFCL= 1000 pF 9,10,11 01 300 ns Total supply current section Supply current ISVSD= -VS+ 0.8 V 1,2,3 01 14 m

36、A Output supply current IOSVSD= -VS+ 0.8 V 1,2,3 01 6 mA 1/ Supply voltage (VS) = 15 V and output voltage (VO) = 22 V. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. 3/ Common mode voltage (VCM) = 12 V. 4/ Unity gain inverting 10 k feedback resistance. 3.6 Certifica

37、te of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order t

38、o be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-

39、PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lo

40、t of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review

41、for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment

42、 for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 58 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPP

43、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 +VT2 2 V+ 3 NONINVERTED INPUT 4 INVERTED INPUT 5 ERROR 6 CT7 2 V- 8 -VT9 -VS10 SUBSTRATE11 -VO12 OUTPUT B13 OUTPUT A14 +VO15 SHUTDOWN 16 +VSNote

44、: The manufacturer never supplied case outline 2 to this document. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

45、0 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96699 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET

46、9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the

47、form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qua

48、lification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the prep