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本文(DLA SMD-5962-96748 REV E-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 3 3-VOLT OCTAL BUS TRANSCEIVER AND REGISTER WITH BUS HOLD THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLIT.pdf)为本站会员(李朗)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96748 REV E-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 3 3-VOLT OCTAL BUS TRANSCEIVER AND REGISTER WITH BUS HOLD THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLIT.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change test conditions in Note 2 of Figure 5. - JAK 96-06-14 Monica L. Poelking B Change the values of VCCfor the ground bounce noise tests from 3.0 V to 3.3 V. - CFS 97-04-24 Monica L. Poelking C Change the device name to reflect the Bus Hold fe

2、ature, and adjust limits to characterize the performance of the optimized die. Editorial changes throughout. - CFS 99-02-17 Monica L. Poelking D Correct the value of VCCfor IIH, and correct the values of VCCfor the ground bounce noise tests from 3.3 V to 3.0 V due to the optimized die. - CFS 99-03-1

3、9 Monica L. Poelking E Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-04-23 Thomas M. Hess REV SHET REV E E E E E E SHEET 15 16 17 18 19 20 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Ke

4、rby CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-01-26 MI

5、CROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-VOLT OCTAL BUS TRANSCEIVER AND REGISTER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-96748 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E235-09 Provided by IHSNot for Re

6、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class leve

7、ls consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected i

8、n the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96748 01 Q K A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device

9、 classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non

10、-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LVTH646 3.3-volt octal bus transceiver and register with bus hold, three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device cla

11、ss designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certi

12、fication and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square

13、chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-967

14、48 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +4.6 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (high state or power-off

15、state) (VOUT) -0.5 V dc to +7.0 V dc 4/ DC input clamp current (IIK) (VIN 0.0 V). -50 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL) (per output) +96 mA DC output current (IOH) (per output) . +48 mA Maximum Power Dissipation at TA= 55C (in still air) (PD) 262 mW 5/ Sto

16、rage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +2.7 V dc to +3.6 V dc Input voltage ran

17、ge (VIN) +0.0 V dc to +5.5 V dc Output voltage range (VOUT). +0.0 V dc to +5.5 V dc Minimum high level input voltage (VIH). +2.0 V dc Maximum low level input voltage (VIL) +0.8 V dc Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA Maximum input rise or fal

18、l rate (outputs enabled) (t/v). 10 ns/V Case operating temperature range (TC). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherw

19、ise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1

20、835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Sta

21、ndardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted,

22、 all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings a

23、re observed. 5/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. Provided by IHSNot for ResaleNo reproduction or networking permitted

24、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, t

25、he text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PR

26、F-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, app

27、endix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device clas

28、s M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specifi

29、ed on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. Th

30、e radiation exposure circuit shall be as specified when available. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall

31、 apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 here

32、in. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be

33、marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PR

34、F-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawin

35、g (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply fo

36、r this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

37、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device

38、 class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required fo

39、r any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onsho

40、re at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

41、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.7 V VCC +3.6

42、 V unless otherwise specified Device type VCCGroup A subgroups Limits 3/ Unit Min Max Negative input clamp voltage 3022 VICFor input under test IIN= -18 mA All 2.7 V 1,2,3 -1.2 V High level output voltage 3006 VOH1For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOH= -100 A All 2.7 V a

43、nd 3.6 V 1,2,3 VCC0.2 V VOH2For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOH= -8 mA All 2.7 V 1,2,3 2.4 VOH3For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOH= -24 mA All 3.0 V 1,2,3 2.0 Low level output voltage 3007 VOL1For all inputs affecting output under test VI

44、N= 2.0 V or 0.8 V IOL= 100 A All 2.7 V 1,2,3 0.2 V VOL2For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOL= 24 mA All 2.7 V 1,2,3 0.5 VOL3For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOL= 16 mA All 3.0 V 1,2,3 0.4 VOL4For all inputs affecting output under test VIN= 2

45、.0 V or 0.8 V IOL= 32 mA All 3.0 V 1,2,3 0.5 VOL5For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOL= 48 mA All 3.0 V 1,2,3 0.55 Input current high 3010 IIH4/ Control pins For input under test VIN= 5.5 V All 0.0 V and 3.6 V 1,2,3 10.0 A Control pins For input under test VIN= VCCAll 3.

46、6 V 1,2,3 1.0 A or B ports For input under test VIN= 5.5 V Unused pins at VCC or GND All 3.6 V 1,2,3 20.0 A or B ports For input under test VIN= VCCUnused pins at VCCor GND All 3.6 V 1,2,3 1.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without

47、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C

48、TC +125C +2.7 V VCC +3.6 V unless otherwise specified Device type VCCGroup A subgroups Limits 3/ Unit Min Max Input current low 3009 IIL4/ Control pins For input under test VIN= GND Unused pins at VCCor GND All 3.6 V 1,2,3 -1.0 A A or B ports For input under test VIN= 0.0 V Unused pins at VCCor GND All 3.6 V 1,2,3 -5.0 Input bus hold current IHOLDA or B ports VIN= 0.8 V All 3.0 V 1,2,3 75.0 A A or B ports VIN= 2.0 V -75.0 Three-state output current, power-up 3020 IOZPU5/ 6/ VOUT= 0.5 V to 3.0 V OE = 0.0 V All 0.0 V and 1.5 V 1,2,3 100.0 A Three-state output current, power-d

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