DLA SMD-5962-96751 REV B-2009 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DUAL J-K FLIP-FLOPS WITH CLEAR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-11-13 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 09-10-02 Charles F. Saffle REV SHET REV SHET REV

2、 STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPART

3、MENT OF DEFENSE CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, DUAL J-K FLIP-FLOPS WITH CLEAR, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-02-09 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96751 SHEET 1 OF 11 DSCC FORM 2233

4、APR 97 5962-E250-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawi

5、ng documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation H

6、ardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96751 01 Q C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /

7、 Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriat

8、e RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS73A Dual J-K flip-flops with clear 1.2.3 Device class designator. The device class designator is a single let

9、ter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to

10、 MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line package D GDFP1-F14 or CDFP2-F14 14 Flat package 1.2.5 Lead finish. The lead finish is as

11、 specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

12、8-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc minimum to +7.0 V dc maximum Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 110 mW Lead temp

13、erature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimim to +5.5 V dc maximum Minimum high level output current (IOH) -0.4 mA Maximum low level

14、 output current (IOL) . 4 mA Maximum input clamp voltage (VIK) . -1.5 V Pulse width (tW) : Clock high 20 ns Clear low . 25 ns Setup time (tSU) 3/ 20 ns Hold time (th) 3/ 0 ns Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and hand

15、books. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,

16、 Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Sta

17、ndard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text

18、of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the d

19、evice. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short circuit test e.g., IOS. 3/ The symbol indicates the falling edge of the clock pulse is used for reference.

20、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individ

21、ual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual

22、item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein

23、 for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be

24、 as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 4 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

25、electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical test

26、s for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the optio

27、n of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification

28、/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compli

29、ance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.

30、2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-P

31、RF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of cha

32、nge for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the ac

33、quiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing s

34、hall be in microcircuit group number 17 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5

35、 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, VIL= 0.7 V, VIH= 2.0 V, IOH= -0.4 mA1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5

36、 V, VIL= 0.7 V, VIH= 2.0 V, IOL= 4.0 mA 1, 2, 3 0.4 V Input clamp voltage VIK VCC= 4.5 V, IIN= -18 mA 1 -1.5 V Input current max input IIVCC= 5.5 V, J or K 1, 2, 3 0.1 mA voltage VIN= 7.0 V Clear 0.3 Clock 0.4 High level input current IIHVCC= 5.5 V, J or K 1, 2, 3 20 A IN= 2.7 V Clear 60 Clock 80 Lo

37、w level input current IILVCC= 5.5 V, J or K 1, 2, 3 -0.4 mA VIN= 0.4 V Clear -0.8 Clock -0.8 Supply current 1/ ICC VCC= 5.5 V 1, 2, 3 65 mA Short circuit output current 2/ IOS VCC= 5.5 V 1, 2, 3 -20 -100 mA Functional tests See 4.4.1b, VCC= 4.5 V, 5.5 V 7, 8 Maximum clock frequency 3/ fMAX VCC= 5.0

38、V, RL= 2 k, CL= 15 pF 9, 10, 11 30 MHz Propagation delay time clear to Q, clear to Q%3/ tPHL1, tPLH19 20 ns 10, 11 28 Propagation delay time clock to Q or Q%3/ tPHL2, tPLH29 20 ns 10, 11 28 1/ With all outputs open, ICCis measured with the Q and Q outputs high in turn. At the time of measurement, th

39、e clock is grounded. 2/ Not more than one output should be shorted at a time, and the duration of the short-circuit conditions should not exceed one second. 3/ Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or

40、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D Terminal number Terminal symbol 1 CLK1 2 CLR13 K14 VCC5 CLK26

41、 CLR2 7 J2 8 Q%2 9 Q2 10 K2 11 GND 12 Q1 13 Q%1 14 J1 FIGURE 1. Terminal connections. INPUTS OUTPUTS CLR CLK J K Q Q L X X X L H H L L QO Q%OH H L H L H L H L H H H H Toggle H H X X QOQ%OH = High logic level. L = Low logic level. X = Either low or high logic level = Negative going edge of pulse QO=

42、The output logic level before the indicated input conditions were established. Toggle = Each output changes to the complement of its previous level on each falling edge of the clock pulse. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

43、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC

44、IRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. RL= 2 k 2. CL= Load capacitance includes jig and probe capacitance. 3. All input pulses have the following characteristics: PRR 1 MHz, ZOUT= 50 , tr 2.0

45、ns, tf 2.0 ns. 4. The outputs are measured one at a time with one input transition per measurement. FIGURE 4. Timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96751 DEFENSE SUPPLY CENTER COLU

46、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan.

47、 The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-385

48、35, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level c