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本文(DLA SMD-5962-96769 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 10-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(周芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96769 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 10-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change Ground Bounce limits in Table I. Editorial changes throughout. - CFS 98-10-05 Monica L. Poelking B Add pulse duration (tW) value for subgroup 10 and 11 in the table I. Add information in footnote 3/ of figure 5. Add footnote 9/ for IOZPU an

2、d IOZPD test in the table I. Update the boilerplate paragraphs to current requirements as specified in the MIL-PRF-38535 - MAA 09-02-04 Charles F. Saffle REV SHET REV B B B B B SHEET 15 16 17 18 19 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A P

3、REPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING AP

4、PROVAL DATE 96-01-23 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 10-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96769 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E113-09 Provided by IHSNot for

5、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class l

6、evels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflecte

7、d in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96769 01 Q K A Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device

8、 classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non

9、-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT841 10-bit bus-interface D-type latch with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a si

10、ngle letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualific

11、ation to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack 3 CQCC1-N28 28 Square leadless chip carrier

12、 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE S

13、UPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range applied to any output in the high s

14、tate or power-off state (VOUT) -0.5 V dc to +7.0 V dc 4/ DC output current (IOL) (per output) . +96 mA DC input clamp current (IIK) (VIN 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C T

15、hermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C Maximum package power dissipation (PD) 500 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT)

16、 +0.0 V dc to VCCMaximum low level input voltage (VIL) . 0.8 V Minimum high level input voltage (VIH) 2.0 V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA Maximum input transition rise or fall rate (t/V). 5 ns/V Minimum power-up ramp rate (t/VCC) 200 s/V

17、 Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The

18、limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C unless otherwise noted. Unused inputs must be held high or low. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clam

19、p current ratings are observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCU

20、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEF

21、ENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of

22、Standard Microcircuit Drawings (SMDs). MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of

23、 precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item r

24、equirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described

25、 herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

26、MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tab

27、le. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit.

28、 The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHE

29、ET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating te

30、mperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN

31、 may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q a

32、nd V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for devic

33、e class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class

34、 M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the m

35、anufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 o

36、r for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is

37、 required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made ava

38、ilable onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 127 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without

39、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C T

40、C+125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit Negative input clamp voltage 3022 VIKFor input under test IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V 4.5 V 1, 2, 3 2.5 For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -3.0 mA 5.0 V 1, 2, 3 3.0 High

41、level output Voltage 3006 VOHFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= +48 mA 4.5 V 1, 2, 3 0.55 V Input current high 3010 IIHFor inpu

42、t under test, VIN= VCC0.0 V and 5.5 V 1, 2, 3 +1.0 A Input current low 3009 IILFor input under test, VIN= GND 0.0 V and 5.5 V 1, 2, 3 -1.0 A Three-state output current, power up IOZPU 9/ 0.0 V to 2.1 V 1, 2, 3 50.0 A Three-state output current, power down IOZPD 9/ VOUT= 0.5 V or 2.7 V OE = Dont care

43、 2.1 V to 0.0 V 1, 2, 3 50.0 Three-state output leakage current high 3021 IOZHVOUT= 2.7 V OE = 2.0 V 2.1 V and 5.5 V 1, 2, 3 10.0 A Three-state output leakage current low 3020 IOZLVOUT= 0.5 V OE = 2.0 V 2.1 V and 5.5 V 1, 2, 3 -10.0 A Off-state leakage current IOFFFor input or output under test, VIN

44、or VOUT= 4.5 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50.0 A Output current 3011 IO4/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -180 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking per

45、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96769 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbo

46、l Test conditions 2/ -55C TC+125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit For all inputs, VIN= VCC or VCC VOUT = 0.0 V, Outputs high 5.5 V 1, 2, 3 280 A For all inputs, VIN= VCC or VCC VOUT = 0.0 V, Outputs low 5.5 V 1, 2, 3 45 mA Quiescent supply Current 3005

47、ICCFor all inputs, VIN= VCC or VCC VOUT = 0.0 V, Outputs disabled 5.5 V 1, 2, 3 280 A For input under test, VIN= 3.4 V For all other inputVIN = VCC. or GND, Data inputs, outputs enabled 5.5 V 1, 2, 3 1.5 mA For input under test, VIN= 3.4 V For all other inputVIN = VCC. or GND, Data inputs, outputs d

48、isabled 5.5 V 1, 2, 3 280 A Quiescent supply Current delta TTL input level 3005 ICC 5/ For input under test, VIN= 3.4 V For all other inputVIN = VCC. or GND, Control inputs 5.5 V 1, 2, 3 1.5 mA Input capacitance 3012 CINTC= +25C, VIN= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 13.5 pF Output capacitance 3012 COUTTC= +25C, VOUT= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 17.0 pF VOLP6/ 5.0 V 4 750 mV Low level ground bounce noise VOLV6/ VIH= 3.0 V, VIL= 0.0 V TA= +25C, See figure 4 See 4.4.1d 5.0 V 4 -1500 mV VOHP6/ 5.0 V 4 1500 mV High level VCCbounce noise VOHV6/ VIH= 3.0 V, VIL

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