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本文(DLA SMD-5962-96774 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUS TRANSCEIVER WITH 25-ohms SERIES RESISTORS AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITH.pdf)为本站会员(孙刚)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96774 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUS TRANSCEIVER WITH 25-ohms SERIES RESISTORS AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITH.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change VOHPground bounce limit. Editorial changes throughout. jak 99-04-23 Monica L. Poelking B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-05-01 Thomas M. Hess REV SHET REV B B B SHEET 15 16 17 REV STATUS RE

2、V B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS

3、AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-02-07 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER WITH 25- SERIES RESISTORS AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SI

4、ZE A CAGE CODE 67268 5962-96774 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E257-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96774 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B

5、 SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Iden

6、tifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96774 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCa

7、se outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appe

8、ndix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT162245 16-bit bus transceiver with 25- series

9、resistors and three-state outputs, TTL compatible inputs. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 c

10、ompliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package styl

11、e X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

12、IZE A 5962-96774 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) (except I/O ports) -0.5 V dc to +7.0 V dc 4/ DC output voltag

13、e range applied to any output in the high state or power-off state (VOUT) -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output): B port . +96 mA A port . +30 mA DC input clamp current (IIK) (VIN 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA Maximum power dissipation (PD)

14、: 522 mW 5/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Inpu

15、t voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMinimum High level input voltage (VIH) +2.0 V Maximum Low level input voltage (VIL). +0.8V Maximum High level output current (IOH): B port . -24 mA A port . -3.0 mA Maximum Low level output current (IOL): B port . +48

16、 mA A port . +3.0 mA Maximum input transition rise or fall rate (t/V) (outputs enabled). 10 ns/V Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performanc

17、e and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provid

18、ed that the input and output clamp-current ratings are observed. 5/ Power dissipation values are derived using the formula Pd = VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table 1 herein, and “n“ represents the total number of outputs. Provided by IH

19、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96774 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards,

20、 and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated

21、Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-

22、780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between

23、the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements fo

24、r device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for de

25、vice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q an

26、d V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure

27、2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be a

28、s specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be as specified when available. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96774 DEFENSE SUPPLY CENTER COLU

29、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table

30、I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed

31、in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shal

32、l still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as require

33、d in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of

34、this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source o

35、f supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as requi

36、red for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 here

37、in) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required docume

38、ntation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A).Provided by IHSNot for Resale

39、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96774 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test meth

40、od 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Negative input clamp voltage 3022 VIC- For input under test IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V 1 3.8 IOH= -1.0 mA 5.0 V 2, 3 2.5 1 3.3 IOH= -1.0 mA 4.5 V 2, 3 3.0 1 3.

41、1 High level output voltage 3006 A portIOH= -3.0 mA 4.5 V 2, 3 3.0 V IOH= -3.0 mA 5.0 V 1, 2, 3 3.0 IOH= -3.0 mA 1, 2, 3 2.5 VOH For all inputs affecting output under test VIN = 2.0 V or 0.8 V B portIOH= -24.0 mA 4.5 V 2, 3 2.0 A portIOL= 12 mA 0.8 Low level output voltage 3007 VOL For all inputs af

42、fecting output under test VIN= 2.0 V or 0.8 V B portIOL= 48 mA 4.5 V 1, 2, 3 0.45 V Control inputs 1, 2, 3 +1.0 A Input current high 3010 IIH 4/ For output under test VIN= 5.5 V A or B ports 5.5 V 1, 2, 3 +20.0 Control inputs 1, 2, 3 -1.0 A Input current low 3009 IIL 4/ For output under test VIN= 0.

43、0 V A or B ports 5.5 V 1, 2, 3 -20.0 Three-state output leakage current high 3021 IOZH 5/ For control input affecting output under test VIN= 2.0 V or 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 +10.0 A Three-state output leakage current low 3020 IOZL 5/ For control input affecting output under test VIN= 2.0 V o

44、r 0.8 V VOUT= 0.5 V 5.5 V 1, 2, 3 -10.0 A Off-state leakage current IOFF For input or output under test VINor VOUT= 4.5 V All other pins at 0.0 V 0.0 V 1 100.0A High-state leakage current ICEX For output under test VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50.0 A A port -25.0 -90.0 Outpu

45、t current 3011 IO6/ VOUT= 2.5 V B port 5.5 V 1, 2, 3 -50.0 -180.0mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96774 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

46、0 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Outputs high 5.5 V 1, 2, 3

47、2.0 Outputs low 5.5 V 1, 2, 3 32.0 Quiescent supply current 3005 ICCA or B ports For all inputs VIN= VCCor GND IOUT= 0.0 A Outputs disabled 5.5 V 1, 2, 3 2.0 mA 1 1.0 Data inputs Outputs enabled 5.5 V 2, 3 2.0 1 0.05 Data inputs Outputs disabled 5.5 V 2, 3 1.0 Quiescent supply current delta, TTL inp

48、ut level 3005 ICC7/ For input under test VIN= 3.4 V For all other inputs VIN= VCCor GND Control inputs 5.5 V 1, 2, 3 1.5 mA Input capacitance 3012 CINTC= +25C, VIN= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 15.0 pF I/O capacitance 3012 CI/OTC= +25C, VOUT= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 15.0 pF VOLP8/ 5.0 V 4 1650 Low level ground bounce noise VOLV8/ 5.0 V 4 -1650 VOHP8/ 5.0 V 4 1600 High level VCCbounce noise VOHV8/ VIH= 3.0 V, VIL= 0.0 V TC= +25C See 4.4.1d See figure 4 5.0 V 4 -850 mV 4.5 V 7, 8 L H Functional test 3014 9/ VIH= 2.0 V, VIL= 0.8 V Verify output VO

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