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本文(DLA SMD-5962-96783 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUFFER DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(孙刚)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96783 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUFFER DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R362-97. 97-06-27 Monica L. Poelking B Changes in accordance with NOR 5962-R445-97. 97-09-12 Monica L. Poelking C Redrawn with changes: Incorporate previous NORs. Update the boilerplate paragraphs to the curren

2、t MIL-PRF-38535 requirements. - LTG 09-02-19 Charles F. Saffle REV SHET REV C C SHET 15 16 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3

3、990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-04-11 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, OCTAL BUFFER/DRIVER WITH NONINVERTING

4、 THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-96783 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E165-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING

5、 SIZE A 5962-96783 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A c

6、hoice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96783 01 Q R A Federal stock

7、class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with th

8、e appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device

9、 type Generic number Circuit function 01 54AHCT244 Octal buffer/driver with noninverting three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements docum

10、entation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 an

11、d as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL

12、-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96783 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Abs

13、olute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +7.0 V dc 4/ DC input clamp current (IIK) (VINVCC). -20 mA DC output clamp current (IOK) (VOUTVCC) -20 mA Continuous

14、output current (IOL) (VO= 0 to VCC) 25 mA Continuous current through VCCor GND 75 mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation

15、 at TA= +55C (in still air) (PD) . 600 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH). +2.0 V Maximum low level input voltage (VIL) +0.8 V Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +

16、0.0 V dc to VCCMaximum high level output current (IOH) -8 mA Maximum low level output current (IOL) +8 mA Maximum input rise or fall rate (t/V). +20 ns/V Case operating temperature range (TC). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following

17、 specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Gene

18、ral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit D

19、rawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. E

20、xtended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused in

21、puts must be held high or low. 4/ The input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96783 DE

22、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, su

23、persedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Qual

24、ity Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design,

25、construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 h

26、erein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bo

27、unce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be as specified when available. 3.3 Electr

28、ical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test re

29、quirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where

30、 marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PR

31、F-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in

32、 MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall b

33、e required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device

34、classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535,

35、appendix A shall be provided with each lot of microcircuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96783 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION L

36、EVEL C SHEET 5 DSCC FORM 2234 APR 97 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for devic

37、e class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for devi

38、ce class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96783 DEFENSE SUPPLY CENTER

39、COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit IOH=

40、 -50 A 1, 2, 3 4.4 1 3.94 High level output voltage 3006 VOHFor all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -8.0 mA 4.5 V 2, 3 3.8 V IOL= 50 A 1, 2, 3 0.1 1 0.36 Low level output voltage 3007 VOLFor all inputs affecting output under test VIN= 2

41、.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 8.0 mA 4.5 V 2, 3 0.44 V 1 +0.25Three-state output leakage current high 3021 IOZHmOE = 2.0 V For all other inputs VIN= VCCor GND VOUT= VCC5.5 V 2, 3 +2.5 A 1 -0.25 Three-state output leakage current low 3020 IOZLmOE = 2.0 V For all other inputs

42、VIN= VCCor GND VOUT= GND 5.5 V 2, 3 -2.5 A 1 +0.1 Input current high 3010 IIHFor input under test VIN= VCCFor all other inputs VIN= VCCor GND 5.5 V 2, 3 +1.0 A 1 -0.1 Input current low 3009 IILFor input under test VIN= GND For all other inputs VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 4.0 Quiescent supply

43、current 3005 ICCFor all inputs VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 40.0 A 1 1.35 Quiescent supply current delta, TTL input levels 3005 ICC4/ One input at 3.4 V Other inputs at VCCor GND 5.5 V 2, 3 1.5 mA Input capacitance 3012 CINTC= +25C, VIN= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Output capacitan

44、ce COUTTC= +25C, VOUT= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD5/ CL= 50 pF minimum f = 1 MHz See 4.4.1c 5.0 V 4 11.0 pF Low level ground bounce noise VOLP6/ 5.0 V 4 1750 Low level ground bounce noise VOLV6/ 5.0 V 4 -1450mV High level VCCbounce noise VOHP6/ 5.0 V 4 750

45、High level VCCbounce noise VOHV6/ CL= 50 pF minimum TA= +25C See 4.4.1d See figure 4 5.0 V 4 -1200mV See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96783 DEFENSE SUPPLY CENTER

46、COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min M

47、ax Unit 4.5 V Functional test 3014 7/ VIH= 2.0 V, VIL= 0.8 V Verify output VOSee 4.4.1b 5.5 V 7, 8 L H 9 1.07.4CL= 15 pF minimum RL= open See figure 5 9/ 4.5 V and 5.5 V 10, 11 1.08.5ns 9 1.08.4tPLH8/ CL= 50 pF minimum RL= open See figure 5 4.5 V and 5.5 V 10, 11 1.09.5ns 9 1.07.4CL= 15 pF minimum R

48、L= open See figure 5 9/ 4.5 V and 5.5 V 10, 11 1.08.5ns 9 1.08.4Propagation delay time, mAn to mYn 3003 tPHL8/ CL= 50 pF minimum RL= open See figure 5 4.5 V and 5.5 V 10, 11 1.09.5ns 9 1.010.4CL= 15 pF minimum RL= 1 k See figure 5 9/ 4.5 V and 5.5 V 10, 11 1.012.0ns 9 1.011.4tPZH8/ CL= 50 pF minimum RL= 1 k See figure 5 4.5 V and 5.5 V 10, 11 1.013.0ns 9 1.010.4CL= 15 pF minimum RL= 1 k See figure 5 9/ 4.5 V and 5.5 V 10, 11 1.012.0ns 9 1.011.4Propagation delay time, output enable, mOE to mYn 3003 tPZL8/ CL= 50 pF minimum RL= 1 k Se

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