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本文(DLA SMD-5962-96802 REV C-2011 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS HEX SCHMITT-TRIGGER INVERTER MONOLITHIC SILICON.pdf)为本站会员(王申宇)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96802 REV C-2011 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS HEX SCHMITT-TRIGGER INVERTER MONOLITHIC SILICON.pdf

1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R260-97. - JAK 97-04-01 Monica L. Poelking B Change low level ground bounce noise limits in table I. Correct logic diagram in figure 3. Update the boilerplate in accordance with MIL-PRF-38535 requirements. Edito

2、rial changes throughout. - TVN 05-01-14 Thomas M. Hess C Update the boilerplate in accordance with MIL-PRF-38535 requirements. Editorial changes throughout. - jak 11-07-21 Thomas M. Hess REV SHET REV C C SHET 15 16 REV STATUS OF SHEETS REV C C C C C C C C C C C C C C SHEET 1 2 3 4 5 6 7 8 9 10 11 12

3、 13 14 PMIC N/A PREPARED BY Rick Officer DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 https:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Rajesh Pithadia APPROVED BY Ra

4、ymond Monnin MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, HEX SCHMITT-TRIGGER INVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-06-27 REVISION LEVEL C SIZE A CAGE CODE 67268 5962-96802 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E270-11 Provided by IHSNot for ResaleNo reproduction or networking

5、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device

6、classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in

7、 the following example: 5962 - 96802 01 Q C A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet

8、 the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The d

9、evice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AHC14 Hex Schmitt-trigger inverter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requiremen

10、ts documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD

11、-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-lineD GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V

12、 or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absol

13、ute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ DC input clamp current (IIK) (VIN 0 V) -20 mA DC output clamp current (IOK) (VOUT 0 V or VOUT VCC) 20

14、mA Continuous output current (IOUT) (VOUT= 0 to VCC) . 25 mA Continuous current through VCCor GND . 50 mA Maximum power dissipation at TA= +55C (in still air) (PD) . 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to

15、-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +2.0 V dc to +5.5 V dc Input voltage range (VIN) 0.0 V to +5.5 V dc Output voltage range (VOUT) . 0.0 V to VCCMaximum high level output current (IOH): VCC= 2.0 V .

16、-50.0 A VCC= 3.3 V 0.3 V . -4.0 mA VCC= 5.0 V 0.5 V . -8.0 mA Maximum low level output current (IOL): VCC= 2.0 V . +50.0 A VCC= 3.3 V 0.3 V . +4.0 mA VCC= 5.0 V 0.5 V . +8.0 mA Maximum input transition rise or fall rate (t/v): VCC= 3.3 V 0.3 V . 100 ns/V VCC= 5.0 V 0.5 V . 20 ns/V Case operating tem

17、perature range (TC) . -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the pa

18、rameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. 5/ Unused inputs must be held high or low to ensure proper devi

19、ce operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specif

20、ication, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-

21、38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit

22、Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of

23、 a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual

24、item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item

25、 requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for

26、 device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as

27、specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and tes

28、t circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full

29、case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

30、IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where ma

31、rking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-3

32、8535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MI

33、L-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be r

34、equired from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meet

35、s, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in M

36、IL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is requir

37、ed for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore doc

38、umentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or ne

39、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2

40、/ -55C TC +125C +2.0 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs, VIN= VCCor GND IOH= -50 A 2.0 V 1, 2, 3 1.9 V 3.0 V 2.9 4.5 V 4.4 IOH= -4 mA 3.0 V 1 2.58 2, 3 2.48 IOH= -8 mA 4.5 V 1 3.94 2, 3 3.8 Low level ou

41、tput voltage 3007 VOLFor all inputs, VIN= VCCor GND IOL= 50 A 2.0 V 1, 2, 3 0.1 V 3.0 V 0.1 4.5 V 0.1 IOL= 4 mA 3.0 V 1 0.36 2, 3 0.5 IOL= 8 mA 4.5 V 1 0.36 2, 3 0.5 Positive-going input threshold voltage VT+ 3.0 V 1, 2, 3 2.2 V 4.5 V 3.15 5.5 V 3.85 Negative-going input threshold voltage VT- 3.0 V

42、1, 2, 3 0.9 V 4.5 V 1.35 5.5 V 1.65 Hysteresis (VT+- VT-) VT 3.0 V 1, 2, 3 0.3 1.2 V 4.5 V 0.4 1.4 5.5 V 0.5 1.6 Input current high 3010 IIHFor input under test, VIN= VCC For all other inputs, VIN= VCCor GND 5.5 V 1 +0.1 A 2, 3 +1.0 Input current low 3009 IILFor input under test, VIN= GND For all ot

43、her inputs, VIN= VCCor GND 5.5 V 1 -0.1 A 2, 3 -1.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 1 2.0 A 2, 3 20.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

44、IT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-96802 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +5.5 V unless otherwise spec

45、ified VCCGroup A subgroups Limits 3/ Unit Min Max Input capacitance 3012 CINTC= +25C VIN= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD4/ CL= 50 pF f = 1 MHz See 4.4.1c 5.0 V 4 10.0 pF Low level ground bounce noise VOLP5/ VIH= VCC, VIL= 0.0 V TA= +25C See 4.4.1d See figure 4

46、 5.0 V 4 1.9 V VOLV5/ 5.0 V 4 -1.6 High level VCCbounce noise VOHP5/ 5.0 V 4 0.5 V VOHV5/ 5.0 V 4 -0.8 Functional test 3014 6/ VIN= VIHor VILVerify output VOUTSee 4.4.1b 2.0 V 7, 8 L H 3.0 V 5.5 V Propagation delay time, mA to mY 3003 tPLH, tPHL7/ CL= 15 pF minimum See figure 5 8/ 3.0 V and 3.6 V 9

47、12.8 ns 10, 11 1.0 15.0 4.5 V and 5.5 V 9 8.6 10, 11 1.0 10.0 CL= 50 pF minimum See figure 5 3.0 V and 3.6 V 9 16.3 10, 11 1.0 18.5 4.5 V and 5.5 V 9 10.6 10, 11 1.0 12.0 1/ For tests not listed in the referenced MIL-STD-883, utilize the general test procedure of 883 under the conditions listed here

48、in. 2/ Each input/output, as applicable, shall be tested at the specified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open, except for all ICCtest where the output terminal shall be open. When performing the ICCtest, the current meter shall be placed in the circuit such that all current flows through the meter. 3/ For negative and positive voltage and current values, the sign designates the potential difference in

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