DLA SMD-5962-96880 REV A-2003 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《互补金属氧化物半导体 倒相三状态输出.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. LTG 03-02-11 Thomas M. Hess REV SHET REV A A A SHET 15 16 17 REV STATUS REV A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A.

2、Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle, Jr. COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-03-0

3、7 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 16-BIT BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-96880 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E148-03 DISTRIBUTION STATEMENT A. Approved for public releas

4、e; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. Thi

5、s drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radi

6、ation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96880 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see

7、 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the a

8、ppropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACTQ16240 16-bit buffer/driver with inverting three-state outputs, TTL compatible inputs 1.2.3 Device

9、class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PR

10、F-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as spe

11、cified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-50

12、00 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT). -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK): VIN= -0.5 V -20

13、mA VIN= VCC+ 0.5 V +20 mA DC output clamp current (IOK): VIN= -0.5 V -20 mA VIN= VCC+ 0.5 V +20 mA DC output current (IOUT) per output pin 50 mA DC VCCor GND current (ICC, IGND) per pin . 400mA Storage temperature range (TSTG). -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal res

14、istance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD). 750 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCM

15、inimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +24 mA Maximum input rise or fall rate (V/t) . 125 mV/ns Case operating temperature range (TC) -55C to +125C 2. APPLICABLE D

16、OCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Inde

17、x of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Ext

18、ended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inpu

19、ts must be held high or low. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 STANDARDS DEPARTMENT

20、OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies

21、 of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless ot

22、herwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation. ELECTRONIC INDUSTRIES AL

23、LIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Applications for copies should be addressed to the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) (Non-Government standards and other p

24、ublications are normally available from the organizations that prepare or distribute the documents. These documents may also be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references

25、cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accorda

26、nce with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL

27、-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein

28、for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. Provided by IHSNot for ResaleNo repro

29、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground

30、bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation pa

31、rameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be t

32、he subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PI

33、N number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device c

34、lass M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3

35、.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacture

36、r in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirem

37、ents of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided

38、with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.

39、9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Mic

40、rocircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A) .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

41、 A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCG

42、roup A subgroups Min Max Unit 4.5 V 1, 2, 3 4.40 IOH= -50 A 5.5 V 1, 2, 3 5.40 1 3.86 4.5 V 2, 3 3.70 1 4.86 IOH= -24 mA 5.5 V 2, 3 4.70 High level output voltage 3006 VOHFor all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -50 mA 4/ 5.5 V 1, 2, 3 3

43、.85 V 4.5 V 1, 2, 3 0.10 IOL= 50 A 5.5 V 1, 2, 3 0.10 1 0.36 4.5 V 2, 3 0.50 1 0.36 IOL= 24 mA 5.5 V 2, 3 0.50 Low level output voltage 3007 VOLFor all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 50 mA 4/ 5.5 V 1, 2, 3 1.65 V Positive input clamp v

44、oltage 3022 VIC+For input under test IIN= 18 mA 5.5 V 1, 2, 3 5.7 V Negative input clamp voltage 3022 VIC-For input under test IIN= -18 mA 5.5 V 1, 2, 3 -1.2 V 1 0.1 Input current high 3010 IIHFor input under test, VIN= 5.5 V For all other inputs, VIN= VCCor GND 5.5 V 2, 3 1.0 A 1 -0.1 Input current

45、 low 3009 IILFor input under test, VIN= 0.0 V For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 0.5 Three-state output leakage current high 3021 IOZH5/ OEn = 2.0 V For all other inputs, VIN= VCCor GND VOUT= 5.5 V 5.5 V 2, 3 10.0 1 -0.5 Three-state output leakage current low 3020 IOZL5/ OEn =

46、2.0 V For all other inputs, VIN= VCCor GND VOUT= 0.0 V 5.5 V 2, 3 -10.0 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96880 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432

47、16-5000 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit 1 8.0 Quiescent suppl

48、y current, output high 3005 ICCH5.5 V 2, 3 160 A 1 8.0 Quiescent supply current, output low 3005 ICCLOEn = GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 160 A 1 8.0 Quiescent supply current, output three-state 3005 ICCZ5/ OEn = VCCFor all other inputs, VIN= VCCor GND 5.5 V 2, 3 160 A 1 1.0 Qui

49、escent supply current delta, TTL input level 3005 ICC6/ For input under test VIN= VCC- 2.1 V For all other inputs, VIN= VCCor GND 5.5 V 2, 3 1.6 mA Input capacitance 3012 CINGND 4 10 pF Output capacitance 3012 COUT5/ 5.5 V 4 15 pF Power dissipation capacitance CPD7/ TC= +25C See 4.4.1c 5.0 V 4 100 pF VOLP8/ 5.0 V 4 1200