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本文(DLA SMD-5962-96898 REV A-2004 MICROCIRCUIT HYBRID LINEAR 28-VOLT SINGLE CHANNEL DC-DC CONVERTER《28伏特单通道直流电到直流电转换器硅单片电路混合线型微电路》.pdf)为本站会员(sofeeling205)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-96898 REV A-2004 MICROCIRCUIT HYBRID LINEAR 28-VOLT SINGLE CHANNEL DC-DC CONVERTER《28伏特单通道直流电到直流电转换器硅单片电路混合线型微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Correct paragraphs 4.2.a.2 and 4.3.3.b.2 from TCto TA. Table I, output current test, correct the test unit from mA to A. Figure 1, case outline X, change to standard dimensioning format of symbols and table. Case outline X dimension D maximum has

2、 changed from 1.455“ to 1.460“ and E maximum has changes from 1.125“ to 1.130“. Editorial changes throughout. 04-08-19 Raymond Monnin REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS S

3、TANDARD MICROCIRCUIT DRAWING CHECKED BY Michael Jones POST OFFICE BOX 3990 COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, LINEAR, 28-VOLT, SINGLE CHANNEL, DC-DC CONVERTER AND AGENCIES OF THE

4、 DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-10-25 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-96898 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E316-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

5、62-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available

6、and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 96898 01 H X X Federal RHA Device Device Case Lead stock class designator type clas

7、s outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropri

8、ate RHA designator. A dash (-) indicates a non-RHA device. Only the RHA levels specified herein are available. See 4.3.5. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MHF+2828S/883, MHF+2828SF/883 DC-DC converter, 1

9、5 W, 28 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class

10、G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space hi

11、gh reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test)

12、periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition do

13、cument should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for

14、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1

15、835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Dual-in-line Z See figure 1 8 Flange mount 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power di

16、ssipation (PD). 6 W Output power. 15.30 W Lead soldering temperature (10 seconds). +300C Storage temperature range . -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to +40 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government

17、 specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION M

18、IL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dra

19、wings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preceden

20、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requiremen

21、ts. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated fo

22、r the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, f

23、it, or function of the device for the applicable device class. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking

24、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be

25、 as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified

26、herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup

27、are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requi

28、rements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manua

29、lly tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a

30、 manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in

31、 MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modificati

32、on in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall

33、be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specifie

34、d in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the man

35、ufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charact

36、eristics. Test Symbol Conditions 1/ -55C TC +125C VIN= 28 V dc 5% Group A subgroups Device type Limits Unit no external sync, CL= 0 unless otherwise specified Min Max 1 27.72 28.28 Output voltage VOUTIOUT= .536 A dc 2,3 01 27.44 28.56 V dc Output current IOUTVIN= 16, 28, and 40 V dc 1,2,3 01 0.0 .53

37、6 A 1 120 Output ripple voltage VRIPIOUT= .536 A, 1/ B.W. = 10 kHz to 2 MHz 2,3 01 180 mVp-p Line regulation VRLINEVIN=16 V dc to 40 V dc, IOUT= .536 A 1,2,3 01 150 mV Load regulation VRLOADIOUT= 0 to .536 A 1,2,3 01 150 mV IOUT= 0 A, Inhibit (pin 1) = 0 12 Input current IINIOUT= 0 A, Inhibit (pin 1

38、) = open 1,2,3 01 60 mA 1 80 Input ripple current IRIPIOUT= .536 A, B.W. = 10 kHz to 10 MHz 2,3 01 120 mAp-p 1 82 Efficiency Eff IOUT= .536 A 2,3 01 78 % Isolation ISO Input to output or any pin to case (except pin 6) at 500 V dc 1 01 100 M Capacitive load 2/ 3/ CLNo effect on dc performance 4 01 10

39、0 F Power dissipation, load fault PDShort circuit 1,2,3 01 6 W 4 500 600 Switching frequency FSIOUT= .536 A 5,6 01 480 620 kHz External sync range 4/ IOUT= .536 A, TTL level to pin 5 4,5,6 01 500 600 kHz Output response to step transient load changes 5/ VOTLOAD50% load to/from 100% load 4,5,6 01 -80

40、0 +800 mV pk See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE

41、I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C VIN= 28 V dc 5% Group A subgroups Device type Limits no external sync, CL= 0 unless otherwise specified Min Max Unit Recovery time, step transient load changes 5/ 6/ TTLOAD50% load to/from 100% load 4,5,6

42、01 400 s Input step 16 to 40 V dc, IOUT= .536 A -1.2 +1.2 Output response to transient step line changes 3/ 7/ VOTLINEInput step 40 to 16 V dc, IOUT= .536 A 4,5,6 01 -1.2 +1.2 V pk Input step 16 to 40 V dc, IOUT= .536 A 1.2 Recovery time, transient step line changes 3/ 6/ TTLINEInput step 40 to 16 V

43、 dc, IOUT= .536 A 4,5,6 01 1.2 ms Turn-on overshoot 3/ VtonOSIOUT = .536 A 4,5,6 01 280 mV pk Turn-on delay 8/ TonDIOUT = .536 A 4,5,6 01 25 ms Load fault recovery 3/ 6/ TrLFIOUT = .536 A 4,5,6 01 30 ms 1/ Bandwidth guaranteed by design. Tested for 10 kHz to 2 MHz. 2/ Capacitive load may be any valu

44、e from 0 to the maximum limit without compromising dc performance. 3/ Parameter shall be tested as part of device characterization and after design and process changes. Therefore this parameter shall be guaranteed to the limits specified in table I. 4/ A TTL level waveform (VIH= 4.5 V minimum, VIL=

45、.8 V maximum) with a 50 percent 10 percent duty cycle applied to the sync input pin (pin 5) within the sync range frequency shall cause the converters switching frequency to become synchronous with the frequency applied to the sync input pin (pin 5). 5/ Load step transition time 10 microseconds maxi

46、mum. 6/ Recovery time is measured from the initiation of the transient to where VOUThas returned to within 1 percent of VOUT final value. 7/ Input step transition time greater than 10 microseconds. 8/ Turn-on delay time measurement is either for a step application of power at the input or the remova

47、l of a ground signal from the inhibit pin (pin 1) while power is applied to the input. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96898 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3390 REVISION L

48、EVEL A SHEET 7 DSCC FORM 2234 APR 97 Case outline X. Symbol Millimeters Inches Min Max Min Max A 8.38 .330 b 0.64 0.89 .025 .035 D 36.70 37.08 1.445 1.460 e 5.08 5.33 .200 .210 e1 12.08 12.95 .500 .510 e2 17.78 18.03 .700 .710 e3 22.86 23.11 .900 .910 e4 27.94 28.19 1.100 1.110 E 28.32 28.70 1.115 1.130 E1 20.19 20.44 .795 .805 L 6.09 6.60 .240 .260 NOTES: 1. The case outline X was originally designed using the inch-pound units of measurement, in the event of conflict between the metric and

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