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本文(DLA SMD-5962-97526 REV C-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS 3-LINE TO 8-LINE DECODER DEMULTIPLEXER MONOLITHIC SILICON.pdf)为本站会员(proposalcash356)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-97526 REV C-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS 3-LINE TO 8-LINE DECODER DEMULTIPLEXER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Corrected input voltage level on page 10 Figure 4 note 3. Updated boilerplate. - LTG 00-08-08 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. LTG 01-04-05 Thomas M. Hess C Update boilerplate paragraphs to the current MIL-PR

2、F-38535 requirements. - LTG 09-07-15 Thomas M. Hess REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT

3、 DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Charles F. Saffle, Jr. APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS, 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER, MONOLITHIC SILICON DRAWING APPROVAL DATE 97-03-27

4、AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-97526 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E361-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

5、 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are r

6、eflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97526 01 Q E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2

7、.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices m

8、eet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LVC138A 3-line to 8-li

9、ne decoder/demultiplexer 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B m

10、icrocircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dua

11、l-in-line F GDFP1-F16 or CDFP2-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permi

12、tted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.5 V dc DC input voltage range (V

13、IN) -0.5 V dc to +6.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ 5/ DC input clamp current (IIK) (VINVCC) 50 mA Continuous output current (IO) (VOUT= 0 to VCC) 50 mA Continuous current through VCCor GND . 100 mA Maximum power dissipation at TA= +55C (in still air) (PD) .

14、550 mW 6/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 7/ Supply voltage range (VCC): Operating . +2.0 V dc to +

15、3.6 V dc Data retention only . +1.5 V dc Minimum high level input voltage (VIH): VCC= 2.7 V to 3.6 V . +2.0 V Maximum low level input voltage (VIL): VCC= 2.7 V to 3.6 V +0.8 V Input voltage range (VIN) +0.0 V dc to 5.5 V dc Output voltage range (VOUT) . +0.0 V dc to VCCMaximum high level output curr

16、ent (IOH): VCC= 2.7 V -12 mA VCC= 3.0 V -24 mA Maximum low level output current (IOL): VCC= 2.7 V +12 mA VCC= 3.0 V +24 mA Input transition rise or fall rate (t/V): . 0.0 ns/V to 10.0 ns/V Case operating temperature range (TC) . -55C to +125C 1/ Stresses above the absolute maximum rating may cause p

17、ermanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature r

18、ange of -55C to +125C. 4/ The input and output negative-voltage ratings may be exceeded provided that the input and output clamp-current ratings are observed. 5/ The value of VCCis provided in the recommended operating conditions table. 6/ The maximum package power dissipation is calculated using a

19、junction temperature of 150C and a board trace length of 750 mils. 7/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY

20、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise

21、 specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835

22、 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standa

23、rdization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or

24、 contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 52 - Standard for Description of Low voltage TTL-compatible CMOS Logic Device (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3

25、834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUI

26、REMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or fun

27、ction as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall b

28、e as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3

29、.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo repro

30、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless

31、 otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified

32、 in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitation

33、s, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535

34、, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes

35、 Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of

36、 supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device c

37、lass M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this

38、 drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class

39、 M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M

40、devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43

41、218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006

42、 VOHFor all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -100 A 2.7 V and 3.6 V 1, 2, 3 VCC-0.2 V IOH= -12 mA 2.7 V 1, 2, 3 2.2 3.0 V 2.4 IOH= -24 mA 3.0 V 1, 2, 3 2.2 Low level output voltage 3007 VOLFor all inputs affecting output under test VIN= VIHor

43、VILFor all other inputs VIN= VCCor GND IOL= 100 A 2.7 V and 3.6 V 1, 2, 3 0.2 V IOL= 12 mA 2.7 V 1, 2, 3 0.4 IOL= 24 mA 3.0 V 1, 2, 3 0.55 Input current high 3010 IIHFor input under test VIN= 5.5 V 3.6 V 1, 2, 3 +5.0 A Input current low 3009 IILFor input under test VIN= GND 3.6 V 1, 2, 3 -5.0 A Quie

44、scent supply current 3005 ICCFor all inputs VIN= VCCor GND IOUT= 0 A 3.6 V 1, 2, 3 10.0 A Quiescent supply current delta TTL input levels 3005 ICCOne input at VCC-0.6 V Other inputs at VCCor GND 2.7 V and 3.6 V 1, 2, 3 500 A Input capacitance 3012 CINTC= +25C VIN= VCCor GND See 4.4.1c 3.3 V 4 9.0 pF

45、 Power dissipation capacitance CPD4/ See 4.4.1c TC= +25C f = 1 MHz 3.3 V 4 90 pF Functional test 3014 5/ VIN= VIHor VILVerify output VOSee 4.4.1b 2.0 V, 2.7 V and 3.6 V 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

46、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0

47、 V VCC +3.6 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Propagation delay time, An or Bn or Cn to Yn 3003 tPHL1, tPLH16/ CL= 50 pF minimum See figure 5 2.7 V 9,10,11 7.9 ns 3.0 V and 3.6 V 1.0 6.7 Propagation delay time, G2A or G2B to Yn 3003 tPHL2, tPLH26/ 2.7 V 9,10,11

48、 7.4 3.0 V and 3.6 V 1.0 6.5 Propagation delay time, G1 to Yn 3003 tPHL3, tPLH36/ 2.7 V 9,10,11 6.4 3.0 V and 3.6 V 1.0 5.8 1/ For tests not listed in the referenced MIL-STD-883, utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicable, shall be tested at the specified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open, except for the ICCtest, where the output terminals shall be open. When performing the ICCtest

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