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本文(DLA SMD-5962-97605 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS HEX INVERTER MONOLITHIC SILICON.pdf)为本站会员(priceawful190)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-97605 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS HEX INVERTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make corrections to figure 5. Update boilerplate. - jak 00-08-16 Monica L. Poelking B Update the boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. - jak 09-05-07 Thomas M. Hess REV SHEET REV B B SHEET 15 16 REV STATUS

2、REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Tin H. Le STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle, Jr. DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEP

3、ARTMENTS APPROVED BY Monica Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS,HEX INVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-09-12 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-97605 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E301-09 Provided

4、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product as

5、surance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) lev

6、els are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97605 01 Q C A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 R

7、HA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A das

8、h (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LVC04A Hex inverter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance le

9、vel as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). Th

10、e case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specif

11、ied in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

12、REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.5 V dc DC input voltage range (VIN) -0.5 V dc to +6.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc 4/ 5/ DC input clamp current (IIK) (VINVCC) 50 mA

13、Continuous output current (IOUT) (VOUT= 0.0 to VCC) 50 mA 5/ Continuous current through VCCor GND 100 mA Maximum power dissipation at TA= +55C (in still air) 500 mW 6/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-cas

14、e (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 7/ Supply voltage range (VCC): Operating . +2.0 V dc to +3.6 V dc Data retention only (minimum) . +1.5 V dc Minimum high level input voltage (VIH) (VCC= 2.7 V to 3.6 V) +2.0 V dc Maximum low level i

15、nput voltage (VIL) (VCC= 2.7 V to 3.6 V). +0.8 V dc Input voltage range (VIN) 0.0 V to +5.5 V dc Output voltage range (VOUT). 0.0 V to VCCMaximum high level output current (IOH): VCC= 2.7V -12 mA VCC= 3.0 V. -24 mA Maximum low level output current (IOL): VCC= 2.7V +12 mA VCC= 3.0 V. +24 mA Case oper

16、ating temperature range (TC). -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits

17、for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ The value of VCCis provided in the

18、recommended operating conditions table. 6/ The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 750 mils. 7/ Unused inputs must be held high or low to prevent them from floating.Provided by IHSNot for ResaleNo reproduction or networking

19、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification

20、, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specificat

21、ion for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copi

22、es of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references

23、 cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accord

24、ance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MI

25、L-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein

26、 for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram s

27、hall be as specified on figure 3. 3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot

28、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation para

29、meter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the

30、 subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due

31、 to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordanc

32、e with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance

33、. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as a

34、n approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and he

35、rein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircui

36、ts delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class

37、 M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device clas

38、s M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMB

39、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V Device type VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Ma

40、x High level output voltage 3006 VOHFor all inputs affecting output under test, IOH= -100 AAll 2.7 V and 3.6 V 1,2,3 VCC-0.2 V VIN= VIHor VILFor all other inputs, IOH= -12 mA All 2.7 V 1,2,3 2.2 VIN= VCCor GND 3.0 V 2.4 IOH= -24 mA All 3.0 V 1,2,3 2.2 Low level output voltage 3007 VOLFor all inputs

41、affecting output under test, IOL= 100 A All 2.7 V and 3.6 V 1,2,3 0.2 V VIN= VIHor VILFor All other Inputs, IOL= 12 mA All 2.7 V 1,2,3 0.4 VIN= VCCor GND IOL= 24 mA All 3.0 V 1,2,3 0.55 Input current high 3010 IIHFor input under test, VIN= 5.5 V All 3.6 V 1,2,3 +5.0 A Input current low 3009 IIL For

42、input under test, VIN= GND All 3.6 V 1,2,3 -5.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A All 3.6 V 1,2,3 10.0 A Quiescent supply current delta TTL input levels 3005 ICCFor input under test, VIN= VCC - 0.6 V, other inputs at VCCor GND All 2.7 V and 3.6 V 1,2,3 500 A

43、 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electric

44、al performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V Devicetype VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Input capacitance 3012 CINTC= +25C VIN= VCCor GND See 4.4.1c All 3.3 V 4 10.0pF

45、Power dissipation capacitance CPD4/ CL= 50 pF minimum f = 10 MHz See 4.4.1c All 3.3 V 4 10.0pF Low level ground bounce noise VOLP 5/ All 3.0 V 4 1500 mV Low level ground bounce noise VOLV5/ All 3.0 V 4 -1500High level VCCbounce noise VOHP5/ All 3.0 V 4 750 High level VCCbounce noise VOHV5/ VIN= 2.7

46、V, VIL= 0.0 V TA= +25 C See figure 4 See 4.4.1d All 3.0 V 4 -750 Functional test 3014 6/ VIN= VIHor VILVerify output VOSee 4.4.1b All 2.0 V and 3.6 V 7,8 L H CL= 50 pF minimum See Figure 5 All 2.7 V 9,10,11 5.5 ns Propagation delay time, mA to mY 3003 tPLHtPHL7/ 3.0 V and 3.6 V 1.0 4.5 See footnotes

47、 on next sheet. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97605 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance c

48、haracteristics - Continued 1/ For tests not listed in the referenced MIL-STD-883 (e.g. ICC), utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicable, shall be tested at the specified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open, except for all ICCand ICCtests, where the output terminals shall be open. When performing these tests, the current meter shall be placed in the circuit such that all

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