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本文(DLA SMD-5962-97624 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH BUS HOLD AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(brainfellow396)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-97624 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH BUS HOLD AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change ground bounce limit. Update boilerplate to MIL-PRF-38535 requirements. jak 01-09-20 Thomas M. Hess B Update test condition for high level output voltage (VOH) and low level output voltage (VOL) in table I. Update boilerplate paragraphs to

2、current MIL-PRF-38535 requirements. - MAA 09-06-26 Thomas M. Hess REV SHEET REV B B B SHEET 15 16 17 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dsc

3、c.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle, Jr. THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH BUS HOLD AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, AND AGENCIES

4、OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 00-03-09 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-97624 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E358-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

5、CIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (devic

6、e class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97624 01 Q X A

7、 Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and a

8、re marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function a

9、s follows: Device type Generic number Circuit function 01 54ABTH16244 16-bit buffer/driver with bus hold and three-state outputs, TTL compatible inputs. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Devi

10、ce requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designat

11、ed in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo re

12、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0

13、V dc DC input voltage range (VIN) (except I/O ports) . -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) (high or power-off state) -0.5 V dc to +5.5 V dc DC input clamp current (IIK) (VIN 0.0 V) . -18 mA DC output clamp current (IOK) (VOUT 0.0 V) . -50 mA DC output current (IOL) (per output)

14、. +96 mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD): 599 mW 5/ 1.4 Recommended operating conditions. 2/ 3/ 6/ Supply voltag

15、e range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMinimum High level input voltage (VIH) +2.0 V Maximum Low level input voltage (VIL) +0.8V Case operating temperature range (TC) -55C to +125C Maximum input transition rise or

16、fall rate (t/V) (outputs enabled) 10 ns/V Maximum High level output current (IOH) -24 mA Maximum Low level output current (IOL) . +48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect

17、 reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output voltage ratings may be exceeded provided that the input and

18、 output clamp-current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCC ICC+ n VOL IOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table 1 herein, and “n“ represents the total number of outputs. 6/ Unused inputs must be held hig

19、h or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICA

20、BLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMEN

21、T OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuit. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103

22、 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Orde

23、r of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 It

24、em requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as descr

25、ibed herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

26、 in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tab

27、le. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit.

28、 The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHE

29、ET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating te

30、mperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN

31、 may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q a

32、nd V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for devic

33、e class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class

34、 M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the m

35、anufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 o

36、r for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is

37、 required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made ava

38、ilable onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without

39、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4

40、.5 V VCC +5.5 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max High level output voltage 3006 VOH For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -3.0 mA 4.5 V 1, 2, 3 2.5 V 5.0 V 1, 2, 3 3.0 IOH= -24 mA 4.5 V 1, 2, 3 2.0 Low level output Voltage 300

41、7 VOL For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= +48 mA 4.5 V 1, 2, 3 0.55 V Negative input clamp voltage 3022 VIC- For input under test, IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V Input current high 3010 IIH 4/ For output under test, VIN= 5.5 V 5.5 V 1, 2, 3 +1 A Input current

42、low 3009 IIL 4/ For output under test, VIN= 0.0 V 5.5 V 1, 2, 3 -1 A Input hold current II(hold) VIL= 0.8 V 4.5 V 1, 2, 3 +100 A VIH= 2.0 V 1, 2, 3 -40 Three-state Power-up current IOZH 5/ mOEnullnullnullnull= 2.0 V or 0.0 V VOUT= 2.7 V 5.5 V 1, 2, 3 +10 A Three-state Power-down current IOZL 5/ mOEn

43、ullnullnullnull= 2.0 V or 0.0 V VOUT= 0.5 V 5.5 V 1, 2, 3 -10 A Off-state leakage current IOFF For input or output under test VINor VOUT 4.5 V All other pins at 0.0 V 0.0 V 1 100 A High-state leakage current ICEX For output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Outpu

44、t current 3011 IOUT6/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -180 mA Quiescent supply current delta, TTL input level 3005 ICC7/ For input under test VIN= 3.4 V For all other inputs VIN= VCCor GND 5.5 V 1, 2, 3 1.5 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking pe

45、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97624 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test cond

46、itions 2/ -55C TC +125C +4.5 V VCC +5.5 V Device Type VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Quiescent supply current , outputs high 3005 ICCHA or B ports For all inputs, VIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 3.0 mA Quiescent supply current , outputs low 3005 I

47、CCLAll 5.5 V 1, 2, 3 32.0 Quiescent supply current , outputs disabled 3005 ICCZAll 5.5 V 1, 2, 3 3.0 Input capacitance 3012 CINTC= +25C See 4.4.1c All 5.0 V 4 10.0 pF Input output capacitance 3012 CI/OTC= +25C See 4.4.1c All 5.0 V 4 9.0 pF Low level ground bounce noise VOLP8/ VIH= 3.0 V, VIL= 0.0 V

48、TC= +25C See 4.4.1d See figure 4 All 5.0 V 4 975 mV VOLV8/ All 5.0 V 4 -1520 High level VCCbounce noise VOHP8/ All 5.0 V 4 1750 VOHV8/ All 5.0 V 4 -525 Functional test 3014 9/ VIH= 2.0 V, VIL= 0.8 V Verify output VOUTSee 4.4.1b All 4.5 V 7, 8 L H All 5.5 V 7, 8 L H Propagation delay time, mAn to mYn 3003 tPLH10/ CL= 50 pF minimum RL = 500 See figure 5 All 5.0 V 9 1.0 3.2 ns 4.5 V and 5.5 V 10, 11 0.7 3.6 tPHL10/ All 5.0 V 9 1.0 3.7 4.5 V and 5.5 V 10, 11 0.5 4.2 See footnotes at end of table. Provided by IHSNot for Resal

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