DLA SMD-5962-98564 REV A-2007 MICROCIRCUIT DIGITAL BIPOLAR BCD-TO-SEVEN-SEGMENT DECODER DRIVER MONOLITHIC SILICON《微型电路 数字型 双极 BCD到7区解码器 驱动器 单块硅》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 07-02-12 Joseph D. Rodenbeck REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Lee Surowiec DEFENSE

2、 SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Larry E. Shaw COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, DIGITAL, BIPOLAR, BCD-TO-SEVEN-SEGMENT DECODER/DRIVER AND AGENCIES OF THE DEPA

3、RTMENT OF DEFENSE DRAWING APPROVAL DATE 98-03-31 MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-98564 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E068-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

4、WING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).

5、 A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 98564 01 Q E X Federal s

6、tock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked wi

7、th the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: D

8、evice type Generic number Circuit function 01 SN5447A BCD-to-seven-segment decoder/driver w/ open-collector outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendo

9、r self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Ou

10、tline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNo

11、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) (with respect

12、 to ground terminal) . 7 V dc Input voltage 5.5 V dc Current forced into any output in the off state . 1 mA Case operating temperature range (TC) -55C to +125C Maximum power dissipation (PD) . 595 mW Thermal resistance, junction to case (JC) . See MIL-STD 1835 Junction temperature (TJ) 175C Storage

13、temperature range . -65C to +150C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc Off-state output voltage (VO(off) (a thru g) . 15 V dc On-state output current (IO(on) (a thru g) 40 mA High-level output current (IOH) ( BI / RBO ) . -200 A Low-level output cur

14、rent (IOL) ( BI / RBO ) 8 mA Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specifie

15、d, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interf

16、ace Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or f

17、rom the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, howev

18、er, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for Resa

19、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for d

20、evice classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for devic

21、e class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V

22、 or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Segment identification, numerical designations and displays. The segment identification, numerical designation and resultant displays shall be as specif

23、ied on figure 1. 3.2.3 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.4 Function table. The function table shall be as specified on figure 3. 3.2.5 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.6 Voltage waveforms and load circuit. The

24、 voltage waveforms and load circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and s

25、hall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2

26、herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still

27、 be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MI

28、L-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this dr

29、awing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of suppl

30、y for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for

31、 device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) inv

32、olving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation

33、. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 4 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo repro

34、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C G

35、roup A subgroups Limits Unit unless otherwise specified Min Max High-level input voltage VIH1, 2, 3 2 V Low-level input voltage VIL1, 2, 3 0.8 V Input clamp voltage VIKVCC= 4.5 V, II= -12 mA 1, 2, 3 -1.5 V High-level output voltage BI / RBOVOHVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V, IOH= -200A 1, 2, 3 2.4

36、V Low-level output voltage BI / RBOVOLVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V, IOL= 8 mA 1, 2, 3 0.4 V Off-state output current a thru g IO(OFF)VCC = 5.5 V, VIH= 2 V, VIL= 0.8 V, VO(OFF)= 15 V 1, 2, 3 250 A On-state output voltage a thru g VO(ON)VCC= 4.5 V, VIH= 2 V, VIL= 0.8 V, IO(ON)= 40 mA 1, 2, 3 0.4 V

37、 Input current at maximum input voltage Any input except BI / RBO IIVCC= 5.5 V, VI= 5.5 V 1, 2, 3 1 mA High-level input current Any input except BI / RBO IIHVCC= 5.5 V, VI= 2.4 V 1, 2, 3 40 A Low-level input current Any input except BI / RBO IILVCC= 5.5 V, VI= 0.4 V 1, 2, 3 -1.6 mA BI / RBO -4 Short

38、-circuit output current BI / RBO IOSVCC= 5.5 V 1, 2, 3 -4 mA Supply current BI / RBO ICCVCC= 5.5 V, All inputs at 4.5 V, All outputs open. 1, 2, 3 85 mA Functional tests See 4.4.1b 7, 8A, 8B Turn-off time from A input tPLHVCC= 5 V, RL= 120 , CL= 15 pF 9 100 ns Turn-on time from A input tPHLTA= 25C S

39、ee Figure 5 100 Turn-off time from RBI input tPLH100 Turn-on time from RBI input tPHL100 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION

40、 LEVEL A SHEET 6 DSCC FORM 2234 APR 97 FIGURE 1 Segment identification, numerical designations and displays. Device type 01 Case outlines E and F Terminal number Terminal symbol 1 B 2 C 3 LT 4BI / RBO 5RBI 6 D 7 A 8 GND 9 e 10 d 11 c 12 b 13 a 14 g 15 f 16 VCCFIGURE 2. Terminal connections Provided

41、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Decimal INPUTS OUTPUTS or Function LTRBID C B A BI / RBO *

42、a b c d e f g NOTE 0 H H L L L L H ON ON ON ON ON ON OFF 1 H X L L L H H OFF ON ON OFF OFF OFF OFF 2 H X L L H L H ON ON OFF ON ON OFF ON 3 H X L L H H H ON ON ON ON OFF OFF ON 4 H X L H L L H OFF ON ON OFF OFF ON ON 5 H X L H L H H ON OFF ON ON OFF ON ON 6 H X L H H L H OFF OFF ON ON ON ON ON 7 H X

43、 L H H H H ON ON ON OFF OFF OFF OFF 1 8 H X H L L L H ON ON ON ON ON ON ON 9 H X H L L H H ON ON ON OFF OFF ON ON 10 H X H L H L H OFF OFF OFF ON ON OFF ON 11 H X H L H H H OFF OFF ON ON OFF OFF ON 12 H X H H L L H OFF ON OFF OFF OFF ON ON 13 H X H H L H H ON OFF OFF ON OFF ON ON 14 H X H H H L H OF

44、F OFF OFF ON ON ON ON 15 H X H H H H H OFF OFF OFF OFF OFF OFF OFF BI X X X X X X L OFF OFF OFF OFF OFF OFF OFF 2 RBI H L L L L L L OFF OFF OFF OFF OFF OFF OFF 3 LT L X X X X X H ON ON ON ON ON ON ON 4 H = high level, L = low level, X = irrelevant NOTES: 1. The blanking input ( BI ) must be open or

45、held at a high logic level when output functions 0 through 15 are desired. The ripple blanking input ( RBI ) must be open or high if blanking of a decimal zero is not desired. 2. When a low logic level is applied directly to the blanking input ( BI ), all segment outputs are off regardless of the le

46、vel of any other input. 3. When ripple blanking input ( RBI ) and inputs A, B, C and D are at a low level with the lamp test input high, all segment outputs go off and the ripple blanking output ( RBO ) goes to a low level (response condition). 4. When the blanking input/ripple blanking output ( BI

47、/ RBO ) is open or held high and a low is applied to the lamp-test input, all segment outputs are on. * BI / RBO is wire AND logic serving as blanking input (BI ) and/or ripple blanking output ( RBO ). FIGURE 3. Function table. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

48、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 FIGURE 4 Logic diagram Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98564 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 Notes: 1. CLincludes probe and jig capacitance. See Table I. 2. All input pulse