DLA SMD-5962-98591 REV B-2003 MICROCIRCUIT DIGITAL-LINEAR 14-BIT 5 MSPS ANALOG-TO-DIGITAL CONVERTER MONOLITHIC SILICON《微型电路 数字线型 14位5MSPS 模数转换器 单块硅》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make changes to 1.3 and table I. - ro 99-02-22 R. MONNIN B Drawing updated to reflect current requirements. gt 03-05-14 R. MONNIN REV SHET REV B B B B SHEET 15 16 17 18 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9

2、10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN AND AGENCIES OF THE DEPARTMENT OF DEFEN

3、SE DRAWING APPROVAL DATE 99-01-06 MICROCIRCUIT, DIGITAL-LINEAR, 14-BIT, 5 MSPS, ANALOG-TO-DIGITAL CONVERTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-98591 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E495-02 DISTRIBUTION STATEMENT A. Approved for public release; distribu

4、tion is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing

5、 documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identif

6、ying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environment. 1.2 PIN. The PIN is as shown in the following example: 5962 - 98561 0

7、1 N X X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Deviceclass designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA lev

8、els and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit f

9、unction as follows: Device type Generic number Circuit function 01 HI5905 14-bit 5 MSPS, analog-to-digital converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vend

10、or self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) Q or V Certification and qu

11、alification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 44 Plastic quad flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for dev

12、ice classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3

13、 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage, AVCCor DVCCto AGNDor DGND.+6.0 V DGNDto AGND.0.3 V Digital INPUT/OUTPUT pins.DGNDto DVCCAnalog INPUT/OUTOUT pins .AGNDto AVCCPower dissipation (PD)See table I Estimated minimum product life time4.5 years 2/ Maximum lead temperat

14、ure (soldering lead tips only, 10 seconds)300C Maximum junction temperature (TJ)150C Maximum storage temperature range.-65C to +150C Thermal resistance, junction-to-ambient (JA) 60C/W 1.4 Recommended operating conditions. Supply voltage, AVCC= DVCC1= DVCC2+5.0 V Operating ambient temperature range (

15、TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue

16、of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method

17、Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and

18、 handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect re

19、liability. 2/ When operated at TA= +125C, the rated frequency is 5 MSPS and the voltage is 5.5 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000

20、 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a spec

21、ific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the

22、QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design,

23、 construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connect

24、ions. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram(s). The block diagram(s) shall be as specified on figure 3. 3.2.4 Timing waveform(s). The timing waveform(s) shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation paramet

25、er limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the su

26、bgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN num

27、ber is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class

28、M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Marking for devices class N. For PEM packages MIL-PRF-38535 marking is not required. Marking on the device shall include; a traceable data code, country of origin, pin one indicator, and Manufacturers identification. In addition, the QML

29、 certification mark and the PIN as shown in 1.2 herein shall be marked on the topside of the package. Manufacturer may at their option place the QML certification mark adjacent to the PIN. 3.5.2 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or

30、“Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes N, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to th

31、e requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an

32、 approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes N, Q, and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. Provided by IHSNot for ResaleNo reproduction or

33、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q,

34、 and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices ac

35、quired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. O

36、ffshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 81 (see MIL-PRF-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sam

37、pling and inspection. For device classes N, Q, and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.

38、 For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes N, Q, and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance i

39、nspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D.

40、 The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the in

41、tent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes N, Q, and V. a. The burn-in test duration, test condition and test temperature, or approve

42、d alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made a

43、vailable to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as spec

44、ified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B or as modified in the device manufacturers quality management (QM) plan. Provided by IHSNot for ResaleNo reproduction or networking permit

45、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Gr

46、oup A subgroups Device type Limits Unit Min Max Internal voltage reference section Reference output voltage VROUT1 01 3.95 4.05 V 2,3 2/ 3.88 4.10 Reference output current IROUT1,2,3 2/ 01 0.75 mA Digital inputs (CLK) section Input logic high voltage VIH3/ 1,2,3 2/ 01 2.0 V Input logic low voltage V

47、IL3/ 1,2,3 2/ 01 0.8 V Input logic high current IIHVCLK= 5 V 1 01 -10.0 +10.0 A Input logic low current IILVCLK= 0 V 1 01 -10.0 +10.0 A Digital outputs (D0 - D13) section Output logic high voltage VOHIOH= 100 A 1,2,3 2/ 01 3.5 V Output logic low voltage VOLIOL= 100 A 1,2,3 2/ 01 1.5 V Power supply c

48、haracteristics section Total supply current ICC+VIN= -VIN= VDC1 01 80 mA 2,3 2/ 90 Power dissipation PD+VIN= -VIN= VDC1 01 400 mW2,3 2/ 415 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

49、IZE A 5962-98591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Accuracy section Resolution 4 01 14 Bits