DLA SMD-5962-98621-1998 MICROCIRCUITS DIGITAL ADVANCED CMOS CRYSTAL CLOCK GENERATOR MONOLITHIC SILICON《微型电路 数字型 混合型的CMOS 晶体石英生成器 单块硅》.pdf

1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDREVSHEETREVSHEET 15 16 17 18 19REV STATUS REVOF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BYJoseph A. KerbyDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYCharles F. Saffle, Jr.COLUMBUS, OHIO 43216THIS DRAWING

2、 IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMonica L. Poelking MICROCIRCUITS, DIGITAL, ADVANCED CMOS, CRYSTAL CLOCK GENERATOR,AND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE98-12-21MONOLITHIC SILICONAMSC N/A REVISION LEVEL SIZEA CAGE CODE 67268 5962-98621SHEET 1 OF 19DSCC FORM 22

3、33APR 97 5962 -E057-99DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98621DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-500

4、0 REVISION LEVEL SHEET 2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents two product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the

5、Partor Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.1.2 PIN . The PIN is as shown in the following example:5962 - 98621 01 Q E XFederal RHA Device Device Case Lead stock class designator type class outline finishdesignator (

6、see 1.2.1) (see 1.2. 2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator . Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and aremarked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-3

7、8535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA device.1.2.2 Device type(s) . The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 54ACT3301 Crystal Clock Generator1.2.3 Dev

8、ice class designator . The device class designator is a single letter identifying the product assurance level as listedbelow. Since the device class designator has been added after the original issuance of this drawing, device classes M and Qdesignators will not be included in the PIN and will not b

9、e marked on the device.Device class Device requirements documentationM Vendor self -certification to the requirements for MIL-STD-883 compliant,non -JAN class level B microcircuits in accordance with MIL-PRF-38535,appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s)

10、 . The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleF GDFP2-F16 or CDFP3-F16 16 Flat p ack1.2.5 Lead finish . The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendixA for d

11、evice class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98621DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3DSCC FORM 2234APR 971.3 Absolute maximum ratings . 1 / 2 / 3 /Supp

12、ly voltage range (V CC ) -0.5 V dc to +7.0 V dcDC input voltage range (V IN ) -0.5 V dc to +7.0 V dcDC output voltage range (V OUT ) . -0.5 V dc to V CC + 0.5 V dcDC input diode current (I IK ) 9 mADC output diode current (I OK ) . 20 mADC output source or sink current (I OUT ) 70 mAMaximum power di

13、ssipation (P D ) 500 mWStorage temperature range (T STG ) -65 C to +150 CLead temperature (soldering, 10 seconds) . +300 CThermal resistance, junction -to -case ( JC ) See MIL -STD -1835Junction temperature (T J ) +175 C 4 /1.4 Recommended operating conditions . 2 / 3 /Supply voltage range (V CC ) +

14、4.5 V dc to +5.5 V dcInput voltage range (V IN ) . +0.0 V dc to +5.5 V dcOutput voltage range (V OUT ) . +0.0 V dc to V CC V dcMaximum low level input voltage (V IL1 ) (OEH, OEL ) . 0.8 V dcMinimum high level input voltage (V IH1 ) (OEH, OEL) 2.0 V dcMaximum low level input voltage (V IL2 ) (DIVA) .

15、 30% V CCMinimum high level input voltage (V IH2 ) (DIVA) 70% V CCMaximum low level input voltage (V IL3 ) (OSC_DR, DIVB) . 10% V CCOne-half input voltage level (V 1/2 ) (OSC_DR, DIVB) 50% V CCMinimum high level input voltage (V IH3 ) (OSC_DR, DIVB) 90% V CCMaximum high level output current (I OH )

16、. -48 mAMaximum low level output current (I OL ) . +48 mACase operating temperature range (T C ) . -55 C to +125 C1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2 / Unless

17、 otherwise noted, all voltages are referenced to GND.3 / The limits for the parameters specified herein shall apply over the full specified V CC range and case temperature rangeof -55 C to +125 C. 4 / Maximum junction temperature shall not be exceeded except for allowable short duration burn-in scre

18、ening conditions inaccordance with method 5004 of MIL-STD-883.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98621DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4DSCC FORM 2234APR

19、972. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks . The following specification, standards, and handbooks form a partof this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in theissue of the Department

20、of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL -STD -883 - Test Method Standard Microcircuits.

21、MIL-STD-973 - Configuration Management.MIL-STD-1835 - Interf ace Standard For Microcircuit Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL -HDBK -780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification

22、, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Non-Government publications . The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the

23、 issues of the documents which are DOD adopted are those listed in the issue of the DODISScited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of thedocuments cited in the solicitation.ELECTRONIC INDUSTRIES ASSOCIATION (EIA)JEDEC Stan

24、dard No. 20 - Standardized for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-SpeedCMOS Devices.(Applications for copies should be addressed to the Electronics Industries Association, 2001 Eye Street, NW,Washington, DC 20006.)(Non-Government standards and other publications are normally a

25、vailable from the organizations that prepare or distributethe documents. These documents may also be available in or through libraries or other informational services.)2.3 Order of precedence . In the event of a conflict between the text of this drawing and the references cited herein, the text ofth

26、is drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98621DEFENS

27、E SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 5DSCC FORM 2234APR 973. REQUIREMENTS3.1 Item requirements . The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in the device manufacturers Q

28、uality Management (QM) plan. Themodification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements fordevice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifiedherein.3.2 Design, c

29、onstruction, and physical dimensions . The design, construction, and physical dimensions shall be as specifiedin MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outlines . The case outlines shall be in accordance with 1.2.4 he

30、rein.3.2.2 Terminal connections . The terminal connections shall be as specified on figure 1.3.2.3 Truth table . The truth table shall be as specified on figure 2.3.2.4 Logic diagram . The logic diagram shall be as specified on figure 3.3.2.5 Switching waveforms and test circuit . The switching wave

31、forms and test circuit shall be as specified on figure 4.3.2.6 Radiation exposure circuit . The radiation exposure circuit shall be as specified when available.3.3 Electrical performance characteristics and postirradiation parameter limits . Unless otherwise specified herein, theelectrical performan

32、ce characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullcase operating temperature range.3.4 Electrical test requirements . The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup ar

33、e defined in table I.3.5 Marking . The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to spacelimitations, the manufacturer has the opt

34、ion of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.3.5.1 Certification

35、/compliance mark . The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.3.6 Certificate of compliance . For device classes Q and V, a certificate of compli

36、ance shall be required from a QML -38535listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate ofcompliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see6.6.2

37、herein). The certificate of compliance submitted to DSCC -VA prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 andherein or for device class M, the requirements of MIL-PRF-

38、38535, appendix A and herein.3.7 Certificate of conformance . A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 orfor device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.3.8 Notification of change f

39、or device class M . For device class M, notification to DSCC -VA of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN

40、DARDMICROCIRCUIT DRAWINGSIZEA 5962-98621DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 6DSCC FORM 2234APR 973.9 Verification and review for device class M . For device class M, DSCC, DSCCs agent, and the acquiring activity retainthe option to review the manufacturers fa

41、cility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for device class M . Device class M devices covered by this drawing shall be inmicrocircuit group number 39 (see MIL-PRF-38535, appendi

42、x A).4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection . For device classes Q and V, sampling and inspection procedures shall be in accordance withMIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM planshall not affect the form,

43、 fit, or function as described herein. For device class M, sampling and inspection procedures shall bein accordance with MIL-PRF-38535, appendix A.4.2 Screening . For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conductedon all devices prior to qualificat

44、ion and technology conformance inspection. For device class M, screening shall be inaccordance with method 5004 of MIL -STD -883, and shall be conducted on all devices prior to quality conformance inspection.4.2.1 Additional criteria for device class M .a. Burn -in test, method 1015 of MIL -STD -883

45、.(1) Test condition A, B, C, or D. The test circuit shall be maintai ned by the manufacturer under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shallspecify the inputs, outputs, biases, and power dissipation, as appl

46、icable, in accordance with the intent specifiedin test method 1015.(2) T A = +125 C, minimum.b. Interim and final electrical test parameters shall be as specified in table II herein.4.2.2 Additional criteria for device classes Q and V .a. The burn -in test duration, test condition and test temperatu

47、re, or approved alternatives shall be as specified in thedevice manufacturers QM plan in accordance with MIL-PRF-38535. The burn -in test circuit shall be maintainedunder document revision level control of the device manufacturers Technology Review Board (TRB) in accordancewith MIL-PRF-38535 and sha

48、ll be made available to the acquiring or preparing activity upon request. The testcircuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intentspecified in test method 1015 of MIL-STD-883.b. Interim and final electrical test parameters shall b

49、e as specified in table II herein.c. Additional screening for device class V beyond the requirements of device class Q shall be as specified inMIL-PRF-38535, appendix B.4.3 Qualification inspection for device classes Q and V . Qualification inspection for device classes Q and V shall be inaccordance with MIL-PRF-38535. Inspections to be