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本文(DLA SMD-5962-99517 REV L-2012 MICROCIRCUIT LINEAR RADIATION HARDENED ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON.pdf)为本站会员(李朗)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-99517 REV L-2012 MICROCIRCUIT LINEAR RADIATION HARDENED ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. rrp 99-11-15 R. Monnin B Changes made to VRLOAD, IADJ(line), VRLINE, VOUT, and VIN/VOUTtests in table I. rrp 00-07-17 R. Monnin C Add case outline Z. Make change to 1.2.4, 1.3, and figure 2. - ro 00-10-03 R. Monnin D Ad

2、d footnote to 1.5. Change made to 3.2.3. Remove radiation test circuits. -rrp 00-12-22 R. Monnin E Drawing updated to reflect current requirements. gt 02-05-10 R. Monnin F Make change to the radiation hardened VOUTtest maximum limits for device types 03 and 04 as specified under table I. - ro 02-08-

3、01 R. Monnin G Make change to VOUT(Recovery) test as specified in table I for device types 03 and 04. - ro 02-09-05 R. Monnin H Add device type 05 tested at Low Dose Rate. Make changes to 1.2.2, 1.3, 1.4, 1.5, table I, figure 2, table IIB, and 4.4.4.1. Drawing updated to reflect current requirements

4、. -rrp 06-07-18 R. Monnin J Add appendix A, die requirements. Change 1.3, ELDRS dose rate from 12 mrad(Si)/s to 10 mrad(Si)/s. - drw 08-09-25 Robert M. Heber K Add device types 06 and 07. - drw 11-11-14 Charles F. Saffle L Add device type 08. - ro 12-06-27 Charles F. Saffle REV SHEET REV L L L L L L

5、 L L L L SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV L L L L L L L L L L L L L L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rajesh Pithadia DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Raj

6、esh Pithadia THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, LINEAR, RADIATION HARDENED, ADJUSTABLE, VOLTAGE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 99-05-13 REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL L SIZE A CAGE CODE

7、 67268 5962-99517 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E287-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99517 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 2 DSCC FORM 2234

8、 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). W

9、hen available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 P 99517 01 Q X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designat

10、or (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA

11、 levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 LM137H, WG Adjustable, negative, voltage regulator 02 LM137K Adjustable, ne

12、gative, voltage regulator 03 1/ LM117H, WG Adjustable, positive, voltage regulator 04 LM117K Adjustable, positive, voltage regulator 05 1/ LM117H, WG Adjustable, positive, voltage regulator 06 1/ LM117GW Adjustable, positive, voltage regulator 07 1/ LM117GW Adjustable, positive, voltage regulator 08

13、 LM137H Adjustable, negative, voltage regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant,

14、non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure

15、 1 3 TO-39 can Y MBFM1-P2 2 Flange mount Z 1/ GDFP1-G16 16 Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1/ For case outline Z, package material for device types 03 and 05

16、are aluminum nitride and package material for device types 06 and 07 are aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99517 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L

17、SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 2/ Minimum input voltage (VIN): Device types 01, 02, and 08 . -41.25 V Maximum input voltage (VIN): Device types 03, 04, 05, 06 and 07 . 41.25 V Input-output voltage differential . 40 V Power dissipation: . Internally limited 3/ Maximum pow

18、er dissipation at TA= 25C: Device types 01 and 08 . 2.5 W Device type 02 . 28 W Device types 03, 05, 06 and 07 . 2 W Device type 04 . 20 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . 300C Maximum junction temperature (TJ) . 150C 3/ Operating junction temperatur

19、e . -55C to +150C Thermal resistance, junction-to-case (JC): Case X at 1.0 W (device types 01 and 08) 15C/W Case Y (device type 02) . 4C/W Case X (device types 03 and 05) . 21C/W Case Y (device type 04) . 1.9C/W Case Z (device type 01) . 2.7C/W Case Z (device types 03 and 05) . 3.4C/W 1/ Case Z (dev

20、ice types 06 and 07) . 7C/W 1/ Thermal resistance, junction-to-ambient (JA): Case X (device types 01 and 08) 140C/W still air at 0.5 W 64C/W 500 LFPM air flow at 0.5 W Case Y (device type 02) 40C/W still air 14C/W 500 LFPM air flow Case X (device types 03 and 05) 186C/W still air 64C/W 500 LFPM air

21、flow Case Y (device type 04) 39C/W still air 14C/W 500 LFPM air flow Case Z (device type 01) 108C/W still air at 0.5 W 65C/W 500 LFPM air flow at 0.5 W Case Z (device types 03 and 05) 115C/W still air at 0.5 W 1/ 66C/W 500 LFPM air flow at 0.5 W 1/ Case Z (device types 06 and 07) 130C/W still air 1/

22、 80C/W 500 LFPM air flow 1/ 1.4 Recommended operating conditions. Input voltage range: Device types 01 02, and 08 -4.25 V to -41.25 V Device types 03, 04, 05, 06 and 07 . 4.25 V to 41.25 V Ambient operating temperature range (TA) -55C to +125C 2/ Stresses above the absolute maximum rating may cause

23、permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ, JA, and TA. The maximum allowable power dissipation at any temperature is PD= (TJM

24、AX TA)/JAor the number given in the absolute maximum ratings, whichever is lower. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99517 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 4

25、 DSCC FORM 2234 APR 97 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s ): Device classes Q and V (device types 01, 02, and 08) 30 krads(Si) 4/ Device classes Q and V (device types 03, 04 and 06) . 100 krads(Si) 4/ Maximum total dose available (dose rate = 10 mrads

26、(Si)/s): Device classes Q and V (device types 05 and 07) . 100 krads(Si) 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, th

27、e issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface S

28、tandard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document

29、 Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws a

30、nd regulations unless a specific exemption has been obtained. 4/ For device types 01, 02, 03, 04, 06, and 08, these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for

31、the conditions specified in MIL-STD-883, method 1019, condition A. 5/ For device types 05 and 07, these parts have been tested lot acceptance testing at low dose rate (10 mrads(Si)/s) and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed

32、 for the conditions specified in MIL-STD-883, test method 1019, condition D. Lot acceptance testing at low dose rate will continue to be performed on each wafer or wafer lot until characterization testing has been performed in accordance with Method 1019 of MIL-STD-883. Provided by IHSNot for Resale

33、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99517 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class

34、es Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M s

35、hall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical

36、 dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shal

37、l be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics a

38、nd post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical te

39、st requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD P

40、IN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device

41、class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.

42、3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufactur

43、er in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q a

44、nd V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A

45、shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that af

46、fects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime , DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made

47、available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted withou

48、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99517 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output voltage VOUTVIN= -4.25 V, IL= 5 mA 1 01, 02, 08 -1.275 -1.225 V 2, 3 -1.3 -1.2 VIN= -4.25 V, IL= 500 mA 1 0

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