ECA 186-10E-1978 Passive Electronic Component Parts Test Methods for Method 10 Effect of Soldering《无源电子元件测试 方法10 焊接影响》.pdf

1、EIA 18b-1OE 78 m 3234600 0028559 b m ANS I/E IA RS-186-E-78 Approved October 27, 1978 EIA STANDARD STANDARD TEST METHODS FOR PASSIVE ELECTRONIC * COMPONENT PARTS METHOD IO: EFFECT OF SOLDERING (Revision of RS-l86-D, Method 1 O) OCTOBER 1978 Engineering Department ELECTRONIC INDUSTRIES ASSOCIATION EI

2、A Lb-LOE 78 m 3234b00 0025b0 2 m 1 ., NOTICE EIA engineering standards are designed to serve the public interest through eliminating mis- understandings between manufacturers and putchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obt

3、aining with mini- mum delay the proper product for his particular need. Existence of such standards shall not in any respect preclude any member or nonmember of EIA froin manufacturing or selling products not conforming to such standards, nor shall the existence of such standards preclude their volu

4、ntary use by those other than EIA members whether the standard is to be used either domestically or internationally. Recommended standards are adopted by EIA without regard to whether or not their adop- tion may involve patents on articles, materials, or processes. By such action, EIA does not assum

5、e any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the recommended standards. This Standard contains the major technical contents of International Electrotechnical Com- mission Publication 68-2-20A, Test Tb: Resistance to Soldering Heat, Method 1B. It

6、 differs from the IEC Publication 68-2-ZOA only in test control and procedure wording. These differences are well known to the U.S. Committee of Experts for the International Electrotechnical Commission Technical Committee 50 and resolution of these differences . will be sought in future meetings of

7、 TC-50. Published by ELECTRONIC INDUSTRIES ASSOCIATION Engimerhq Department 2001 Eye Street, N. W.? Waahiagton, D, C, 20006 Q Eleotronlc Industries A8BoclettOa 1979 PRICE: $&OQ EIA Lb-LOE 78 i 3234b00 00285bL 4 RS-186-IOE Page 1 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 10

8、EFFECT OF SOLDERING (From EIA Standard RS-186-D and Standards Proposal No. 1271 formulated under the cognizance of the ElA P-9 Committee on Test Methods and Procedures.) INTRODUCTION This Test Method forms a part of the EIA Standard RS-186 which contains test guidance, definitions and standard test

9、conditions. 1. 2. 3. 4. PURPOSE This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied t

10、o integral component termina- stions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly. NOTE

11、 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.) NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.) PRECAUTIONS Care sho

12、uld be taken to prevent splashing of molten solder, which could result in serious injury to personnel or unnecessary damage to the test specimens. Care should be taken to avoid the presence of moisture or an abrupt immersion of the specimens. APPARATUS The following equipment is required: (a) Meltin

13、g pot capable of maintaining a solder bath at the desired temperature. (b) Timer, (c) Suitable fixtures for supporting specimens during test. PROCEDURE 4.1 Mounting - Specimens shall be mounted in any suitable fixture of low heat-conducting material, It is preferable although not required, that the

14、fixture be so arranged that the specimens are automatically released from the solder bath upon expiration of the specified time of test. EIA 186-1OE 78 3234600 08285b2 6 3 .= RS-186-1OE. Page 2, . If re-equipped with a suitable cam, the mechanical dipping device of EIA Standard RS-178-A may be conve

15、nient for performing the immersion and withdrawal operation over the solder bath. 4.2 Initial measurements shall be made as specified in the individual component-part standard. 4.3 Any dross on top of the solder bath shall be skimmed off immediately prior to dipping terminals into the bath. 4.4 AU c

16、omponent part terminals shall be immersed, one at a time, or if all terminals are grouped on one face and the clearance between adjacent terminals is less than one inch (25.4 mm), the terminals shall be dipped simultaneously as a group, Solder bath temperature and immersion time shall conform to the

17、 specified severity selected from Table I. TABLE I SOLDER BATH TEMPERATURE IMMERSION TIME, SECONDS SEVERITY RANGE - Co MIN. - MAX. . 350 (662OF) 340 to 360 (644 to 68OoF) 3 4 260 (5OOOF) 255 to 265 (491 to 509OF) 9 17 Terminals shall be immersed in the solder to a point one-eighth (3.17 mm) to three

18、-sixteenths (4.76 mm) of an inch from the component part body. Terminal insulation shall be considered as part of the component body. 4.5 % i 4 hours after the specimens have been removed from the solder bath, the final measurements shall be made and specimens visually examined for any physical damage. 5. SUMMARY The following details shall be specified in the individual component part standard: 5.1 Severity according to Table I in 4.4. 5.2 Special mounting, if required. 5.3 Measurements to be made and measurement methods. 5.4 Percent change in electrical characteristics allowed,