ECA 216-1959 Adhesion of Printed Wiring Method of Test for《印制电路粘连标准测试方法》.pdf

1、EIA 21b 59 W 3234b00 O063288 O = K Standard Method of Test for Adheswn of Printed Wiring E IA BAWD IS1216 (Reaffirmed Decem ber 1 9 70) Enlgilzeering Department ELECTRONIC INDUSTRIES ASSOCIATION (Porwrly RADIO-ELEC“RONICS-TELETELEVISION MA“ACRS ASSOCIATION) NOTICE EIA engineering standards are desig

2、ned to serve the public interest through eliminating mis- understandings between manufacturers and purchasers, facilitating interchangeability and improve- ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need, Existenc

3、e of such standards shall not in any respect pre- clude any member or non-member of EIA from manufacturing or selling products not conforming to such standards, nor shaii the existence of such standards preclude their voluntary use by those other than EIA members whether the standard is to be used e

4、ither domestically or internationally. Recommended standards are adopted by EIA without regard to whether or not their adoption may involve patents on articles, materials, or processes. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever

5、to parties adopting the recommended standards. Published by ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Eye Street, N.W., Washington, D. C. 20006 Copyright 1970 Electronic Industries Association All rights reserved PRICE: $2.00 .=. ,- 3 EIA 216 59 = 3234600 0063290 9 W RS-216 Pi wh

6、ether in adhesion, cohesion in the adhesive or in the base material. 9.1 1 Observations of unbonded areas after solder dipping, and approximate percentage of conductor area blistered or lifted from surface of insulating base in blister test. Typical Test Results : 3) 9) Material - .O62 inch.(l.6 mm)

7、 XXXP, .O0135 inch (.O35 mm) copper, one side Full off test Flux - triethanol amine Solder - ternary Pb-Sn-Bi Flux - Rosin alcohol Solder - Alloy Grade 60B, ASTM Designation B32 Time - 10 sec. Dip solder test Testing apparatus - Shot Bucket Elevated test temperature - 130C (1.3 N/mm) Test values - P

8、eel Test - 7.6 lb./in. (1.3 N/mm) average Maximum and Minimum Peel - 7.2 - 8.3 lb./in. (1.27 - 1.46 N/mm) Average values of peel strength Pull Test - 15 lbs. (2.6 N/mm) average Room 7.6 lb./in. (1.3 N/mm) Elevated 3.6 lb./in. (0.63 N/mm) Before soldering 15 lbs. (2.6 N/mm) After soldering 14 lbs. (2

9、.46 N/mm) Average pull-off strength Type of failure - Pull failed in cohesion of base material No blisters after dip soldering. Peel failed in adhesion to base material A. o-_ -6 O i i 0 .I25 - .I 25 f .O05 (3.17 f -13 mm) T_ t .I 25 f .O05 (3.17 k .I3 mm) EIA 2Lb 59 M 3234b00 00b3296 T W RS-216 Pag

10、e 7 .O3 1 (0.79 mm) I I- .O52 hole f .O83 (1.3 * .O8 mm) I- k.3124.2504 (3.1 7 mm) . (7.9mm) . (6.35 mm) 2.00 (50 rnm) FIGURE 1 NOTE: When soldering in wires to lands for pull-off test, be sure that wire extends at 90“ angle from board use 0.04 inch (0.10 mm) dia. Tolerances are f .O1 5 (0.39 mm) unless otherwise noted. Dimensions are in inches; millimeter dimensions in brackets. - E E 3 FIGURE 2 0 - .O31 f .O05 inches (0.79 f .I3 mm) space centered within f .O16 (0.4 mm)