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本文(ECA EIA-364-1000A-2016 TS-1000A Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Controlled Environment Applications.pdf)为本站会员(eventdump275)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ECA EIA-364-1000A-2016 TS-1000A Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Controlled Environment Applications.pdf

1、 EIA STANDARD TS-1000A Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Controlled Environment Applications EIA-364-1000A (Revision of EIA-364-1000) February 2016 Electronic Components Industry Association ANSI/EIA-364-1000A-2016 Approved: Feb

2、ruary 26, 2016 EIA-364-1000A NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting a

3、nd obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence

4、 of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent poli

5、cy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA standard is considered to have International Standardization implications, but the International Electrotechnical Commissio

6、n activity has not progressed to the point where a valid comparison between the EIA standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this

7、 Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. SP-5294 formulated under the cognizance of the EIA CE-2.0 Committee on National Connector and Socket Standards). Published by ELECT

8、RONIC COMPONENTS INDUSTRY ASSOCIATION 2016 Standards see table 8 4.3 Temperature and duration for temperature life (preconditioning) test; see table 9 4.4 Option to be used for test group 4 (see note 1 at the bottom of table 4) and the total exposure time to mixed flowing gas, (see table 4.1) 4.5 Co

9、nnector or socket to be tested (supplier part number and family name) 4.6 Contact plating types and thicknesses (with measurement location and technique to be used) 4.7 Plastic material(s) (generic type, color, and glass and/or mineral content) 4.8 Contact alloy (CA number or other industry material

10、 designation) 4.9 Surface treatment (lubricant or other, if any) NOTE If present, do not remove during preparation of test specimens. 4.10 Pass/Fail criteria (if any) 4.11 Any information that differs from that described in this standard. 5 Test documentation Documentation shall contain the followin

11、g. Some items may be provided by the connector or socket supplier. Others may be determined by the testing laboratory. 5.1 Description of test specimen(s) 5.1.1 Supplier part number(s) 5.1.2 Supplier family name 5.1.3 Applicable industry standards EIA-364-1000A Page 13 5.1.4 Contact count and spacin

12、g 5.1.5 Number of rows of contacts 5.1.6 Plastic material (generic type, color, and glass and/or mineral content) 5.1.7 Contact alloy (CA number or other industry material designation) 5.1.8 Contact plating types 5.1.9 Test specimen plating thicknesses, including statistical summary of the measureme

13、nts 5.1.10 Surface treatment, if any 5.1.10.1 Supplier name and/or generic description 5.1.10.2 How and when applied to contacts 5.1.11 For card edge connectors, thickness and bevel of mating card 5.1.12 Photographs (optional) 5.2 Preparation of test specimens 5.2.1 Description of board carrier atta

14、chment method 5.2.1.1 Chemical (flux, solvent, rinse, etc.) and temperature exposure 5.2.1.2 Application tools used 5.2.2 Description of cable/wire termination method 5.2.2.1 Application tools used 5.2.2.2 Cable/wire size 5.2.2.3 Cable/wire type 5.2.2.3.1 Plating 5.2.2.3.2 Number of strands 5.3 Test

15、 equipment used, and date of last and next calibration EIA-364-1000A Page 14 5.4 Test procedures used 5.4.1 Deviation(s) to those specified, if any, including explanation(s) 5.5 Schematic diagram of the circuit used to measure low level contact resistance 5.6 Test results 5.6.1 Mean, minimum, and ma

16、ximum change in low level contact resistance, and the standard deviation of the changes, as calculated at each interval of measurement in each of the test groups 5.6.2 Plots of the change in low level contact resistance (y-axis) versus cumulative % of the readings less than that change (x-axis) for

17、each interval of measurement in each of the test groups (if requested) 5.6.3 Tabulated data of the change in low level contact resistance of each circuit that includes a separable contact interface, as calculated at each interval of measurement in each of the test groups (if requested) 5.6.4 Photogr

18、aphs (optional) 5.7 A discussion of the test results 5.8 Name of operator and start/finish date(s) of test EIA-364-1000A Page 15 Table 8 - Test durations (hours) for temperature life Field temperature, C Field life, years Test temperature, C 85 90 105 115 125 150 175 Test duration, hours (see note 3

19、) 57 3 355 176 24 7 5 568 281 38 11 7 775 381 51 14 4.4 10 1,076 527 69 20 5.9 60 3 563 278 37 11 5 905 444 59 17 5.0 7 1,237 605 79 22 6.6 10 1,724 839 108 30 9.0 65 3 1,214 593 78 22 6.55 1,966 955 122 34 10 7 2,701 1,306 165 46 13 10 3,783 1,820 228 62 18 75 3 2,703 333 90 26 5 4,412 533 143 41 7

20、 726 193 55 10 1,008 265 75 4.1 85 3 4,169 505 135 39 5 819 217 61 7 1,126 295 83 4 10 1,578 411 114 6 95 3 2,103 543 150 8 5 3,458 882 241 12 7 4,799 1,213 329 16 10 1,701 457 22 105 3 2,182 582 28 5 3,589 946 44 7 4,981 1,302 60 4 10 1,827 83 5 125 3 361 21 5 584 33 7 802 45 10 1,121 62 NOTES 1 Te

21、st durations pertaining to field temperatures of 57 C, 60 C, 65 C and 75 C. are based on the assumption that the contact spends its entire field life at that temperature, whereas those associated with a field temperature of 85 C, 95 C, 105 C and 125 C are based on the assumption that the contact spe

22、nds 1/3 of its field life at that temperature and its remaining life at 40 C or less. 2 The materials used in the construction of the connector or socket and in the components of the test vehicle (e.g., printed circuit cards, wiring, etc.) should be considered when selecting a test temperature. 3. V

23、alues less than 4 hours and greater than 5000 hours have been eliminated from this table. This table was derived from the table in the informative annex C. EIA-364-1000A Page 16 Table 9 - Test durations (hours) for temperature life (preconditioning) Field temperature, C Field life, years Test temper

24、ature, C 85 90 105 115 125 150 175 Test duration, hours 57 3 205 103 14 4 - - - 5 339 169 23 7 - - - 7 467 231 31 9 - - - 10 651 321 43 12 - - - 60 3 336 167 23 7 - - - 5 547 270 36 10 - - - 7 747 368 49 14 4.2 - - 10 1,029 504 66 19 5.6 - - 65 3 733 361 48 14 4 - - 5 1,166 570 75 21 6 - - 7 1,567 7

25、63 99 28 8 - - 10 2,129 1,032 132 37 11 - - 75 3 3,048 1,471 186 51 15 - -5 4,733 2,270 281 77 22 - - 7 6,327 3,023 371 100 29 - - 10 8,628 4,104 497 133 38 - - 85 3 4,499 2,159 268 73 21 - - 5 - 3,378 412 111 32 - - 7 - 4,551 549 147 42 - - 10 3,260 - 747 198 56 - - 95 3 - - 974 257 72 4.0 - 5 - -

26、1,561 406 113 6.0 - 7 - - 2,144 553 153 8.0 - 10 - - 3,019 772 212 10.9 - 105 3 - - 3,892 989 269 14 - 5 - - - 1,629 438 22 - 7 - - - 2,262 603 29 - 10 - - - 3,194 844 40 - 125 3 - - - - 3,522 153 9.4 5 - - - - - 221 13.3 7 - - - - - 273 16.3 10 - - - - - 333 19.7 NOTES 1 Test durations pertaining t

27、o field temperatures of 57 C, 60 C, 65 C and 75 C. are based on the assumption that the contact spends its entire field life at that temperature, whereas those associated with a field temperature of 85 C and 95 C are based on the assumption that the contact spends 1/3 of its field life at that tempe

28、rature and its remaining life at 40 C or less. 2 The materials used in the construction of the connector or socket and in the components of the test vehicle (e.g., printed circuit cards, wiring, etc.) should be considered when selecting a test temperature. 3. Values less than 4 hours and greater tha

29、n 5000 hours have been eliminated from this table. This table was derived from the table in the informative annex D. EIA-364-1000A Page A-1 Annex A Reference documents (normative) The following documents form a part of this standard to the extent indicated herein. In the event of conflict between th

30、e requirements of the standard and the reference documents this standard shall take precedence. A.1 EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications A.2 EIA-364-09: Durability Test Procedure for Electrical Connectors A.3 EIA-364-11: Resistance to Solvents

31、Test Procedure for Electrical Connectors A.4 EIA-364-17: Temperature Life With or Without Electrical Load Test Procedure for Electrical Connectors A.5 EIA-364-20: Withstanding Voltage Test Procedure for Electrical Connectors A.6 EIA-364-23: Low Level Contact Resistance Test Procedure for Electrical

32、Connectors A.7 EIA-364-28: Vibration Test Procedure for Electrical Connectors A.8 EIA-364-31: Humidity Test Procedure for Electrical Connectors and Sockets A.9 EIA-364-32: Thermal Shock Test Procedure for Electrical Connectors A.10 EIA-364-56: Resistance to Soldering Heat Test Procedure for Electric

33、al Connectors A.11 EIA-364-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors or Sockets Mounted on Printed Circuit Boards A.12 EIA-364-65: Mixed Flowing Gas A.13 EIA-364-70: Test Procedure for Current vs. Temperature Rise of Electrical Connectors A14 EIA-364-91: Du

34、st Test for Electrical Connectors and Sockets A.15 EIA-364-110: Thermal Cycling Test Procedure for Electrical Connectors and Sockets B Objective of the tests contained in the test groups (informative) B.l Cyclic temperature and humidity EIA-364-lOOOA Page B-1 To evaluate the susceptibility of the co

35、ntacts to the damaging effects caused by wet oxidation of platings and/or base metals at the contact interface B.2 Dielectric withstanding voltage To detect the presence of contaminants or debris between conducting components of the connector or socket B.3 Durability To confirm the integrity of the

36、connector or socket design with respect to its ability to withstand many mating/unmating cycles B.4 Durability (preconditioning) To subject the connector or socket to the number of mating :unmating cycles typically encountered during system manufacture and test and, in some cases, during early field

37、 use B.S Dust To evaluate the susceptibility of the connector or socket to the damaging effects caused by dust accumulation at the separable contact interface B.6 Low level contact resistance To detect surface contaminants, corrosion products, and films at the contact interface by applying a voltage

38、 across that interface without physically altering it B.7 Mixed flowing gas To evaluate the susceptibility of the contacts to the damaging effects caused by pore corrosion at the separable contact interface B.8 Resealing To determine if resealing the connector or socket causes electrical instability

39、 EIA-364-1000A Page B-2 B.9 Temperature life B.9.1 To evaluate the susceptibility of the connector or socket to the damaging effects caused by stress relaxation of the contacts, while allowing for other thermally activated material transformations, such as base metal diffusion to the contact interfa

40、ce and surface treatment degradation at the contact interface, to occur NOTE It is extremely difficult to define a single temperature life test that is efficient and accounts for every thermally activated material transformation. In fact, little data is available pertaining to some of these processe

41、s (i.e., the behavior of surface treatments over a significant range of exposure durations and temperatures). That being the case, the test durations and temperatures of table 8 were selected after consideration of the stress relaxation behavior of brass and phosphor bronze. The reasoning for this s

42、election is as follows. B.9.1.1 There is substantial data on the amount of stress relaxation in these copper alloys over a significant range of exposure durations and temperatures. B.9.1.2 The amount of stress relaxation in beryllium-copper at equivalent exposure durations and temperatures is neglig

43、ible. B.9.2 Each set of test conditions (duration and temperature) yields about the same amount of stress relaxation as that found in brass or phosphor bronze after the corresponding field exposure. B.10 Temperature life (preconditioning) B.10.1 To accelerate thermally activated material transformat

44、ions, thereby assuring that the contacts subjected to subsequent testing are representative of an aged condition NOTE Similar to the temperature life test, (see B.9), it is very difficult to define a single temperature life (preconditioning) test that efficiently accounts for every thermally activat

45、ed material transformation. Once again, and for the same reasons, the test durations and temperatures of table 9 were selected after consideration of the stress relaxation behavior of brass and phosphor bronze. B.10.2 Each set of test conditions (duration and temperature) results in 85% of the stres

46、s relaxation found in brass or phosphor bronze after the corresponding field exposure. B.11 Thermal cycling To evaluate the susceptibility of the connector or socket to the damaging effects caused by fretting corrosion at the contact interface B.l2 Thermal cycling (disturbance) ETA-364-lOOOA Page B-

47、3 To determine if a physical disruption of the contact interface causes electrical instability B.l3 Thermal shock To confirm the integrity of the connector or socket with respect to its ability to handle the thermal stresses that might be encountered during storage and transportation B.l4 Vibration

48、To confirm the integrity of the connector or socket design NOTE- This test does not simulate an actual application. EIA-364-1 OOOA Page C-1 C Test durations (hours) for temperature life complete data (informative) Table C.l in this informative annex contains the complete, unabridged test duration da

49、ta set used in the preparation of Table 8. This unabridged data has been retained for historical purposes. Test durations of less than 4 hours and greater than 5000 hours were omitted from table 8 because they were judged to be impractical. Table C.l -Test durations (hours) for temperature life complete data Field Field life, Test temperature, C temperature, years 85 90 105 liS 125 ISO 175 “C Test duration, hours 3 355 176 24 7 2.2 0.1 0.01 57 5 568 281 38 II 3.3 0.2 0.02 7 775 381 51 14 4.4 0.3 0.02 lO 1,076 527 69 20 5.9 0.4 0.03

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