ECA EIA-364-1004A-2016 TS-1004A Environmental Test Methodology for Verifying the Current Rating of Freestanding Power Contacts or Electrical Connectors and Sockets.pdf

1、 EIA STANDARD TS-1004A Environmental Test Methodology for Verifying the Current Rating of Freestanding Power Contacts or Electrical Connectors and Sockets EIA-364-1004A (Revision of EIA-364-1004) March 2016 Electronic Components Industry Association ANSI/EIA-364-1004A-2016 Approved: March 23, 2016 E

2、IA-364-1004A NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining wit

3、h minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standar

4、ds and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such acti

5、on, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA standard is considered to have International Standardization implications, but the International Electrotechnical Commission activity has n

6、ot progressed to the point where a valid comparison between the EIA standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to est

7、ablish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5352 formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Sockets Standards.) Published by Electronic Components I

8、ndustry Association 2016 EIA Standards & Technology Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of c

9、opies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5186), International (303-397-7956) i CONTENTS Clause Page 1 Introduction . 1 1.1 Scope . 1 1.2 Object 1 1.3 Definition 1 2 Test specimen 2

10、2.1 Description 2 2.2 Preparation 2 3 Test sequence 2 3.1 Test groups 2 3.2 Test groups 1, 2 and 3 . 3 3.3 Stabilization 3 3.4 Special applications 3 4 Details to be specified . 4 5 Test documentation . 5 Table 1 Tests and sequences 4 ii (This page left blank) EIA-364-1004A Page 1 TEST SEQUENCE No.

11、1004A ENVIRONMENTAL TEST METHODOLOGY FOR VERIFYING THE CURRENT RATING OF FREESTANDING POWER CONTACTS OR ELECTRICAL CONNECTORS AND SOCKETS (From EIA Standards Proposal No. 5352, formulated under the cognizance EIA CE-2.0 Committee on National Connector Standards, and previously published in EIA-364-1

12、004) 1 Introduction 1.1 Scope This standard describes recommended test sequences for verifying the specified current rating of freestanding contacts or electrical connectors and sockets used in power applications. These sequences may be used for developmental purposes and not for qualifying products

13、 with a specified current rating. 1.2 Object 1.2.1 Joule, or I2R, heating occurs in all current-carrying contacts. The associated temperature rise (T-rise) may lead to accelerated thermal degradation and possible, thermal runaway. This possibility gives rise to safety concerns which are generally ad

14、dressed by specification of a maximum T-rise at the device rated current. To ensure temperature rise stability, requires that the device maintain a stable value of resistance over the product lifetime. The test sequences in this standard are extreme environmental stresses and thus are intended to ve

15、rify the T-rise and resistance stability of electrical connectors and sockets after exposure to simulated application stresses. 1.3 Definitions For the purpose of this standard the following definitions apply: 1.3.1 Current rating The maximum current that results in a specified steady state T-rise o

16、f a contact when in a terminated state for its intended application, as specified in the manufacturers literature. EIA-364-1004A Page 2 2 Test specimens 2.1 Description 2.1.1 Unless otherwise specified in the reference document, three connectors shall be prepared for each test group, see 3.4. For fr

17、eestanding contacts, five contacts shall be prepared for testing. 2.2 Preparation Unless otherwise specified in the referencing document the test samples shall be terminated to the maximum size conductors. In no case shall the current rating of the conductor size being tested be exceeded. 2.2.1 For

18、printed circuit board connectors, the traces shall be designed to carry the specified current. 2.2.2 See EIA-364-70 (Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets) to select appropriate wire lengths, and board trace lengths and widths. 2.2.3 Unless otherwise sp

19、ecified in the referencing document the connectors shall be tested with a full compliment of contacts appropriately terminated to carry the rated current as specified. 2.2.4 Unless otherwise specified in the referencing document, the connector with the largest contact population shall be tested. 3 T

20、est sequences Power applications are those in which the T-rise at rated current may significantly affect degradation mechanisms and rates. The power application sequences are intended to create potential degradation mechanisms in the device under test. However, additional stresses may be present in

21、the application that would contribute to the degradation of the device, and therefore it may be necessary to include additional tests based on design objectives. The sequences presented are intended to fulfill the minimum performance requirements for the device. See table 1 for the test sequence pla

22、n. 3.1 Test groups 3.1.1 Unless otherwise specified, all contact positions designated for power shall be energized, and tested in accordance with the test sequences as indicated in table 1. If it is not intended to verify the current rating with all power positions of the connector energized, then t

23、he referencing document shall so specify. EIA-364-1004A Page 3 3.1.2 The referencing document shall indicate the following: identification of power contact patterns or positions to be tested, power input output locations, circuitry considerations (bussed, series circuit, etc) as applicable, thermoco

24、uple placement as applicable. NOTE It is recommended that the above items be agreed upon between the test requestor and testing agencies prior to initiating testing.“ 3.1.3 Unless otherwise specified in the referencing document or this standard, the specified current rating shall be used for all tes

25、ts requiring an energized condition. 3.2 Test groups 1, 2 and 3 3.2.1 The current versus T-rise test shall be performed in accordance with EIA-364-70, Method 1, unless otherwise specified in the referencing document. 3.2.2 Due to the broad amount of power applications, the referencing document shall

26、 specify the maximum allowed initial and final T-rise as well as the initial and all subsequent millivolt drop values. 3.3 Stabilization Unless otherwise specified in the referencing document, stabilization shall be defined as follows: 3.3.1 Temperature rise stabilization When the T-rise does not va

27、ry more than 1 C over three consecutive measurements conducted at five minute intervals. 3.4 Special applications In the event that special applications exists where a given environment is not relevant or an issue, said tests may be deleted. Additionally, other test may be added as well. Said except

28、ions as applicable shall be documented in the test report. EIA-364-1004A Page 4 Table 1 - Tests and sequences 1), 2) Test or examination Test procedure Test group 1 3)2 4)3 Test sequence Examination of product EIA-364-18 1 1 1,3 Millivolt drop EIA-364-06 2, 4 5), 6, 8, 10, 12, 14, 16 2, 4 5), 6, 8,

29、10, 12, 14, 16 Current versus temperature rise EIA-364-70 3, 15 3, 15 Durability, preconditioning EIA-364-9 5 5 Thermal shock EIA-364-32 7 7 Temperature life EIA-364-17 9 9 Humidity-cyclic EIA-364-31 11 Mixed flowing gas EIA-364-65 11 Vibration 6) EIA-364-28 13 13 Current cycling 7), 8)EIA-364-55 2

30、NOTES 1) Test methods, including severity levels and durations shall be specified in the referencing document. 2) Numbers indicate sequence in which the tests are to be performed. 3) Applies only to finish systems of tin and tin alloys. 4) Applies only to gold, palladium alloys, silver and their all

31、oys. 5) Millivolt drop measurements 4 through 14 of Test Groups 1 and 2 are optional, and are recommended. 6) When performing the vibration test, unless otherwise specified in the referencing document, a current to be determined to cause a T-Rise of 20 C 3 C shall be applied. 7) Unless otherwise spe

32、cified in the referencing document, the number of cycles shall be 1000. 8) T-rise and millivolt drop shall be measured during the last 15 minutes of the “on” cycle a minimum of twice a day. 4 Details to be specified The following detail shall be specified in the referencing document: 4.1 Current lev

33、els 4.2 Conductor size and plating 4.3 Voltage drop, temperature rise, and visual requirements 4.4 Environmental severity levels 4.5 Environmental durations EIA-364-1004A Page 5 4.6 Contact plating and thickness 4.7 Part numbers 4.8 Contact positions or patterns to be tested, see 3.1.2 4.9 Power inp

34、ut/output locations 4.10 Circuitry considerations 4.11 Thermocouple placement 5 Test documentation Documentation shall contain the details specified in clause 5, (when provided), and the following: 5.1 Test equipment used, and date of last and next calibration 5.2 Observed voltage drop data 5.3 Temp

35、erature rise versus current (amperes) data and supporting data 5.4 Test severity and durations 5.5 Any interruptions of the environmental tests 5.6 Recovery periods between removal of specimens from environmental chambers and measurements 5.7 Sample size per test group 5.8 Name of operator and start

36、/finish date(s) of test ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standar

37、ds & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Change

38、s: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Revision History Revision letter Project number Publication date Additions, changes and deletions - SP-5174-4 July 2010 In

39、itial publication A SP-5352 Revised paragraph 1.1, 2.1.1, 3.1.1, 3.1.2, 3.2, 3.3, 5.3 and 5.6 Revised test sequence in table 1 Revised table 1 note 5) Deleted table 1 notes 6) and 7) Renumbered remaining notes. Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org