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本文(ECA EIA-364-113-2010 TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets.pdf)为本站会员(王申宇)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ECA EIA-364-113-2010 TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets.pdf

1、 EIA STANDARD TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets EIA-364-113 March 2010 Electronic Components Industry Association ANSI/EIA-364-113-2010 (R2016) Approved: June 4, 2010 Reaffirmed: April 13, 2016 EIA-364-113NOTICE EIA Engineering Standards and Publicat

2、ions are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need

3、. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those

4、other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner

5、, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA standard is considered to have International Standardization implications, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison betwee

6、n the EIA standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to dete

7、rmine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5204 and reaffirmed by Standards Proposal No. 5361.08, formulated under the cognizance of the EIA CE-2.0 Committee on National Connector and Socket Standards). Published by ELECTRONIC COMPONENTS INDUSTRY A

8、SSOCIATION 2016 Standards & Technology Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through

9、 entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5186), International (303-397-7956) CONTENTS Clause Page 1 Introduction . 1 1.1 Scope . 1 2 Test resources 1 2.1 Material . 1 3 Test specimen 1 3.1 Descr

10、iption 1 3.2 Preparation 2 4 Test procedure . 2 5 Details to be specified . 4 6 Test documentation . 4 Table 1 Test conditions 3 i (This page left blank) ii EIA-364-113 Page 1 TEST PROCEDURE No. 113 CORROSIVITY OF CONTACTS TEST PROCEDURE FOR ELECTRICAL CONNECTOR AND SOCKET (From EIA Standards Propos

11、al No. 5204, formulated under the cognizance EIA CE-2.0 Committee on National Connector Standards.) 1 Introduction 1.1 Scope 1.1.1 This test procedure establishes a test method to determine whether corrosion products as a result of residual corrosive elements may be created on contact surfaces. Said

12、 products may be a result from improper cleaning or lack thereof, improper processes, entrapped particulates, etc. The following plating systems (but not limited to) are of interest. gold over copper (alloys) with or without nickel underplate, gold over palladium-nickel over copper (alloys) with or

13、without nickel underplate, silver plated systems with or without underplates. 1.1.2 This test procedure does not determine to what extent, if any, the performance of the product tested may be affected by the presence of residual corrosive elements on the contacts or connectors and any resulting corr

14、osion from the test exposure. Any effect that the existence of residual corrosive elements may have on product performance would be dependent on many factors including the product design, the location, type, concentration of residual corrosive elements, and the actual application of the product. 2 T

15、est resources 2.1 Material Noncorrosive string or equivalent 3 Test specimen 3.1 Description 3.1.1 Specimens shall be unassembled contacts (loose or on a carry strip). Contacts used in insert moldings shall be supplied loose prior to the molding operation. All contacts shall be tested in the as rece

16、ived condition, see 3.2.3 through 3.2.5. 3.1.2 Unplated control samples shall be from the same lot of contacts used in the insert molded assemblies, see 3.2.3 through 3.2.5. EIA-364-113 Page 2 3.2. Preparation 3.2.1 The test chamber shall be thoroughly cleaned, including the water pan for the humidi

17、ty generation. Deionized water shall be used. 3.2.2 A drip shield shall be used at an angle over the specimens under test to prevent stray water droplets from depositing on the test specimens. The drip shield shall be constructed of non-reactive material. 3.2.3 A minimum of 10 as received plated spe

18、cimens shall be attached to non-reactive string. An additional five specimens minimum, of the as received samples, shall be cleaned using ultrasonics and deionized water or equivalent process. A minimum of 10 control samples from connector assemblies shall also be prepared. All test specimens shall

19、be exposed in the unassembled and unmated condition except as noted in 3.2.5. 3.2.4 The test specimens (loose contacts, carrier strips or assemblies) shall be suspended in the chamber no closer than 5 centimeters (2 inches) from any chamber surface or to each other. 3.2.5 Optional (Connector assembl

20、ies) Contacts that have been assembled or insert molded may be tested along with loose contacts, see 3.2.3, at the discretion of the sponsoring activity. All test specimens shall be exposed in the unmated state. A total of five connector assemblies and the number of loose contacts, see 3.2.3, shall

21、be exposed. All loose contacts, carrier strips and assemblies shall be examined in accordance with 4.9 through 4.11. For insert-molded connectors a minimum of 10 contacts per connector shall be examined. For connector assemblies with less than 10 positions all positions shall be examined. Upon compl

22、etion of the visual examination, all test specimens shall be returned to the test sponsors for final disposition 4 Test procedure 4.1 The environment used is considered benign in that it will not create corrosion by itself. It is and acts as an accelerator and will initiate corrosion when in contact

23、 with corrosive elements or particulates that may have been deposited on metallized surfaces or entrapped in or on plating imperfections such as pore sites, material edges where the plating has thinned, voids, nicks, etc. 4.2 When corrosion occurs, it is recommended that root cause be determined. Sa

24、id activity may require additional procedures that are beyond the scope of this test procedure. In this instance, a separate report may be issued. When performed, the applicable test procedures used shall be listed with appropriate data. EIA-364-113 Page 3 4.3 Care should be taken in the selection o

25、f the test condition. The following guidelines are applicable: Test condition I: Flux induced corrosion, Test condition I or II: Loose contacts, Test condition I: When printed circuit boards are used with mating contact pads, Test condition II: When printed circuit boards are used with mating pads t

26、o which no soldering operation has been performed. NOTE When in doubt, test condition I shall be selected. 4.4 The test specimens shall be placed in the chamber with the chamber at room ambient conditions. 4.5 Unless otherwise specified, the chamber temperature shall be increased at an approximate r

27、ate of 1 C per minute (1.8 F per minute) and the humidity at an approximate rate of 4% per minute. At the conclusion of the exposure, the chamber ramp down rates shall be the same as the ramp up rates. 4.6 It is important that during the exposure that condensation does not form on the test samples.

28、If condensation does form on the samples, the test shall be aborted. In this instance the ramp rate may have to be adjusted to a level at which condensation does not form. 4.7 The test environment shall be in accordance with EIA-364-31, Method II. One of the test conditions in table 1 shall be chose

29、n. Table 1 Test conditions Test condition Temperature Relative humidity Duration I 40 C 2 C 90% to 96% 14 days II 85 C 2 C 82% to 88% 14 days 4.8 Upon completion of the exposure, the test specimens shall be allowed to recover to room ambient conditions. Wiping of the specimens shall not be allowed.

30、4.9 Unless otherwise specified in the referencing document, all test specimens shall be examined under 20X magnification. 4.10 If corrosion is observed on the unplated control samples, the test shall be considered invalid and will have to be repeated. Moisture spots, staining or surface tarnish shal

31、l not be considered as a reject. EIA-364-113 Page 4 4.11 Unless otherwise specified by the referencing document, the area of examination shall be the contact and projected wipe areas. The following are examples of (but not limited to) these areas: pin contacts: complete diametrical wipe area, blade

32、or pads: projected wipe area, socket contacts same zones, as indicated in EIA-364-53 figures 2 through 8. NOTE Evidence of corrosion products outside of the examination zones shall not be cause for failure 5 Details to be specified The following details shall be specified in the referencing document

33、: 5.1. Description of test specimens including part numbers, plating and plating thickness 5.2 Pass/fail criteria 5.3 Test conditions I or II 5.4 Specimen size, if other than specified 5.5 Connector assemblies, if applicable 6 Documentation Documentation shall contain the details specified in clause

34、 5, with any exceptions, and the following: 6.1 Title of test 6.2 Specimen description and/or part number 6.3 Test equipment used, and date of last and next calibration 6.4 Room ambient temperature and humidity 6.5 Test condition used and applicable charts 6.6 Results 6.7 Visual observations 6.8 Nam

35、e of operator and start/finish date(s) of test ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry

36、Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing

37、: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Revision History Revision letter Project number Publication date Additions, changes and deletions Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org

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