ECA EIA-364-61A-2014 TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards.pdf

1、 EIA STANDARD TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit BoardsEIA-364-61A (Revision of EIA-364-61) May 2014 ANSI/EIA-364-61A Approved: May 6, 2014 EIA-364-61A NOTICE EIA Engineering Standards and Publications are d

2、esigned to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existenc

3、e of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than

4、 ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does

5、 it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implications, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA

6、Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the

7、applicability of regulatory limitations before its use. (From Standards Proposal No. 5320, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Sockets Standards.) Published by Electronic Components Industry Association 2014 EIA Standards depending on the solder rewo

8、rk process. In the case of connectors or sockets with compliant pin terminations Procedure 4 shall be used. Table 1 Test procedures Test procedure Rework process Procedure 1 Soldering iron Procedure 2 Solder pot / fountain / wave solder Procedure 3 Hot gas / vapor Procedure 4 For compliant pin conne

9、ctor or socket EIA-364-61A Page 4 4.1 Procedure 1, soldering iron 4.1.1 Test specimen preparation 4.1.1.1 The test specimens shall be placed on a mounting board, see 2.1.4, or substrate surface in a position that is to be expected during normal use of the connector or socket. They shall not be in co

10、ntact with each other. 4.1.2 Test specimen thermal exposure 4.1.2.1 Unless otherwise specified in the referencing document, the test specimens on the mounting board or substrate surface shall be placed in an air circulating chamber, see 2.1.6, and baked at 125 C 5 C for a minimum of 48 hours. 4.1.2.

11、2 After baking a flux, see 2.2.2, shall be applied to the test specimens. 4.1.2.3 Solder shall be applied to each termination of the test specimen. The soldering iron tip shall be heated to a temperature and applied for a duration specified in the referencing document. In the absence of such a speci

12、fication, the soldering iron tip shall be heated to 360 C 10 C (680 F 18 F) for a tin/lead solder application or 426 C 10 C (799 F 18 F) for a lead-free solder application and it shall be applied for a duration that allows the solder to become liquid and remain in a liquid state for 4 to 5 seconds.

13、4.1.2.4 Unless otherwise specified in the referencing document, the solder and soldering iron shall be applied at a distance of 1.91 millimeters (0.075 inch) to 2.54 millimeters (0.100 inch) from the plastic housing. 4.1.2.5 After all terminations have been exposed to the soldering iron perform a vi

14、sual inspection at 10X plus any measurements specified in the referencing document. 4.2 Procedure 2, solder pot / fountain / wave solder 4.2.1 Test specimen preparation 4.2.1.1 Unless otherwise specified in the referencing document, the test specimens shall be mounted on a board with their terminati

15、ons inserted in through-holes. They shall not be in contact with each other, but they shall be in contact with the board. The mounting board shall be as described in 2.1.4. 4.2.1.2 After baking and before pre-heating, see 4.2.2.1, a flux, see 2.2.2, shall be applied to the test specimens. EIA-364-61

16、A Page 5 4.2.1.3 Any special preparation of test specimens prior to testing shall be defined in the referencing document. It could include bending of the terminations, cleaning (such as that found in IPC-CH-65), application of a special flux, pre-tinning of the terminations, and/or attachment of hea

17、t sinks or shielding, see 2.1.3. 4.2.2 Test specimen solder immersion/emersion 4.2.2.1 Unless otherwise specified in the referencing document, test specimens on the mounting board shall be placed in an air circulating chamber, see 2.1.6, and baked at 125 C 5 C for a minimum of 48 hours. Then, those

18、requiring tin/lead solder rework shall be pre-heated at 160 C 5 C for a minimum of 12 minutes, whereas those requiring a lead-free solder shall be pre-heated at 175 C 5 C for a minimum of 12 minutes. 4.2.2.2 Test specimens on the mounting board shall be immersed in the molten solder to a depth so th

19、at the bottom of the board contacts the solder. 4.2.2.3 Terminations of test specimens not mounted on a board shall be immersed in the molten solder to the depth specified in the referencing document. If not specified in the referencing document, they shall be immersed to a minimum depth of 0.762 mi

20、llimeter (0.030 inch). The terminations shall be immersed simultaneously, component geometry permitting. 4.2.2.4 The test condition shall be specified in the referencing document. When not defined, one shall be selected from table 2. The default test condition to be used for tin/lead solder rework i

21、s test condition I, whereas that to be used for lead-free solder rework is test condition II. Unless otherwise specified in the referencing document, the test specimens shall be subjected to 3 passes of the test condition. The temperature of the test specimen shall be 25C +/- 5C before starting anot

22、her cycle. Dross shall be removed from the solder prior to immersion. The surface of the solder shall be kept bright and clean. 4.2.3 Test specimen measurements and observations 4.2.3.1 Upon completion of all passes, perform a visual inspection at 10X magnification plus any measurements specified in

23、 the referencing document. Table 2 Test conditions Test condition Solder temperature Immersion duration, seconds I (see note) 265 C 5 C (509 F 9 F) 10 2 II (see note) 275 C 5 C (527 F 9 F) 10 2 NOTE Perform 3 passes. EIA-364-61A Page 6 4.3 Procedure 3, hot gas / vapor 4.3.1 Test specimen preparation

24、 4.3.1.1 The test specimens shall be placed on a mounting board, see 2.1.4, or substrate surface in a position that is to be expected during normal use of the connector or socket. They shall not be in contact with each other. 4.3.1.2 Unless otherwise specified in the referencing document, flux shall

25、 not be applied. 4.3.2 Test specimen thermal exposure 4.3.2.1 Unless otherwise specified in the referencing document, test specimens on the mounting board or substrate surface shall be placed in an air circulating chamber, see 2.1.6, and baked at 125 C 5 C for 48 hours minimum. 4.3.2.2 In lieu of ho

26、t gas / vapor rework tools, a test chamber with infrared or convection heating capability and of such size to accommodate all test specimens shall be used. The chamber shall be of a single or multiple temperature zone construction, with or without a conveyor transport system, as long as it is capabl

27、e of meeting the reflow conditions of 4.3.2.3, 4.3.2.3.1, and 4.3.2.3.2. 4.3.2.3 Unless otherwise specified in the referencing document, the reflow profile shall meet the requirements specified in the latest version of IPC/JEDEC J-STD-020, exclusive of the peak/classification temperature and the tim

28、e within 5 C of actual peak temperature. 4.3.2.3.1 Unless otherwise specified in the referencing document, the peak temperature of the connector or socket plastic housing shall be 240 C + 10 C / - 0 C (500 F + 18 F / - 0 F) for tin/lead solder rework or 260 C + 10 C / - 0 C (554 F + 18 F / - 0 F) fo

29、r lead-free solder rework. In each case the time within 5 C of actual peak temperature shall be a minimum of 10 seconds. 4.3.2.3.2 Unless otherwise specified in the referencing document, the test specimens shall be subjected to 2 passes of the reflow profile. After each pass they shall be removed fr

30、om the test chamber and allowed to cool and stabilize at room ambient conditions. 4.3.2.3.3 Verification testing should first be performed to determine if the thermal profile can be met. If it cannot a heat sink or shielding of the mounting board or substrate on which the connector or socket is plac

31、ed may be used. Verification testing should again be performed until the thermal profile is met. 4.3.3 Test specimen measurements and observations 4.3.3.1 Upon completion of all cycles, perform a visual inspection at 10X magnification plus any measurements specified in the referencing document. 4.4

32、Procedure 4, for compliant pin connectors or sockets EIA-364-61A Page 7 4.4.1 Test specimen preparation 4.4.1.1 Unless otherwise specified in the referencing document, the test specimens shall be pressed into a board meeting the thickness and plated-through-hole requirements of the compliant pin tec

33、hnology. The board material shall be suitable for withstanding the specified test temperatures. 4.4.1.2 Unless otherwise specified in the referencing document, flux shall not be applied. 4.4.2 Test specimen thermal exposure 4.4.2.1 Unless otherwise specified in the referencing document, test specime

34、ns shall be placed in an air circulating chamber (see 2.1.6) and baked at 125 C 5 C for a minimum of 48 hours. 4.4.2.2 Following baking, unless otherwise specified in the referencing document, the test specimens shall be placed in a reflow chamber and exposed to 2 cycles of the appropriate thermal p

35、rofile shown in table 3 and figure 1. The temperature of the test specimen shall be 25C 5C before starting another cycle. 4.4.2.2.1 Verification testing should first be performed to determine if the thermal profile can be met. If it cannot a heat sink or shielding of the board to which the connector

36、 or socket is mounted may be used. Verification testing should again be performed until the thermal profile is met. 4.4.3 Test specimen measurements and observations 4.4.3.1 Perform a visual inspection at 10X magnification plus any measurements specified in the referencing document. Table 3 Thermal

37、profiles Profile feature SnPb solder rework Pb-free solder rework Pre-heat and peak temperature ramp rate 3C per second maximum 3 C per second maximum Dwell at pre-heat 150 C 5 C for a minimum of 2 minutes 180 C 5 C for a minimum of 2 minutes Dwell at peak 175 C 5 C for a minimum of 60 seconds 205 C

38、 5 C for a minimum of 100 seconds Cool down ramp rate 6C per second maximum 6 C per second maximum NOTE All temperatures refer to the topside of the connector or socket, measured on the plastic housing surface. EIA-364-61A Page 8 Figure 1 Thermal profile 5 Details to be specified The following detai

39、ls shall be specified in the referencing document: 5.1 Type of flux, if required 5.2 Solder alloy, if required 5.3 Type of termination and test procedure 5.4 Test condition 5.5 Special preparation requirements for test specimens 5.6 Mounting board or substrate (if applicable) size and thickness, alo

40、ng with plated or unplated hole diameter 5.7 Component terminal diameter / size 5.8 Heat sinks or shielding devices, if applicable 5.9 Number of specimens tested 5.10 Failure criteria Temperature Time Cool down ramp rate Peak ramp rateDwell at preheat Preheat ramp rate Peak temperature - Preheat Tem

41、perature - Step 1 Step 2 Step 3 Step 4 Dwell at peak EIA-364-61A Page 9 6 Test documentation Documentation shall contain the details specified in clause 5, with any exceptions, and the following: 6.1 Title of test 6.2 Test specimen description 6.3 Test equipment used and date of last and next calibr

42、ation 6.4 Deviations to stated procedures 6.5 Heat sink or shielding used to attain the thermal profile 6.6 Measurements and observations with conclusions based on the failure criteria in the referencing document. 6.7 Name of operator and start/finish date(s) of test EIA-364-61A Page A-1 Annex A Nor

43、mative A.1 Other than visual observations and dimensional measurements, it is recommended that appropriate tests be considered to insure that internal damage has not been done to the connectors or sockets which would compromise their reliability. Such testing may involve the following attributes. Co

44、mponent torque Contact resistance Contact retention Dielectric withstanding voltage Insert retention Insulation resistance Mating and unmating capability ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical re

45、asons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-ma

46、il: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Ch

47、airman: Revision History Revision letter Project number Publication date Additions, changes and deletions - SP-5231 February 2013 Initially published as EIA 364-61 A SP-5320 Added wave solder to 1.1 Scope and 4.2 Procedure 2 Revised paragraph 2.1.2, 4.2.1.3, 4.2.2.2 and 4.2.2.3 Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.eciaonline.org