ECA EIA-364-70C-2014 TP-70C Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets.pdf

1、 EIA STANDARD TP-70C Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets EIA-364-70C (Revision of EIA-364-70B) July 2014 ANSI/EIA-364-70C-2014 Approved: July 4, 2014 EIA-364-70C NOTICE EIA Engineering Standards and Publications are designed to serve the public intere

2、st through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publicatio

3、ns shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standar

4、d is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever

5、 to parties adopting the Standard or Publication. This standard is based upon the major technical content of International Electrotechnical Commission standard 60512-5-1, Current-carrying Capacity Tests, 2002-02; and 60512-5-2, Current-carrying Capacity Tests, 2002-02. It conforms in all essential r

6、espects with this IEC standard. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicabili

7、ty of regulatory limitations before its use. (From Standards Proposal No. 5325, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Sockets Standards.) Published by Electronic Components Industry Association 2014 EIA Standards see 4.2. 1.2.2 Method 2, temperature ri

8、se versus current curve The object of this test is to establish a characteristic temperature rise versus current curve for the connector or socket: see 4.3. This curve may subsequently be used to create a derating curve as appropriate for the stated maximum operating temperature of the connector or

9、socket. 1.2.3 Method 3, specified temperature rise The object of this test is to determine the current level, that will not exceed a specified temperature rise; see 4.3. 2 Test resources 2.1 Equipment 2.1.1 Regulated power supply Capable of regulating current within 5% of the desired value. EIA-364-

10、70C Page 2 2.1.2 Ammeter, shunt or ohmmeter Capable of determining the current within 1% of the desired value. 2.1.3 Temperature measuring system Capable of indicating temperature to within 2 C. 2.1.3.1 Thermocouples In order to reduce heat sinking the cross sectional area of the thermocouple wire s

11、hall not exceed 50% of the cross sectional area of the contact(s) being measured. 2.1.3.2 Infrared temperature measurement, microscope or thermography The infrared system shall be suitable for the spatial resolution and temperature range of interest. 2.2 Test room or enclosure The specimens shall be

12、 placed in an enclosure or room that shields them from external movements of air. If an enclosure is used it shall be of non-reflective material, shall have a cover. The enclosure or room shall be of sufficient size to accommodate any test specimen spacing as described herein. 3 Test specimen 3.1 De

13、scription 3.1.1 Specimens terminated to conductors or cables The specimens shall be in free air suspension. If free air suspension is not possible, a thermally insulating material (e.g., wood, cardboard, polystyrene, etc.) shall be used as a support, provided that not more than 20% of the specimen s

14、urface is in contact with the insulating surface. Specimens shall be arranged in a horizontal attitude and shall meet the following requirements: 3.1.1.1 Specimens shall not be closer than 20 centimeters (8 inches) from the walls of the enclosure or room. 3.1.1.2 Specimens shall be no closer than 15

15、 centimeters (6 inches) from the top of the enclosure or room. 3.1.1.3 If free air suspension is used, the specimens shall be a minimum of 5 centimeters (2 inches) above the bottom of the room or enclosure. 3.1.1.4 See figure 1 for typical specimen mounting and wiring layout. EIA-364-70C Page 3 3.1.

16、2 Printed circuit board connectors 3.1.2.1 Specimens shall be tested mounted to test boards. The current input/output traces shall be capable of conducting the maximum current that is to be applied; see table 1. The traces shall be on the termination side of the test board, unless otherwise specifie

17、d in the referencing document. When traces are on both sides of the test board or multilayers, see note 2 in table 1. 3.1.2.2 An optional technique can be to direct attach the input/output conductors directly to the termination area of the contacts on the termination side of the test board. 3.1.2.3

18、It is not recommended to utilize the trace technique for test currents in excess of 13 amperes. Table 1 - Test board trace characterizations Trace width Trace length Equivalent AWG wire size Test current, amperes maximum cm in cm in 0.03 0.010 1.3 0.50 36 0.1 0.06 0.025 2.3 0.90 32 0.5 0.13 0.050 3.

19、0 1.20 28 1.5 0.19 0.075 3.8 1.50 26 2.0 0.25 0.100 4.3 1.70 24 3.0 0.64 0.250 6.9 2.70 20 7.5 1.27 0.500 9.4 3.70 16 13 NOTES 1. The above is based on 1.0 oz copper. 2. The table applies to single sided test boards. The values may be used as reference for multilayer or double-sided test boards that

20、 produce a temperature rise less than 30C. 3. Minimum length is a slight function of temperature rise criteria assumed that is 30C. For temperature rise criteria less than 30C, these values are conservative. 3.1.3 Input / output conductors 3.1.3.1 The input/output conductors shall be capable of cond

21、ucting the maximum current that is to be applied; see table 2. 3.1.3.2 To minimize and standardize heat-sinking conditions, the minimum conductor lengths specified in table 2 shall be used. EIA-364-70C Page 4 3.1.3.3 When multiple specimens are to be tested, the conductor lengths connecting the spec

22、imens shall comply with the minimum lengths as specified in table 2. Table 2 - Conductor characteristics Wire size Test current, amperes maximum Wire length, minimum AWG mm2 in2x 103cm in 36 0.013 .020 0.9 4 1.5 34 0.020 .031 1.2 5 2.0 32 0.03 .047 1.5 5 2.0 30 0.05 .078 2.0 8 3.0 28 0.08 .124 2.7 9

23、 3.5 26 0.13 .202 3.6 11 4.5 24 0.2 .310 4.8 14 5.5 22 0.3 .465 6.4 16 6.5 20 0.5 .775 8.5 20 8.0 18 0.8 1.240 11 25 10.0 16 1.3 2.015 15 29 11.5 14 2.0 3.100 20 36 14.0 12 3.0 4.650 27 42 16.5 10 5.0 7.750 35 50 19.5 8 8.0 9.200 47 57 22.5 6 13.0 20.150 63 67 26.5 4 21.0 32.550 84 79 31.0 2 34.0 52

24、.700 111 93 36.5 0 50.0 77.500 148 108 42.5 00 70.0 108.500 171 117 46.0 000 80.0 124.000 197 126 49.5 0000 120.0 184.550 227 136 53.5 3.1.4 Series circuit When more than one contact is to be energized, the following shall be adhered to in creating a series circuit. 3.1.4.1 For test specimens termin

25、ated to a conductor or cable, the conductor length or link shall be equal to that shown in table 2. Typical jumpering arrangements are shown in figures 2 and 3. 3.1.4.2 For test specimens terminated (soldered) to printed circuit boards, the jumper or links length shall be equal to the spacing betwee

26、n the contacts to be energized. The jumper or links shall be equivalent to the conductor size (cross-sectional area) that is to carry the maximum test current to be used; see table 2. Typical jumpering arrangements are shown in figures 2 and 4. 3.1.4.2.1 An alternative to the jumper technique for te

27、st specimens soldered to printed circuit boards, is to create a series circuit by interconnecting the positions by use of traces. Trace widths shall comply with 3.1.2.1, see table 1. EIA-364-70C Page 5 3.1.4.2.2 The technique for compliant terminations shall be the same as indicated in 3.1.4.2.1. So

28、ldering in the termination area or on the pin shall not be allowed. 3.1.4.3 An alternative to 3.1.4.2 is to terminate conductors to the contact terminations. The conductor length or link shall be equal to that shown in table 2. 3.2 Preparation 3.2.1 Temperature measuring techniques 3.2.1.1 Thermocou

29、ple temperature measuring techniques 3.2.1.1.1 Thermocouples that are attached to metallic surfaces of current-carrying contacts shall be oriented with the bimetal junction perpendicular to the direction of current flow to prevent errors caused by voltage gradients when using direct current; see fig

30、ure 5. 3.2.1.1.2 Temperature probes shall be attached to the specimens by any means that: makes intimate thermal contact with the specimen when required or located in air within contact system; does not alter the physical characteristics of the specimen; does not cause significant heat sinking of th

31、e specimen; does not physically disturb natural position orientation and/or operation of the contact system. 3.2.1.1.3 Temperature probes shall be attached to lead-in connecting wires in each specimen chain approximately 12.5 centimeters (5 inches) from the input connection to the test specimen or f

32、irst specimen in the chain. Conductor temperature shall be measured by embedding a thermocouple in a slit cut longitudinally in the wire insulation, with the thermocouple junction contacting the conductor. Care shall be taken to ensure that conductor strands are not nicked. The insulation may be sec

33、ured by a few wraps of fine cotton thread or equivalent. 3.2.1.1.4 When a thermocouple or temperature probe is inserted into a contact cavity through the housing wall, the hole shall be sealed with duck seal or other equivalent means. 3.2.2 Thermography temperature measuring techniques 3.2.2.1 Therm

34、ographic measurements may be performed when the contact is in direct line of sight. 3.2.2.2 Due to the complexity of this type of measurement, specific procedures necessary to ensure consistent results may vary depending on the characteristics of the test specimens. The procedures listed below are a

35、 general in nature. Additional procedures may be specified by the requesting organization as appropriate for the test specimen. EIA-364-70C Page 6 3.2.3 Ambient temperature measurement point The ambient temperature shall be measured in the approximate horizontal plane adjacent to the middle of the t

36、est specimen or chain being tested. The thermocouple shall be placed a minimum of 15 centimeters (6 inches) from the closest specimen. The thermocouple shall be placed in an unpowered test specimen or open air and shall be shielded from any heating affects or air movement. See figure 6 for a typical

37、 radiation shield that may be employed. 4 Test procedure 4.1 General 4.1.1 Test conditions The test shall be performed in at least one of the following conditions indicated in table 3: Table 3 - Test conditions Test condition Description 1 Contacts in housing, single contact energized 2 Contacts in

38、housing, multiple contacts energized 3 Contacts in housing, 100% of the contacts energized 4 Contacts in free air 5 As specified in the referencing document 4.1.1.1 Unless otherwise specified, test condition 1 shall be used. 4.1.1.2 The number of contacts to be energized for test condition 2 and the

39、ir location within the specimen shall be specified in the referencing document. 4.1.2 Current measurement The specimen or chain shall be connected to a regulated power supply through a voltmeter, ammeter or shunt using wires of suitable cross-section. Loading current may be ac or dc. When alternatin

40、g current is used, the rms value applies. 4.1.3 Temperature measurement (via thermocouple technique) When direct current is used, the specimen chain shall be energized in both forward and reversed-current modes to check for cross-junction thermocouple errors. If thermocouple readings are found to di

41、ffer by more than 1 C (1.8 F) for equal forward and reversed-current, one of the following steps shall be taken: Use alternating current; Reattach thermocouple in error; Use forward and reverse current at each increment and average thermocouple readings. EIA-364-70C Page 7 4.1.3.1 Thermal stability

42、Maintain current until thermal stability is achieved on all specimens. Thermal stability shall be achieved when the temperature rise of a minimum of three consecutive readings taken at 5 minute intervals minimum does not differ by more than 1C (1.8F) for each thermocouple being used for monitoring.

43、Thermal stability applies to all current applications for all test methods described herein. 4.1.4 Discrete wiring applications For discrete wiring applications when a wire bundle is part of the test specimen, an additional thermocouple shall be located in the middle of the bundle within 2.54 centim

44、eters (1.0 inch) of where the conductors exit the connector housing, and the temperature measured and recorded. 4.2 Method 1, specified current 4.2.1 The test specimen(s) shall be energized at the current level specified in the detail specification until thermal stability is achieved. 4.2.2 The spec

45、imen temperature, input wire temperature if specified and ambient temperature shall be measured and recorded. 4.3 Method 2, temperature rise versus current curve 4.3.1 Energize test specimen(s) with a test current to produce approximately 5 C to 10 C temperature rise (stabilized condition). 4.3.2 Me

46、asure and record specimen temperature, ambient temperature and test current. If specified, measure and record lead-in wire, wire bundle, and/or printed circuit board trace temperatures. 4.3.3 Repeat 4.3.1 at a minimum of 4 consecutively increasing current levels with each additional level generating

47、 an additional temperature rise (minimum) of 10C above that previously recorded. The highest test current level used shall not exceed the temperature rating of the connector. 4.4 Method 3, specified temperature rise 4.4.1 The test specimen(s) shall be energized to generate a temperature rise equal t

48、o approximately 30% of the specified requirement. 4.4.2 The current shall then be increased in gradual increments and the temperature rise shall be measured and recorded along with the corresponding current after stabilization has been achieved. EIA-364-70C Page 8 4.4.3 Incremental increases shall b

49、e repeated until the specified temperature rise has been achieved or exceeded. 4.4.4 If the specified temperature rise is exceeded, the next lowest current level that did not exceed the specified requirement shall be considered as the maximum current that can be used. 4.4.5 When multiple test specimens are involved, the test shall be terminated when any one of the specimens exceeds the specified requirement, and 4.4.4 shall apply. 5 Details to be specified The following details shall be specified in the referencing document: 5.1 Specimen preparation 5.2 Type an