1、 EIA STANDARD TP-71C Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets EIA-364-71C (Revision of EIA-364-71B) May 2008 ANSI/EIA-364-71C-2008(R2014) Approved: May 22, 2008 Reaffirmed: August 28, 2014 EIA-364-71C NOTICE EIA Engineering Standards and Publication
2、s are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. E
3、xistence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those oth
4、er than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, n
5、or does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between th
6、e EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determin
7、e the applicability of regulatory limitations before its use. (From Standards Proposal No. 5148, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Socket Standards and reaffirmed per Standards Proposal No. 5326.04). Published by Electronic Components Industry Asso
8、ciation 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into
9、a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-397-7956) ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health o
10、r technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.:
11、 FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org
copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1