ECA EIA-448-19A-2000 Test Standard for Electromechanical Components - Environmental Effects of Machine Soldering Using a Vapor Phase System.pdf

1、EIASTANDARDTest Standard for ElectromechanicalComponents Environmental Effectsof Machine Soldering Using A VaporPhase SystemEIA-448-19A(Revision of EIA-448-19)OCTOBER 2000ELECTRONIC COMPONENTS, ASSEMBLIES & MATERIALSASSOCIATIONTHE ELECTRONIC COMPONENT SECTOR OF THE ELECTRONIC INDUSTRIES ALLIANCEEIA-

2、448-19AANSI/EIA-448-19A-2000Approved: October 25, 2000NOTICEEIA Engineering Standards and Publications are designed to serve the public interest througheliminating misunderstandings between manufacturers and purchasers, facilitatinginterchangeability and improvement of products, and assisting the pu

3、rchaser in selecting andobtaining with minimum delay the proper product for his particular need. Existence of suchStandards and Publications shall not in any respect preclude any member or nonmember of EIAfrom manufacturing or selling products not conforming to such Standards and Publications, norsh

4、all the existence of such Standards and Publications preclude their voluntary use by those otherthan EIA members, whether the standard is to be used either domestically or internationally.Standards and Publications are adopted by EIA in accordance with the American NationalStandards Institute (ANSI)

5、 patent policy. By such action, EIA does not assume any liability toany patent owner, nor does it assume any obligation whatever to parties adopting the Standard orPublication.This EIA Standard is considered to have International Standardization implication, but theInternational Electrotechnical Com

6、mission activity has not progressed to the point where avalid comparison between the EIA Standard and the IEC document can be made.This Standard does not purport to address all safety problems associated with its use or allapplicable regulatory requirements. It is the responsibility of the user of t

7、his Standard toestablish appropriate safety and health practices and to determine the applicability of regulatorylimitations before its use.(From Standards Proposal No. 4673, formulated under the cognizance of the P-13 Committee onSwitches & Interrupting Devices.)Published byELECTRONIC INDUSTRIES AL

8、LIANCE 2000Technology Strategy & Standards Department2500 Wilson BoulevardArlington, VA 22201PRICE: Please refer to the currentCatalog of EIA Electronic Industries Alliance Standards and Engineering Publicationsor call Global Engineering Documents, USA and Canada (1-800-854-7179)International (303-3

9、97-7956)All rights reservedPrinted in U.S.A.PLEASE!DON”T VIOLATETHELAW!This document is copyrighted by the EIA and may not be reproduced withoutpermission.Organizations may obtain permission to reproduce a limited number of copiesthrough entering into a license agreement. For information, contact:Gl

10、obal Engineering Documents15 Inverness Way EastEnglewood, CO 80112-5704 or callU.S.A. and Canada 1-800-854-7179, International (303) 397-7956EIA-448-19APage 1METHOD 19TEST STANDARD FOR ELECTROMECHANICAL COMPONENTSENVIRONMENTAL EFFECTS OF MACHINE SOLDERINGUSING A VAPOR PHASE SYSTEM(From EIA Standards

11、 Proposal No. 4673, formulated under the cognizanceof the P-13 Committee on Switches & Interrupting Devices.)1. PURPOSEThe purpose of this standard is to evaluate electromechanicalsurface mountable components that have been subjected to theenvironmental effects of machine soldering using the batch t

12、ypevapor phase system (that is considered to be more severe than anin-line system) and for use with solder alloys in a rangesuitable for use in a 215 degree C vapor.This standard shall not be construed as a production procedure inmachine soldering operations.The solderability determination is made o

13、n the basis of aneffective bond between the component terminals and the printedwiring board.The acceptable performance of a component subjected to this testis determined by visual examination and those tests specified tobe performed upon completion of the test.This test deals with vapor soldering an

14、d cleaning operationsonly, and does not consider additional factors in the assembly ofsurface mounted devices such as oven drying of soldering pastes.2. DEFINITIONS2.1 SOLDERABILITY The property of a metal surface to bereadily wetted by molten solder.2.2 FLUXING The preconditioning of a metal surfac

15、e prior to thesoldering operation utilizing activated flux.2.3 PREHEATING The elevating of the printed wiring boardtemperature prior to soldering.2.4 CLEANING The removal of flux and other residue from theprinted wiring board assembly using chemical and/or aqueoussolvent systems.3. EQUIPMENT3.1 A va

16、por phase soldering system of the batch type withprovisions for adjustment so that the time/temperatureprofile is within the shaded area of Figure 1. Use of an in-line system is acceptable provided the time/temperatureprofile agrees with Figure 1.EIA-448-19APage 23.2 Optional Equipment None, because

17、 it is unlikely that theenvironment of a vapor phase system can be simulatedwithout, in effect, duplicating the system.EIA-448-19APage 34. MATERIALS4.1 Printed Wiring Board4.1.1 Printed Wiring Board Material G10 epoxy glass or FR-4base material with 1 oz Copper, or any otherappropriate material that

18、 is thermally compliant withthe component.4.1.2 Physical Size and Configuration The physical size andconfiguration shall be of good design and layout suchthat a reasonable number of samples can be solderedin a pass through the machine. Land and trace designshall facilitate the making of any specifie

19、d post-testmeasurements.4.1.3 Land Size The attachment lands shall have a minimumwidth equal to that of the component terminals and aminimum length which is 0.015” greater than that of thecomponent terminals.4.1.4 Land Finish The land finish shall be of fusedtin-lead, or an oxide-resistant coating o

20、f adequatethickness such that it is readily solderable. Solderquantity shall be sufficient to provide good bondcharacteristics after reflow, but not excessive so asto be detrimental to effective bonding.4.1.5 Printed Wiring Board Preparations The printed wiringBoard shall be prepared in such a manne

21、r as to ensureA clean and readily solderable surface at the time theTest is performed. Solder pastes or other fluxing meansShall be dried adequately after mounting of components.5. TEST CONDITIONSThe test conditions for soldering shall be within the profile ofFigure 1.Test conditions for cleaning sh

22、all be specified as one or more ofthe following options:A. ImmersionB. SprayC. Vapor and Spray6.TEST PROCEDUREUnless otherwise specified, parts shall be checked in an “asreceived” condition from the supplier, and care shall beexercised to prevent contamination of the surfaces to be testedby grease,

23、perspiration, etc. Under all soldering testconditions, it is assumed that a clean, fully solderable testboard is used.EIA-448-19APage 46.1 COMPONENT MOUNTING Components shall be mounted in theirNormal manner. More than one and/or different styles oftest components may be mounted to a single printed

24、wiringboard.6.2 FLUXING Fluxing, if used, shall be in place as a resultOf component mounting. Flux shall be R, or RMA inaccordance with MIL-F-14256.6.3 PREHEATING Preheating shall be within the profile ofFigure 1.6.4 SOLDERING The test samples, suitably mounted to aPrinted wiring board, shall be run

25、 through a cycle of avapor phase soldering machine having a time/temperatureprofile within the envelope of Figure 1.6.5 CLEANING The specified method(s) of cleaning shall beApplied to the component/printed wiring board assemblyusing all of the following cleaning solutions (one at atime):A. A terpene

26、 defluxer consisting of a minimum of 90%d-limonene and 10% surfactant.B. This solution has been deleted. When a suitableReplacement solvent has been determined, it will beadded as solution B.C. Isopropyl AlcoholD. Deionized water/detergent1. 90% deionized water, 10% alkaline detergent(45% butyl cell

27、osolve, 45% monoethanolamine,10% water) by volume.2. Deionized water rinse.Cleaning shall be done in a manner so as to remove allvisible flux and other soldering residue from thecomponent and the printed wiring board. One test boardassembly per cleaning solution and cleaning method shallbe used. Cle

28、aning shall be accomplished within one hourafter soldering.7. EVALUATIONAfter the test solder joints shall be visually examined under 10Xmagnification for wetting and adherence, good solder blends andmetallic continuity. Defective areas shall not constitute morethan 10% of the area of any individual

29、 connection. Solderabilityexamination shall be limited to those areas affecting thecomponent under test.The component shall not exhibit loose or deformed parts, and itshall meet all operating characteristics as defined in the detailspecification.EIA-448-19APage 5Additional evaluations shall be perfo

30、rmed as prescribed in thedetail specification.8. The following details shall be specified in the detailSpecification:8.1 NUMBER OF TEST SAMPLES as specified in the detailspecification.8.2 CLEANING Method A, B, and/or C (immersion, spray,vapor and spray) must be specified. All four solutionsmust be u

31、sed in each method, unless otherwise specified.8.3 EVALUATION MEANS OR CRITERIA as specified in thedetail specification.8.4 AGING Special environmental conditions which maydeteriorate the solderability of components shall beconsidered and specified as required.NOTESThe use of certain materials liste

32、d in this standard, such as leadcontained in solder are, or may be, controlled or regulated throughactions of OSHA or EPA. This standard does not contain details orrequirements of such regulation or control.EIA Document Improvement ProposalIf in the review or use of this document, a potential change

33、 is made evident for safety, health or technicalreasons, please fill in the appropriate information below and mail or FAX to:Electronic Industries AllianceEngineering Department Publications Office2500 Wilson Blvd.Arlington, VA 22201FAX: (703) 907-7501Document No. Document Title:Submitters Name: Tel

34、ephone No.:FAX No.:e-mail:Address:Urgency of Change:Immediate: At next revision:Problem Area:a. Clause Number and/or Drawing:b. Recommended Changes:c. Reason/Rationale for Recommendation:Additional Remarks:Signature: Date:FOR EIA USE ONLYResponsible Committee:Chairman:Date comments forwarded to Committee Chairman: