ECA EIA-481-E-2015 8 mm Through 200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling.pdf

1、 EIA STANDARD 8 mm Through 200 mm Embossed Carrier Taping and 8 mm however in absence of Termination 1 definition, the following features can be used: fiducial mark, chamfered edge, dimple, notch, wider termination, etc. If the orienting feature is located in the exact center of the component, or it

2、 lies on the shorter axis of the component, then an alternate orienting feature on the component should be chosen. (d) A component is considered square if the bounding rectangle around the outer extents of the component (including body and terminations) contains edges with a difference no greater th

3、an 0.3mm between the nominal length and width. (e) The tape pocket quadrant designations that describe the taped orientation of components are shown in Figure 1. (f) For existing Component Packages use Figure 2 “Orientation Guide for Commonly Used Devices”. (g) If a package type is not contained in

4、Figure 2, use the rules in the sequence shown in the following flow chart (Figure 3) to determine the correct orientation of the component in the tape pocket. EIA-481-E Page 5 Left intentionally blank. EIA-481-E Page 6 Figure 1 - Component orientation and quadrant designationsRound sprocket holesCom

5、ponentElongated sprocket holes(32 mm tape and wider)Round sprocket holesQuadrant designations:1 = upper left2 = upper right3 = lower left4 = lower rightElongated sprocket holes(32 mm tape and wider)User directionof unreelingAoBo1 23 4User directionof unreelingEIA-481-E Page 7 Figure 2 Orientation Gu

6、ide for Commonly Used Devices USER DIRECTION OF UNREELING Component Package SOT23 SOT223 SOT143 SOT89 SOT343 Orientation in carrier Termination 1 Orientation by Quadrant 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 Component PackageSOT23-5 / SC70-5 / SSOP-5SOT23-6 / SC70-6 / SSOT-6TO-89 DPAK / D2PAK / TO

7、-252 / TO-220D2PAK-5P / TO-263-5 Orientation in carrier Termination 1 Orientation by Quadrant 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 Component Package QFP (square geometry) TSOP PLCC SOIC DIP Orientation in carrier Termination 1 Orientation by Quadrant 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 Compon

8、ent Package QFN (Square geometry) QFN (Rectangular geometry)BGA (Square geometry)BGA (Rectangular geometry)LCC Orientation in carrier Termination 1 Orientation by Quadrant 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 Component Package SSOP / TSSOP / MSOP Ultra Thin SO8 (US8) Tantalum Capacitor DIODE / LE

9、D Connectors (square or rectangular) Orientation in carrier Termination 1 Orientation by Quadrant 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 EIA-481-E Page 8 Figure 3 - Rules for determining orientation of component in tape pocket (1 of 2) Yes To Next PageNo N NoYes Is the outline of the component squa

10、re? Does one edge contain the most terminations? Place component with its long axis perpendicular to tape length and with the edge containing the most leads in Quadrants 1 and 3. If orientation in Quadrants 1 and 3 is not possible, place the edge containing the most leads near the round sprocket hol

11、es. Examples Place component with its long axis perpendicular to tape length and with its orienting feature near the round sprocket holes. Examples Start EIA-481-E Page 9 Figure 3 - Rules for determining orientation of component in tape pocket (2 of 2) From Previous Page No Yes NoYesDoes one edge co

12、ntain the most terminations? Place component with the edge containing most terminations in Quadrants 1 and 3. Examples Place component with the edge associated with the orienting feature near the round sprocket holes.ExamplesIs the orienting feature close to or associated with only one edge?Place co

13、mponent with its orienting feature in Quadrant 1. ExampleEIA-481-E Page 10 Figure 4 - 8 mm if used, dimensions B and D shall apply.N(Hub diameter,see Note 2, Tables 1, 2 & 3)A(Hub diameter,see Note 2,Tables 1, 2 & 3)W1 (Measured at hub)W2 (Measured at hub)W3 (Includesflange distortionat outer edge)R

14、eel With Drive HoleReel Without Drive HoleNC(Arbor HoleDiameter)Optional Access Hole( 40 mm min.)R28.5525.49.57.6DriveHoleEIA-481-E Page 21 Table 4 - Reel dimensions See Section 4.0 for requirements (all dimensions in millimeters) Constant Dimensions Reels Without Drive Hole Reels With Drive Hole Ta

15、pe Size A Max. B Min. C D Min. B C Max. D 8 mm to 200 mm 609 1.5 13.0+0.5-0.220.2 Not Applicable29.2 Not ApplicableVariable Dimensions Tape Size (mm) N Min. See Note 2, Tables 1-3 W1W2 Max for A 360 mm See Note 1 W2 Max for A 360 and 609 mm See Note 2 W38 40 8.4 +1.5/-0.0 14.4 14.4 Shall Accommodate

16、 Tape Width Without Interference 12 50 12.4 +2.0/-0.0 18.4 18.4 16 16.4 +2.0/-0.0 22.4 29.0 24 24.4 +2.0/-0.0 30.4 37.0 32 See Note 3 32.4 +2.0/-0.0 38.4 45.0 44 44.4 +2.0/-0.0 50.4 57.0 56 56.4 +2.0/-0.0 62.4 69.0 72 72.4 Min. 89.0 88 88.4 Min. 105.0 104 104.4 Min. 121.0 120 120.4 Min. 137.0 136 13

17、6.4 Min. 153.0 152 152.4 Min. 169.0 168 168.4 Min. 185.0 184 184.4 Min. 201.0 200 200.4 Min. 217.0 Notes 1 For reels less than 360 mm diameter (A), the most widely used reel diameters are 178 mm 2 mm and 330 mm 2 mm. Reel diameters ranging from 254 mm to 292 mm also exist. Commonly used hub diameter

18、s are 80, 100, 150, and 178 mm. 2 For reels greater than or equal to 360 mm diameter (A), various sizes exist with the most widely used being 381 mm 2 mm, 482 mm 2 mm and 558 mm 2 mm. Hub diameters vary widely, up to 254 mm. 3 Tape with components must wrap around hub without damage. EIA-481-E Page

19、22 Acknowledgements The following team members were part of the Automated Component Handling Committee and contributed to the realization of the latest document revision: James Adams (3M) Bill Aldeen (Nu-Way Electronics) Ken Ball (Knowledge Based Technical Consultancy Ltd.) Joseph Biernacki (Stackpo

20、le Electronics) Ed Bishop (Tayloreel) Christine Blair (STMicroelectronics) Ray Bloom (Advantek) Michael Cannon (TDK Corporation of America) Scott Carter (Tek Pak)Chair Jaron Christoph (Rockwell Collins) Albert Escusa (Texas Instruments) Darin Glenn (Vishay) Charles Gutentag (Tempo Electronics) Willi

21、am Hall (Tayloreel) Steven Kummerl (Texas Instruments) Doug Laven (SCC) Alok Lohia (Texas Instruments) Lanney McHarque (Murata Electronics) Henry Sipes (Samtec, Inc.) Scott Wischoffer (Fuji America) EIA-481-E Page 23 Addendum Complementary Taping Standards: EIA-726 8 mm Punched & Embossed Carrier Ta

22、ping of Surface Mount Components for Automatic Handling of Devices Smaller Than 2.0 mm x 1.2 mm EIA-747 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick EIA-763 Bare Die and Chi

23、p Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling Other Reference Documents: ESD TR20.20 ESD Association Standard - ESD Handbook ESD ADV1.0 ESD Association Glossary Glossary of Terms SEMI E78 Semiconductor Equipment and Materials International Standard Electrostatic Compatib

24、ility Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment Recommendation: For waste minimization purposes it is recommended that the industry modify its methods and equipment so that the minimum leader dimension can be eventually reduced from 40

25、0 mm to 320 mm and that the minimum trailer dimension be reduced from 160 mm to 80 mm. ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or

26、 FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Proble

27、m Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org