ECA EIA-654-2000 Resistance to Soldering Heat Test Procedure for Wire and Electrical Components.pdf

1、ANSIIEIA-654-2000 Approved: August 16,2000 EIA STANDARD Resistance to Soldering Heat Test Procedure for Wire and Electrical Components EIA-654 AUGUST 2000 ELECTRONIC COMPONENTS, ASSEMBLIES & MATERIALS ASSOCIATION THE ELECTRONIC COMPONENT SECTOR OF THE ELECTRONIC INDUSTRIES ALLIANCE NOTICE EL4 Engine

2、ering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper pro

3、duct for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EL4 fiom manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude th

4、eir voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EL4 does not assume any liabi

5、lity to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a

6、valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and healt

7、h practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 2272-C, formulated under the cognizance of the Soldering Technology Committee (STC).) Published by ELECTRONIC INDUSTRIES ALLIANCE 2000 Technology Strategy & Standards Department 2500

8、 Wilson Boulevard Arlington, VA 2220 1 PRICE: Please refer to the current Catalog of EIA Electronic Industries Alliance Standards and Engineering Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) All rights reserved Printed in U.S.A. Page

9、 Foreword iii Clause 1 2 3 4 5 6 7 Annex A Table 1 Figure 1 Purpose Apparatus Materials Test procedures Examination and measurement Details to be specified Documentation IRR equipment Solder test procedures Placement of wire leads 7 8 9 i Foreword The Soldering Technology Committee (STC) of the Elec

10、tronic Components, Assemblies & Materials Association, the electronic component sector of Electronic Industries Alliance prepared this specification. iv EIA-654 Page 1 1 Purpose These tests are performed to determine whether wire and other component parts can withstand the effects of the heating and

11、/or environment to which they will be subjected during the soldering of their terminations by soldering iron, solder dip, solder wave, or other soldering techniques. The solder dip method is used as a reasonably close simulation of conditions encountered in wave soldering in regard to radiated and c

12、onducted heat. The heat and/or environment of soldering may affect the parametric and/or physical characteristics of the component part. 2 Apparatus 2.1 Solder pot A static solder pot, of sufficient size to accommodate the mounting board and to immerse the termination to the depth specified for the

13、solder dip without touching the bottom of the pot, shall be used. This apparatus shall be capable of maintaining the solder at the temperature specified. The solder bath temperature shall be measured in the center of the pot at a depth of at least 12.7 mm (0.50 in), but no deeper then 25.4 mm (1 .O0

14、 in) below the surface of the solder. The solder shall be dedrossed immediately before each test. 2.2 Heat sinks or shielding The use of heat sinks or shielding is prohibited except when it is part of the component. When applicable, heat sinks or shielding shall be specified in the Detail Specificat

15、ion, including all of the details such as materials, dimensions, method of attachment, and location of the necessary protection. 2.3 Fixtures Fixtures, when required, shall be made of a nonsolderable material designed in such a way that they will make minimum contact (e.g., minimum heat sink) with t

16、he component. Further, they shall not place undue stress on the component when fixtured. 2.4 Mounting board A mounting board, in accordance with IPC-4101, IPC-4110, IPC-4130, or MlL-I-24768/2 and /3, Insulation, plastic, laminated, thermosetting, glass-cloth, epoxy-resin (e.g., 3 x 3, 1 x 9, etc.) m

17、inimum area, (1 57 f 0.19) mm (0.062 f 0.007) in thick, shall be used unless otherwise specified. For through-hole applications the terminal hole size shall be such that diametrical clearance between the hole and component terminals shall not exceed 0.38 mm (0.015 in) unless otherwise specified. In

18、the event plated- through holes are specified in the detail specification, said holes shall be in accordance with IPC-6012, MIL-P-55110, or equivalent. Surface mount boards shall have pads of sufficient size and number to accommodate the component being tested per latest revision of IPC-SM-782/EIA P

19、DP-100. In lieu of a mounting board, a ceramic substrate, e.g., 0.89 mm (0.035 in) thick may be used. 2.5 Solder iron A solder iron rated for 25 watts and capable of maintaining a temperature of (350 f IO) OC shall be used. E IA-654 Page 2 2.6 Reflow chambers The reflow chambers or equivalent vapor

20、phase reflow (VPR) chamber, infrared/convection reflow (IRR) oven, air circulating oven, etc. shall be of sufficient size to accommodate the components to be evaluated. They shall be capable of generating the specified heating rate, temperatures and environments. See annex A. 2.7 Temperature measure

21、ment Low-mass thermocouples that do not affect the heating rate of the sample shall be used. A temperature- recording device is advisable. The equipment shall be capable of maintaining an accuracy of f 1 OC at the temperature range of interest. 3 Materials 3.1 Solder Unless otherwise specified, the

22、solder or solder paste shall be a tin-lead alloy with a nominal tin content of 50 % to 70 % per ANSI J/STD-005, -006. Other solders can be used so long as they are molten at the specified temperature and are designated in the Detail Specification. 3.2 Flux If used, the type of flux to be applied sha

23、ll be specified in the Detail Specification. 3.3 VPR fluid A perfluorocarbon fluid that has a boiling point of 215 OC -265 OC shall be used. 4 Test procedures 4.1 Procedures The test technique and category shall be selected based on the component type and application (application shall be agreed upo

24、n between vender and user), unless specifically stated in the Detail Specification. There are six types of solder techniques covered by these procedures. The procedures are outlined in table 1. 1) Solder iron-solder cup, hand soldering, through-hole components, tab and post terminations, solder eyel

25、et terminations 2) Solder dip-practice of hot solder dipping (tinning) of leaded components 3) Wave solder simulation-topside board mount product 4) Wave solder simulation-bottomside board mount product 5) VPR-VPR environment without preheat 6) IRR-I RR, natural convection and forced air convection

26、reflow environments EIA-654 Page 3 4.1.1 Technique 1: solder iron a) When testing a solder cup, tab and post termination or solder eyelet termination, the applicable wire size properly prepared for the solder termination shall be attached in the appropriate manner. When testing a board mount compone

27、nt, the component shall be placed in a suitable board per 2.4 b) If flux is to be used, the test assemblies shall be fluxed per 3.2 c) A solder iron per 2.5 shall be used. When required, due to the termination size being evaluated, the appropriate solder iron wattage shall be specified in the Detail

28、 Specification. d) The soldering iron shall be heated to a temperature of (350 f IO) OC and shall be applied to the termination for a time duration of 4 s-5 s after the solder has become molten. See test category A in table 1. For surface mount components the iron shall be placed only on the circuit

29、 board pad. e) The solder iron and solder shall be applied to the area of the assembly designated in the Detail Specification. In the absence of such a designation the solder and iron shall be applied to the area of the assembly closest to the component body that the product is likely to experience.

30、 f) Remove the iron and allow the specimens to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examined per clause 5. 4.1.2 Technique 2: solder dip a) Place specimen in appropriate fi

31、xture per 2.3 b) Special preparation of specimen: Any special preparation of specimens prior to testing shall be as specified in the Detail Specification. This could include specific instructions such as bending or any other relocation of terminations, cleaning or attachment of heat sinks prior to t

32、he solder dip. c) If flux is to be used, the leads shall be fluxed per 3.2 d) Test category B in table 1, detailing time, temperature and immersion speed, shall be used unless otherwise designated in the Detail Specification. e) The terminations shall be immersed to the depth designated by the Detai

33、l Specification. They shall remain immersed for the time specified in 4.1.2d. In the absence of such a designation the terminations shall be immersed to within 1.27 mm (0.050 in) of the component body. Terminations shall be immersed simultaneously, if the geometry of the component permits. f) After

34、the dip, the specimens shall be allowed to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examined per clause 5. E IA-654 Page 4 4.1.3 Technique 3: wave solder simulation - topside b

35、oard mount product a) The test specimens shall be mounted on a printed circuit board (PCB) with terminals seated in the termination holes as specified in the Detailed Specification. The PCB shall be as described in 2.4. - Wire leads: Wire leads shall be brought through the board holes and bent at le

36、ast 30“ from a line perpendicular to the board. Leads shall extend from 1.27 mm to 2.54 mm (0.050 in to 0.100 in) from the bottom of the board. Axial leads shall be bent at a 90“ angle at a point between 1.5 mm-2.0 mm (0.06 in-0.08 in) from the body, eyelet fillet or welds unless otherwise specified

37、 as shown in figure 1. - Pin leads: where the component is designed with rigid pin leads, the full length of the termination shall be retained. b) Special preparation of specimen: Any special preparation of specimens prior to testing shall be as specified in the Detail Specification. This could incl

38、ude specific instructions such as bending or any other relocation of terminations, cleaning or attachment of heat sinks prior to the solder immersion. c) If flux is to be used, the leads shall be fluxed per 3.2 d) Test category C in table 1, detailing time, temperature, and immersion speed, shall be

39、 used unless otherwise designated in the Detail Specification. e) The test specimens mounted on the PCB shall be immersed in the solder pot so that the bottom of the board “floats“ on the solder. They shall remain immersed for the time specified in 4.1.3d. f) After the float, the specimens shall be

40、allowed to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examined per clause 5. 4.1.4 Technique 4: wave solder simulation - bottomside board mount product a) Place specimen in appro

41、priate sample fixture per 2.3. b) Special preparation of specimen: Any special preparation of specimens prior to testing shall be as specified in the Detail Specification. This could include specific instructions such as bending or any other relocation of terminations, cleaning or attachment of heat

42、 sinks prior to the solder dip. c) If flux is to be used, the leads shall be fluxed per 3.2. d) Test category D in table 1, detailing time, temperature, preheatinghate temperature and immersion rate, shall be used unless otherwise designated in the Detail Specification e) The test specimen shall be

43、preheated and fully immersed in the solder bath per 4.1.4d. f) After the immersion, the specimens shall be allowed to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examined per clau

44、se 5. 4.1.5 Technique 5: VPR soldering EIA-654 Page 5 a) Test specimens shall be placed on a ceramic plate or mounted on a PCB as described in 2.4. In the case of through hole product the terminals shall be inserted into the termination holes. Surface mount samples shall be placed on top of the boar

45、d. b) Special preparation of specimens: Any special preparation of specimens prior to testing shall be as specified in the Detail Specification. This could include specific instructions such as bending or any other relocation of terminations, attachment of heat sinks, use of board retention features

46、, precleaning, pretinning or the addition and type of solder paste to be placed on the assembly. c) A test chamber (e.g., vapor phase reflow machine, beaker, etc.) as specified in 2.6 shall be used which is large enough to suspend the test assembly without touching the sides or solution. Unless othe

47、rwise specified, a perfluorocarbon organic solution whose boiling point is 215 OC - 265 OC shall be placed in the test chamber and shall be heated until it is boiling. The solution shall be allowed to boil for five minutes prior to suspending the test assembly. d) Test category E in table 1, detaili

48、ng time and temperature shall be used unless otherwise designated in the Detail Specification. e) After equalization the test assembly shall be suspended into the vapor in a horizontal plane. If a preheat is specified the sample shall be preheated and then placed into the equilibrated chamber. In ei

49、ther case the assembly shall not touch the solution. f) After the heat cycle, the specimens shall be allowed to cool and stabilize at room ambient conditions. If a solder paste was used the specimen shall be cleaned using an appropriate solution. g) The test specimens shall be examined per clause 5. 4.1.6 Technique 6: IRR soldering a) Test specimens shall be placed on a ceramic plate or mounted as described in 2.4. In the case of through-hole product the terminals shall be inserted into the termination holes. Surface mount samples shall be placed on top of the board. b) Special preparatio