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本文(ECA EIA-717-A-2010 SURFACE MOUNT NIOBIUM AND TANTALUM CAPACITOR QUALIFICATION SPECIFICATION《表面安装铌电容器和钽质电容器鉴定规范》.pdf)为本站会员(赵齐羽)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ECA EIA-717-A-2010 SURFACE MOUNT NIOBIUM AND TANTALUM CAPACITOR QUALIFICATION SPECIFICATION《表面安装铌电容器和钽质电容器鉴定规范》.pdf

1、 EIA STANDARD SURFACE MOUNT NIOBIUM ANDTANTALUM CAPACITORQUALIFICATION SPECIFICATION EIA-717-A (Revision of EIA-717) JUNE 2010 EIA Standards Electronic Components Association ANSI/EIA-717-A-2010 Approved: June 24, 2010 EIA-717-A NOTICE EIA Engineering Standards and Publications are designed to serve

2、 the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standa

3、rds and Publications shall not in any respect preclude any member or nonmember of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whe

4、ther the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to any patent owner, nor does it assume any oblig

5、ation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC

6、document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regu

7、latory limitations before its use. (From Standards Proposal No. 5097 formulated under the cognizance of the P-2.5 Committee on Solid Electrolytic Capacitors) Published by: ELECTRONIC COMPONENTS ASSOCIATION 2010 EIA Standards and Technology Department 2500 Wilson Boulevard Suite 310 Arlington, VA 222

8、01 PRICE: Please call: Global Engineering Documents, USA and Canada (1-800-854-7179) http:/ All rights reserved Printed in U.S.A. EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 1 PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the EIA and may n

9、ot be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-800-854-7179), I

10、nternational (303-397-7956) EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 2 PageForeword iiiClause 1 Scope 11.1 Description 11.2 Preconditioning 11.3 Reference documents 12 General requirements 12.1 Objective 12.2 Classification for voltage and temperature r

11、ange 12.2.1 Terms 12.3 Generic data 22.3.1 Use of generic data to satisfy qualification requirements 22.3.2 Qualification families 22.4 Test samples 22.4.1 Production requirements 22.4.2 Reusability of test samples 22.5 Definition of electrical test failure after stressing 33 Qualification. 33.1 Whe

12、n qualification is required 33.1.1 Qualification of products 33.1.3 Qualification of manufacturing sites 34 Qualification tests 34.1 General tests 34.2 Electrical characteristics 44.3 Visual and mechanical examination 44.4 Preconditioning 44.5 Life test 44.5.1 Condition A (life test) 44.5.2 Conditio

13、n B (life test) 44.6 Humidity test 54.7 Thermal shock test (air to air) 54.8 Temperature stability 54.9 Resistance to soldering heat (RTSH) 64.10 Vibration 64.11 Shock 74.12 Terminal strength /shear force test 74.13 Solderability and dissolution of metallization 74.14 Other non-required Tests 74.14.

14、1 Sensitivity to electrostatic discharge 74.14.2 Board flex 84.14.3 Barometric pressure 84.14.4 Radiation 84.14.5 Flammability 85 Data reporting requirements 8EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 3 Table 1 Common temperature range classifications 22

15、 Capacitor qualification test program; approval levels and sampling plan 33 Test requirements for temperature range classifications 6EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 4 Foreword The Electronic Component Associations P-2.5 Committee for Solid Elec

16、trolytic Capacitors Task Force on Passive Device Qualification Specifications prepared this specification. EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 5 1 Scope 1.1 Description This specification defines the qualification program for surface mount tantalum

17、 and niobium capacitors. Table 2 lists the tests required. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the suppliers of their responsibility to their own companies internal qualification programs

18、. 1.2 Preconditioning Preconditioning is included before qualification testing to simulate exposure to the thermal and cleaning environments of the assembly process. 1.3 Reference documents Qualification plans per this standard use these referenced documents in effect at the date of agreement to the

19、 qualification plan. Subsequent qualification plans will automatically use the then-current revisions of these referenced documents. EIA-535 BAAC Tantalum Chip Capacitor, Solid Tantalum, Standard Capacitance Range EIA/ECA-953 Molded Tantalum Chip Capacitor with Polymer Cathode MIL-STD-202 Test Metho

20、ds for Electronic and Electrical Component Parts UL-94 Tests for Flammability of Plastic Materials ASTM D 2863 Flammability of Plastics Using the Oxygen Index Method ANSI/J-STD-002 Solderability MIL-STD-883 Test Methods and Procedures for Microelectronics JIS-6429 Fixed Multilayer Ceramic Chip Capac

21、itors for Use in Electronic Equipment J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices EIA-757 Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacito

22、rs 2 General requirements The requirements of this standard include robust qualification tests for the full range of expected commercial applications; so, suppliers can use it to satisfy the requirements of multiple OEM customers. 2.1 Objective The objective of this qualification program is to ensur

23、e that components meet acceptable quality and/or reliability levels. 2.2 Classifications for voltage and temperature range Qualification testing parameters are dictated by the components rated voltage (UR) at rated temperature (TR) and category voltage (UC) at category temperature (TC). Voltage valu

24、es from rated voltage (UR) to category voltage (UC) are derated linearly unless otherwise specified by the manufacturer. 2.2.1 Terms Family: A component family is all electronic components with sufficiently similar manufacturing processes and materials and performance attributes as to be able to be

25、qualified by a single qualification test program. Generic data: Current component test data demonstrated to apply to the component family under test and are reflective of current manufacturing processes and materials. Site: The manufacturing facility used for final assembly of the component. Even if

26、 final testing is at another facility, the final-assembly location shall be considered the site. Rated temperature (TR): The maximum temperature at which the device can be used without voltage derating. It is the same as or lower than the category temperature (TC). Category temperature (TC): The max

27、imum recommended operating temperature of the device. EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 6 Rated voltage (UR): The maximum recommended peak DC operating voltage for continuous operation up to the rated temperature (TR). Category voltage (UC): The

28、maximum recommended peak DC operating voltage for continuous operation at the category temperature (TC). In some classes of components there is no voltage derating up to category temperature. Below are common temperature range classifications currently available. Table 1 Common temperature range cla

29、ssifications Temperature classification85 C (TR) / 125 C (TC) Rate voltage (UR) 2.5 4 6.3 - 10 - 16 20 25 35 50 63 Category voltage (UC) 1.6 2.7 4.2 - 6.6 - 10.6 13.3 16.6 23.3 33.3 40 85 C (TR) / 150 C (TC) Rate voltage (UR) - 4 6.3 - 10 - 16 20 25 35 50 - Category voltage (UC) - 2.7 4 - 7 - 11 13

30、17 24 34 - 85 C (TR) / 175 C (TC) Rate voltage (UR) - 4 6.3 - 10 - 16 20 25 35 50 - Category voltage (UC) - 2 3.1 - 5 - 8 10 12.5 17.5 25 - 105 C (TR) / 105 C (TR) Rate voltage (UR) 2.5 4 6.3 8 10 12.5 16 20 25 - - - Category voltage (UC) 2.5 4 6.3 8 10 12.5 16 20 25 - - - 105 C (TR) / 125 C (TC) Ra

31、te voltage (UR) 2.5 4 6.3 8 10 12.5 16 20 25 35 - - Category voltage (UC) 1.7 2.7 4.2 5.3 6.6 8.4 10.6 13.3 16.6 23.3 - - 2.3 Generic data 2.3.1 Using generic data to satisfy qualification requirements Generic data may be used as part of qualification if they meet the requirements of this clause. Qu

32、alification shall be based on specific requirements associated with characteristics of the device and manufacturing process. The qualification requirements, referenced in Table 2, are the same for new products, products with process changes affecting form, fit or function, and products from new site

33、 locations. For each stress test, two or more qualification families can be combined if reasoning for similarity is technically justified, supported by data and periodically reviewed for soundness of original assumptions. To reduce the amount of qualification testing needed, strive to increase avail

34、able generic data thats applicable to more components and families. For example, this can be achieved through qualification and monitoring of the most complex device in the family and applied to less complex devices that subsequently join this family. Generic data shall come from supplier-certified

35、test labs, and can include internal suppliers qualification, user-specific qualifications and suppliers in-process monitors, as long as the test conditions and endpoint test temperatures address the worst case temperature extremes and other conditions defined in this specification. 2.3.2 Qualificati

36、on families In order for tested components to qualify as a family, the qualification must represent the same manufacturing process, materials and formulation. A minimum of four capacitor ratings chosen to represent high and low CV ratings, high and low voltages, and a variety of case sizes shall be

37、tested. There must be valid and obvious links between the data and the subject of qualification. 2.4 Test samples 2.4.1 Production requirements Test samples must be manufactured using the same equipment, process, and site(s) as used for production parts. 2.4.2 Reusability of test samples Devices, wh

38、ich have been used for nondestructive qualification tests may be used to populate other qualification tests except as noted in specific test descriptions. EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 7 2.5 Definition of electrical test failure after stressi

39、ng Electrical test failures are defined as those devices not meeting the individual device electrical requirements called out in clause 4 of this document. 3 Qualification 3.1 When qualification is required Qualification is required for: A) New products B) Changes to qualified products that affect t

40、he form, fit, or function C) New site locations. 3.1.1 Qualification of products (A and B) The stress test requirements and corresponding test conditions for the qualification are listed in Table 2. For each qualification, the supplier must present data for all of these tests, either specific to the

41、 device to be qualified or acceptable generic data. Justification for the use of generic data must be demonstrated by the supplier and approved by the user. 3.1.2 Qualification of manufacturing sites (C) For site qualification, each manufacturing location must be qualified separately to prove capabl

42、e of running the required processes. A single-family qualification is sufficient for nonlocation specific materials, processes and design changes. 4 Qualification tests 4.1 General tests Individual samples per tests required in Table 2 are selected from one manufacturing lot of each value being qual

43、ified. A minimum of three manufacturing lots shall be selected for the tests defined in clauses 4.5 to 4.7. All parameters shall be measured at the conditions, e.g., test frequency, voltage, etc., defined in EIA-535 BAAC for MnO2cathode devices and EIA/ECA-953 for polymer cathode devices. Table 2Cap

44、acitor qualification test program; approval levels and sampling plan Test method clause Test Description Total sample size Defects permitted 4.2 Electrical characteristics All pieces tested 0 4.3 Visual and mechanical 30 0 4.5* Condition A: Rated temp (TR) life test 40 0 Condition B: Category temp (

45、TC) life test 40 0 4.6 60 C biased humidity test 40 0 4.7 Thermal shock 40 0 4.8 Temperature stability 30 4.9 Resistance to soldering heat 30 0 4.10 Vibration 30 0 4.11 Shock 4.12 Terminal strength 5 04.13 Solderability/dissolution of metallization 5 0 * For this test, condition A or B is acceptable

46、 For this test, a minimum of three lots (40 pieces per lot) is required. Can use generic data. Sequence determined by supplier. EIA-717-A Surface mount niobium and tantalum capacitor qualification specification Page 8 4.2 Electrical characteristics Total samples required in Table 2 shall be measured initially before su

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