ECA EIA-757-A-2015 Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors.pdf

1、 EIA STANDARD Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors EIA-757-A (Revision of EIA-757) March 2015 Electronic Components Industry AssociationEIA-757-A ANSI/EIA-757-A (2015) Approved: March 3, 2015 NOTICE EIA Engineering Standards and Publications are designed to serve

2、 the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standa

3、rds and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, w

4、hether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any o

5、bligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the

6、IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of

7、regulatory limitations before its use. (From Standards Proposal No.5256, formulated under the cognizance of the P-2.5 Committee on Solid Electrolytic Capacitors Standards). Published by Electronic Components Industry Association 2015 Standards & Technology Department 2214 Rock Hill Road, Suite 265 H

8、erndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way

9、East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-397-7956) i CONTENTS Page Foreword ii 1 Scope 1 1.1 Case Defects 1 1.2 Termination Defects 2 1.3 Printing Defects 3 Figures 1 Molded SMT solid tantalum capacitor case defects 5 2 Molded SMT solid tantalum capac

10、itor terminations 6 3 Molded SMT solid tantalum capacitor dimensional defects 7 ii Foreword This document was developed under the cognizance of the P-2.5 Committee on Electrolytic Dielectric Capacitors. EIA-757-A Page 1 1 Scope This document covers the general industry inspection requirements for mo

11、lded surface mount tantalum capacitors with solid electrolyte. The devices selected for inspection shall be examined under 3 power to 10 power magnification to determine compliance with the requirements specified herein. Sampling plans or lot accept/reject criteria shall be negotiated between the su

12、pplier and the customer. 1.1 Case defects as referenced in figure 1 1.1.1 Show through Devices shall not exhibit visible internal metallic body or lead frame material. 1.1.2 Top surface The top surface of the device should be smooth, flat, and free of voids or mold marks. This area must be at least

13、1.0 mm (0.04 in) in diameter. This area must be located at the device centroid, which is used as a vacuum pickup point. 1.1.3 Holes No single hole shall be greater than 0.5 1 mm (0.020 in) in diameter. There shall be no more than three holes in a single unit. 1.1.4 Chips (or chipouts) No chip or com

14、bination of chips shall extend more than 50% of a side or allow metallic body or lead material to be exposed. 1.1.5 Cracks Case cracks are not allowed. 1.16 Flash Molding flash shall not exceed 0.13 mm (0.005 in) protruding from any surface or cause the capacitor body to exceed the maximum case dime

15、nsions. 1.1.7 Glue pad If a glue pad is on the case either as a depression or protrusion the depression shall be no deeper than 0.5 1 mm (0.020 in) and the protrusion no thicker than the termination thickness. EIA-757-A Page 2 1.1.8 Gate scar Gate scars shall not exceed 0.13 mm (0.005 in) protruding

16、 from the case or cause the capacitor to exceed the maximum case dimensions. 1.1.9 Offset Case Molded halves of a case must not be offset by more than 0.25 mm (0.010 in) or cause the capacitor to exceed the maximum case dimensions. 1.1.10 Contamination No foreign material such as dirt or metal parti

17、cles are allowed on the molded case of the capacitor. 1.1.11 Blister or bubbles Blisters or bubbles on the case are not allowed. 1.1.12 Workmanship Color and texture of the devices may vary from gloss to dull, however, abnormal discoloration is not allowed. Case melting and abnormally rough surfaces

18、 are not allowed. Cosmetic scratches having no apparent depth are acceptable. 1.2 Termination defects 1.2.1 Missing terminations Missing terminations are not allowed. 1.2.2 Lead frame window Lead frame windows may or may not be visible. Lead frame windows on one or both terminations should be center

19、ed properly in the lead frame. 1.2.3 Termination condition There shall be no cracks, cuts, splitting, tool marks, removed solder, dewetting, or exposed termination base metal in solderable areas. Case material, contaminants or other foreign material should not be present. The termination surface sha

20、ll be free of bumps or nodules. EIA-757-A Page 3 1.2.4 Lead thickness reduction as referenced in figure 2 There shall be no reduction or flattening in lead thickness greater than 25 percent. This includes the necking area where the lead exits the case. Splitting in the necking area is not allowed. 1

21、.2.5 Solderability (see figure 1) Leads must meet specification solderability requirements 1.3 Printing Defects 1.3.1 Missing printing Missing printing is not allowed. 1.3.2 Incorrect or backward printing There shall be no incorrect or backward printing and printing must agree with specification req

22、uirements. 1.3.3 Legibility Characters must be readable at three power with no smearing. 1.3.4 Double characters A second set of characters is not allowed 1.3.5 Polarity The polarity stripe for all tantalum capacitors shall be on the positive end of the body and be plainly visible. 1.3.6 Location Pr

23、inting must be at the proper specified location on the capacitor body. 1.4 Dimensional defects 1.4.1 Surface Mount tantalum capacitors must meet the specification dimensional criteria 1.4.2 Dimensional criteria must be compatible with specifications for tape and reel packaging. 1.4.3 Terminations ar

24、e shown in figure 3 and 4. EIA-757-A Page 4 1.4.3.1 On the bottom side of the capacitor the termination shall not project from the body by more than 0.20 mm (0.008 in) max. 1.4.3.2 The termination on the bottom side of the capacitor shall be uniform in width and shall not be reduced by more than 25

25、percent from side to side. EIA-757-A Page 5 Figure 1 Molded SMT solid tantalum capacitor case defects EIA-757-A Page 6 Figure 2 Molded SMT solid tantalum capacitor terminations EIA-757-A Page 7 Figure 3 Molded SMT solid tantalum capacitor dimensional defects EIA-757-A Page 8 CRITICAL SOLDERABLE AREA

26、 IS BOTTOM TERMINAL SURFACE ONLY, SOLDER COVERAGE CRITERIA 95% MINIMUM. Figure 4 Molded SMT Face-Down Termination Solid Tantalum Capacitor Dimensional Defects ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technic

27、al reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.:

28、 e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org