ECA EIA-945-2002 Surface Mount Inductor Qualification Specification《表面贴装电感合格规范》.pdf

1、 EIA STANDARD Surface Mount Inductor Qualification Specification EIA-945 NOVEMBER 2002 ELECTRONIC COMPONENTS, ASSEMBLIES approval levels and sampling plan Test method Inductor inspection Sample size per lot Total sample size Defects permitted 4.2 Electrical characteristics 83 249 0 4.3 Visual and me

2、chanical 5 15 0 4.4 Life test 16 48 4.5.1 Load humidity test 16 48 0 4.5.2 Moisture resistance 16 48 0 4.6 Thermal shock 16 48 0 4.7 Vibration 5 15 4.8 Shock 15 0 4.9 Bending 5 15 4.10 Insulation resistance 5 15 0 4.11 Flammability Present certificate of compliance 4.12 Solderability 10 30 0 4.13 Re

3、sistance to soldering heat 5 15 0 4.14 Terminal Strength 5 15 0 4.2 Electrical characteristics The total samples required in Table 1 shall be measured initially at ambient room temperature, relative humidity, and atmospheric pressure (Typical 25C, 760mm Hg) before subsequent testing. Initial electri

4、cal parameters shall not exceed the values listed in the product specifications. Table 2 Maximum inductance change chart Category L% A 30 B 20 C 15 D 10 E 5 4.3 Visual and mechanical examination Inductors shall be examined visually to verify that no defects in workmanship exist. Mechanical dimension

5、s will be measured and shall meet the requirements defined in the detail specification sheet or reference documents. Unless otherwise specified, when inductors are tested in accordance with the environmental tests listed below and the specification, there shall be no evidence of mechanical damage or

6、 measurable discontinuity. This test may be conducted at room temperature. 4.4 Life test Inductors shall be tested in accordance with MIL-STD-202, Method 108, Test Condition D where applicable except: a) Inductors are to be electrically tested per section 4.3 b) preconditioning is required as specif

7、ied in Section 5. EIA-945 Surface mount inductor qualification specification Page 5 c) test temperature shall be 85 3oC for inductors rated at 85oC , and the test temperature shall be 125oC 3oC for 125oC rated inductors based on a component temperature rise of 20oC. If the component temperature rise

8、 of the device is greater than 20oC, the test temperature shall be adjusted accordingly d) apply maximum rated DC current for 1000 hours minimum e) measurements shall be taken at 0 h and 1000 h; the inductors shall be allowed to stabilize at room temperature for 24 hours before measurements are take

9、n. f) the inductance value shall not change by more than (Refer to 4.2 Maximum Inductance Change Chart Table 2) of the initial value at the intermediate or final measurements; the DC resistance (DCR) value shall not exceed the maximum specification value at final measurements; no physical or mechani

10、cal damage shall be observed. 4.5 Testing in aqueous conditions 4.5.1 Load humidity test Inductors shall be tested in accordance with MIL-STD-202, Method 103, Test Condition C where applicable except: a) Inductors are to be electrically tested per section 4.3 b) preconditioning is required as specif

11、ied in Section 5 c) test temperature 85 3oC d) relative humidity shall be held at 85% e) power the units at 10% of their rated current continuously applied for 1000 hours f) measurements shall be taken at 0 h and 1000 h. g) the inductors shall be allowed to stabilize at room temperature for 24 hours

12、 before final measurements are taken h) the inductance value shall not change by more than (Refer to 4.2 Maximum Inductance Change Chart Table 2) from the initial value; the DCR value shall not exceed the maximum specification value at final measurements; no physical or mechanical damage shall be ob

13、served. 4.5.2 Moisture resistance Inductors shall be tested per MIL-STD-202 Method 106 except: a) Inductors are to be electrically tested per section 4.3 b) preconditioning is required as specified in Section 5 c) sequentially measure and record the initial inductance of each unit at: 25 2 C d) plac

14、e the units in a temperature/moisture chamber and subject them to 50 cycles per figure 1; readings must be taken at 0 cycles and 50 cycles e) at the conclusion of the last cycle, remove the units from the chamber. Stabilize at (25 2) C for a minimum of 4 hours to a maximum of 24 hours and sequential

15、ly remeasure the inductance; calculate and EIA-945 Page 6 Surface mount inductor qualification specification record the L change in % from the initial inductance value for each unit; the DCR value shall not exceed the maximum specification value at final measurement. LIMIT- the change in inductance

16、from initial to the end of the test shall not exceed the maximum % L specified, nor shall there be any evidence of mechanical abnormalities. EIA-945 Surface mount inductor qualification specification Page 7 EIA-945 Page 8 Surface mount inductor qualification specification 4.6 Thermal shock Inductors

17、 shall be tested either per MIL-STD-202, Method 107, where applicable except: a) Inductors are to be electrically tested per section 4.3 b) preconditioning is required as specified in Section 5; c) air-to-air Subject units to 500 cycles in the following sequence. Measurements shall be made at 0 cycl

18、es and 500 cycles. Step TemperatureC Time min 1. Start -40 2 2. Hold -40 2 30 5 3. Transfer 0.5 max. 4. Hold +105 2 30 5 5. Transfer 0.5 max. Or d) liquid-to-liquid; Subject units to 200 cycles in the following sequence. Measurements shall be made at 0 cycles and 200 cycles. Step TemperatureC Time 1

19、. Start -40 2 2. Hold -40 2 5 min (Min.) 3. Transfer 10 s 4. Hold +105 2 5 min (Min.) 5. Transfer 10 s d) the inductors shall be allowed to stabilize at room temperature for 24 hours before measurements are taken; at the intermediate and post readouts the inductance value shall not change by more th

20、an (Refer to 4.2 Maximum Inductance Change Chart Table 2); the DCR value shall not exceed the maximum specification value at final measurement; there shall be no physical or mechanical damage. 4.7 Vibration the same set of samples shall be used to perform both the mechanical shock and vibration test

21、s. in addition, it shall be permissible to perform the tests in either order of sequence. a) preconditioning is required as specified in Section 5 b) the inductors shall be tested in accordance with MIL-STD-202, Method 204, Test Condition B (15 g) c) this test shall be done in series with 4.8, Shock

22、 4.8 Shock EIA-945 Surface mount inductor qualification specification Page 9 a) preconditioning is required as specified in Section 5 b) samples shall be tested in accordance with MIL-STD-202, Method 213, Test Condition A (50 g); c) after the conclusion of the two tests (4.7 and 4.8) there shall be

23、no physical or mechanical damage; the inductance value shall not change by more than (Refer to 4.2 Maximum Inductance Change Chart Table 2) ; the DCR value shall not exceed the maximum specification value. 4.9 Bending Inductors shall be tested in accordance with IEC 68-2-21 except: a) preconditionin

24、g is required as specified in Section 5 b) the inductor will be subjected to one bend of 1 mm; c) the inductance shall not change by more than (Refer to 4.2 Maximum Inductance Change Chart Table 2) ; the DCR value shall not exceed the maximum specification value; no physical or mechanical damage sha

25、ll be observed. 4.10 Insulation resistance (IR) Inductors shall be tested in accordance with MIL-STD-202, Method 302 except: a) place a conductive band on the surface of the body b) the two terminations of the inductor shall be shorted together c) apply voltage for 30 seconds and measure resistance;

26、 the test voltage shall be defined in the detail specification sheets d) The IR shall be 1M minimum. 4.11 Flammability The encapsulating material, and/or any other material employed in inductor manufacture, when applicable, shall be certified to meet the minimum flammability requirements of UL-94 V-

27、0 or V-1 and an oxygen index of 28% minimum as defined in ASTM-2863-91. The supplier must provide certificates of compliance to both tests upon request. When UL and Oxygen-Index testing are not feasible, the IEC “Needle-Flame“ test (IEC 60695-2-2), may be used. In all cases, appropriate documentatio

28、n must be maintained. 4.12 Solderability Solderability evaluation on inductor samples shall be tested in accordance with ANSI/ J-STD-002 Test Method B. Steam aging for components to be tested shall be in accordance with Category 3 of ANSI/J-STD-002 Tin lead terminations only. a) All terminations sha

29、ll exhibit a continuous solder coating free from defects for a minimum of 90% of the critical area of any individual termination. Anomalies other than dewetting, non-wetting, and pin holes are not cause for rejection b) If solderability problems are encountered using the dip and look test, the wetti

30、ng balance test shall be employed. c) There shall be no evidence of mechanical abnormalities. EIA-945 Page 10 Surface mount inductor qualification specification 4.13 Resistance to soldering heat Inductors shall be tested as follows: a) samples shall be tested according to MIL-STD-202, Method 210, Te

31、st Condition B; b) the inductance value shall not change by more than (Refer to 4.2 Maximum Inductance Change Chart Table 2) from the initial value; the DCR value shall not exceed the maximum specification value; c) no physical or mechanical damage shall be observed. 4.14 Terminal strength Surface m

32、ount inductors shall be tested in accordance with MIL-STD-202, Method 211, Test Condition A where applicable except: 4.14.1 Hanging Test a) This test is not applicable for case sizes 0402 and smaller b) Solder two metal leads to each surface mount inductor under test using 60/40 Sn/Pb solder. c) Use

33、 the metal leads to subject the surface-mount inductors to a hanging weight of 1.0kg for case sizes larger than 0805, and 0.5kg for case sizes 0805 and smaller. d) The surface-mount inductors shall be able to sustain the hanging weight for a minimum of 30 seconds. e) No physical or mechanical damage

34、 shall be observed. OR 4.14.2 Shear Test a) The surface mount inductors shall be mounted on a FR4 board by reflow or wave soldering, using 60/40 Sn/Pb solder. b) Gradually apply a pushing force in a direction parallel to the chip width (at the device centerline) and maintain for a period of 60 5 sec

35、onds. c) Devices with a case size larger than 0805 shall withstand a force of 1.0kg, while devices with case sizes 0805 and smaller shall withstand a force of 0.5kg. d) No physical or mechanical damage shall be observed. 5 Preconditioning This process is intended to simulate exposure to the thermal

36、and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components. EIA Document Improvement Proposal If in t

37、he review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Industries Alliance Technology Strategy & Standards Department Publications Office 2500 Wilson Blvd. Arlingto

38、n, VA 22201 FAX: (703) 907-7501 Document No. Document Title: Submitters Name: Telephone No.: FAX N.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR EIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: