1、BRITISH STANDARD BS EN 165000-3:1996 Harmonized system of quality assessment for electronic components Film and hybrid integrated circuits Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers The European Standard EN 165000-3:1996 has the status of a British S
2、tandard ICS 31.200BS EN 165000-3:1996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15October1996 BSI 11-1998 The following BSI references relate to the work on t
3、his standard: Committee reference EPL/47/1 Draft for comment 92/216400 DC ISBN 0 580 26181 6 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated cir
4、cuits, upon which the following bodies were represented: Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate (BSI Product Certification) Amendments issued since publication Amd. No. Date CommentsBS EN 165000-3:1996 BSI 11-1998 i Contents Page Committees respo
5、nsible Inside front cover National foreword ii Foreword 2 Text of EN165000-3 5 List of references Inside back coverBS EN 165000-3:1996 ii BSI 11-1998 National foreword This British Standard has been prepared by Subcommittee EPL/47/1 and is the English language version of EN165000-3:1996, Film and hy
6、brid integrated circuits Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers, published by the European Committee for Electrotechnical Standardization (CENELEC). A British Standard does not purport to include all the necessary provisions of a contract. Users
7、of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Corresponding British Standard BS EN 165000 Film and hybrid integrated circuits EN 165000-1:1996
8、BS EN 165000-1:1996 Generic specification. Capability approval procedure EN 165000-2:1996 BS EN 165000-2:1996 Internal visual inspection and special tests EN 165000-4:1996 BS EN 165000-4:1996 Customer information, product assessment level schedules and blank detail specification Summary of pages Thi
9、s document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 98, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside
10、 front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 165000-3 April 1996 ICS 31.200 Descriptors: Quality, generic specification, hybrid circuits English version Film and hybrid integrated circuits Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacture
11、rs This European Standard was approved by CENELEC on 1996-03-05. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographic
12、al references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a C
13、ENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Nor
14、way, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reser
15、ved to CENELEC members Ref. No. EN165000-3:1996 EEN 165000-3:1996 BSI 11-1998 2 Foreword This European Standard was prepared by CLC/TC CECC SC 47AX (former CECC/WG 21), Film and hybrid integrated circuits. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CEN
16、ELEC as EN165000-3 on 1996-03-05. The following dates were fixed: The present standard, EN165000-3, Film and hybrid integrated circuits Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers, is intended to be read in conjunction with the other parts of EN165000
17、, which are: Part 1: Generic Specification Capability approval procedure; Part 2: Internal visual inspection and special tests; Part 4: Customer information, product assessment level schedules and blank detail specification. This Part 3 is primarily intended as a pro-forma for the manufacturer and i
18、s not considered essential for a customer in this form. Part 4 is considered an essential document for all users; in particular it includes a helpful introductory section which is aimed at potential customers and seeks to explain the underlying philosophy upon which the whole standard is based. Cont
19、ents Page 1 Scope 5 2 Document information 5 2.1 Introduction 5 2.2 Related documents 5 3 General requirements 6 3.1 Self-audit checklist and report 7 3.2 Description of report/company structure 8 3.3 Approval information 11 3.4 Summary of testing 13 3.5 Analytical methods 15 3.6 Control of procurem
20、ent sources and incoming material 17 3.7 Environmental control and static handling 19 3.8 Change notification requirements 20 3.9 Hybrid design 21 4 Thick film processing 23 4.1 Artwork sections which invoke mandatory process or inspection requirements are shown in bold italics. It should be noted t
21、hat it is not the requirement or the intention that each section has to be answered with an affirmative, excepting mandatory requirements. The objective of the report is for the maufacturer to demonstrate that all manufacturing processes are under control by whatever means this is achieved. Where su
22、pporting evidence is included, for example Engineering reports, SPC data etc, it should be appended to the report. The manufacturer may use his own style of typeface to reproduce this document and produce his report. The ONS may subsequently validate any part of the submission as a process assessmen
23、t. 2.2 Related documents. EN 165000-1 Generic Specification for film and hybrid integrated circuits, capability approval procedure EN 100114-1 Quality assessment procedures: Approval of manufacturers and other organisations. CECC 00114/111 Quality assessment procedures. Capability approval of an ele
24、ctronic component manufacturing activity. EN 100012 Basic specification: Radiographic inspection of electronic components. EN 100015 Basic specification: Protection of electrostatic sensitive devices. CECC 00016 Basic specification: Basic requirements for the use of statistical process control (SPC)
25、 in the CECC system.EN 165000-3:1996 6 BSI 11-1998 3 General Requirements The following pages contain: 3.1 Report front sheets and authentication. 3.2 Description of report/company structure 3.3 Approval information 3.4 Summary of testing 3.5 Analytical methods 3.6 Control of procurement sources and
26、 incoming material 3.7 Environmental control and static handling 3.8 Major change notification 3.9 Hybrid designEN 165000-3:1996 BSI 11-1998 7 3.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit manufacturers Report No: Date: Previous report No: Date: Approval: Appl
27、ication/Periodic review/Extension/Major change* Company name: Address: Postcode: Telephone: Telex: Facsimile: Company declaration. The information contained herein is a true and accurate record of appraisals carried out between / and/. Report compiled by: signed: date: / Report approved by: signed:
28、date: / ONS Countersignature. The information supplied in this report fully supports the Application/Periodic review/Extension/Major change* as detailed. The following sections of this report have been subject to subsequent evaluation by the ONS: For ONS: Signed: date: / *delete as appropriate.EN 16
29、5000-3:1996 8 BSI 11-1998 3.2 Description of Report/Company Structure Provide a description for the purpose of this report. a. For a new approval application State the extent of the technology sought in terms of materials, complexity, packaging etc. together with the maximum screening/test level app
30、lied for from EN165000-4. b. For an extension/major change Nature of technology extension required, or details of process/equipment change.EN 165000-3:1996 BSI 11-1998 9 3.2 Description of Report/Company Structure, continued Senior management: Name: Position: Location: Name: Position: Location: Name
31、: Position: Location: Name: Position: Location: Name: Position: Location: Name: Position: Location: Name: Position: Location: Name: Position: Location: Quality department: Name: Position: Quality Manager Reports to: Name: Position: Deputy Quality Manager Number of Quality Engineers: Number of Inspec
32、tors per shift: Number of Employees Engaged in Hybrid Production: Total: Administration: Production Engineers: Production Operators: Production Inspection: Design Engineers: Reliability Engineers: Supervisors:EN 165000-3:1996 10 BSI 11-1998 3.2 Description of Report/Company Structure, continued Prod
33、uction line (Space allocations): Market: Production: Thick film substrate production: YES/NO.* Number of shifts: Thin film substrate production: YES/NO.* Number of shifts: Solder assembly: YES/NO.* Number of shifts: Chip and wire: YES/NO.* Number of shifts: Test and environmental: YES/NO.* Number of
34、 shifts: Quality engineering: YES/NO.* Number of shifts: Quality inspection: YES/NO.* Number of shifts: Production supervision: YES/NO.* Number of shifts: Design: area in m 2 . Development: area in m 2 . Production: area in m 2 . Test and environmental: area in m 2 . Space: % Military: % Telecom: %
35、Automotive: % Others: % *delete as appropriate.EN 165000-3:1996 BSI 11-1998 11 3.3 Approval Information Approved Quality System to CECC 00114: YES/NO.* Approval No: Assessed: / Approved to EN 165000-1: YES/NO.* Approval No: Assessed: / Other National/International Approvals Held: Approval Type: Appr
36、oval No: Assessed: / Approval Type: Approval No: Assessed: / Approval Type: Approval No: Assessed: / Approval Type: Approval No: Assessed: / Approval Type: Approval No: Assessed: / Commercial Approvals (e.g. Ford, IBM etc.) Held: Approval Type: Approval No: Assessed: / Approval Type: Approval No: As
37、sessed: / Approval Type: Approval No: Assessed: / Approval Type: Approval No: Assessed: / Approval Type: Approval No: Assessed: / Notes. *delete as appropriate.EN 165000-3:1996 12 BSI 11-1998 3.3 Approval Information, continued In 1937 Welwyn was set up to manufacture high grade resistors primarily
38、for use by the telecommunications industries. During 1962 the company began production of Custom Electronic Hybrid Integrated Circuits for Industrial, Telecommunications and Military customers. Today Welwyn uses the latest technology to design and produce high reliability hybrids conforming to the m
39、ost exacting requirements of customer applications, for customers requiring a wide range of electronic circuit complexity/density and for quantities of hybrids ranging from small batch production to high volume production. In addition 100% screening tests and customer design evaluation testing progr
40、ammes are also available to provide the highest level of Quality Assurance required by any customer. Example of abstract of capability approval. EN 165000-1 Approval Number ABC 123 Thick Film Technology: General: Current levels of release available: Maximum Dimensions EN 165000-4 reference Surface-m
41、ount, Non-Hermetic Technology 50.8 25.4 mm PALS 5 Surface-mount, Hermetic Technology 54.5 29.2 mm PALS 8 Chip and Wire, Non-Hermetic Technology 50.8 25.4 mm PALS 5 Chip and Wire, Hermetic Technology 54.5 29.2 mm PALS 8 Sub-contracted processes: None. Address: Welwyn Microcircuits Factory D BEDLINGTON Northumberland NE22 7AA UNITED KINGDOM Tel:+44 1670 822181 Fax:+44 1670 530123 Telex:53514 Contacts: Commercial Manager: Mr G Thompson, Ext. 421 Quality Manager: Mr D Oliver, Ext. 430
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