EN 16602-70-08-2015 en Space product assurance - Manual soldering of high-reliability electrical connections《航空产品质量保证 高可靠性电气连接装置的手工焊接》.pdf

1、BSI Standards PublicationBS EN 16602-70-08:2015Space product assurance Manual soldering of high-reliability electrical connectionsBS EN 16602-70-08:2015 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN16602-70-08:2015.The UK participation in its preparation was e

2、ntrusted to TechnicalCommittee ACE/68, Space systems and operations.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplicatio

3、n. The British Standards Institution 2015. Published by BSI StandardsLimited 2015ISBN 978 0 580 86584 8ICS 25.160.50; 49.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Comm

4、ittee on 31 January 2015.Amendments issued since publicationDate Text affectedBS EN 16602-70-08:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-08 January 2015 ICS 25.160.50; 49.140 English version Space product assurance - Manual soldering of high-reliability electrical connection

5、s Assurance produit des projets spatiaux - Soudage manuel des connexions lectriques fiabilit leve Raumfahrtproduktsicherung - Manuelles Lten von hoch-zuverlssigen elektrischen Verbindungen This European Standard was approved by CEN on 18 October 2014. CEN and CENELEC members are bound to comply with

6、 the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Manage

7、ment Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management

8、Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, G

9、reece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CEN/CENELEC All rights of ex

10、ploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-70-08:2015 EBS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 2 Table of contents Foreword 9 Introduction 10 1 Scope . 11 2 Normative references . 12 3 Terms, definitions and ab

11、breviated terms 13 3.1 Terms from other standards 13 3.2 Terms specific to the present standard . 13 3.3 Abbreviated terms. 20 4 Principles of reliable soldered connections . 22 5 Preparatory conditions 23 5.1 Calibration 23 5.2 Facility cleanliness 23 5.3 Environmental conditions 23 5.4 Lighting re

12、quirements . 24 5.5 Precautions against static discharges . 24 5.5.1 General . 24 5.5.2 Precautions against ESD during manufacturing 24 5.5.3 Protective Packaging and ESD Protection 25 5.5.4 Packing and filler materials . 26 5.6 Equipment and tools . 26 5.6.1 General . 26 5.6.2 Brushes . 26 5.6.3 Cu

13、tters and pliers 26 5.6.4 Bending tools 27 5.6.5 Clinching tools . 27 5.6.6 Insulation strippers 28 5.6.7 Soldering irons and resistance soldering equipment . 29 5.6.8 Soldering tools 30 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 3 6 Materials selection . 31 6.1 General . 31 6.2 Solder . 31 6.2.1

14、 Form . 31 6.2.2 Composition 31 6.3 Flux 32 6.3.1 Rosin-based fluxes 32 6.3.2 INH1 corrosive acid flux 33 6.3.3 Application of flux 33 6.4 Solvents 34 6.5 Flexible insulation materials 34 6.6 Terminals 35 6.6.1 Materials . 35 6.6.2 Tin-, silver- and gold-plated terminals 35 6.6.3 Shape of terminals

15、35 6.7 Wires 35 6.8 PCBs 36 6.8.1 Boards 36 6.8.2 Gold finish on conductors 36 6.9 Component lead finishes 36 6.10 Adhesives (staking compounds and heat sinking), encapsulants and conformal coatings 36 7 Preparation for soldering . 38 7.1 General . 38 7.1.1 Tools . 38 7.1.2 Components 38 7.2 Prepara

16、tion of conductors, terminals and solder cups . 38 7.2.1 Insulation removal . 38 7.2.2 Surfaces to be soldered 39 7.2.3 De-golding of gold-plated leads and terminals . 40 7.2.4 Constraints on degolding and pretinning methods . 41 7.2.5 Pretinning of stranded wires 42 7.2.6 Pre-tinning of component l

17、eads and solid-wire conductors 42 7.3 Preparation of the soldering bit . 43 7.3.1 Fit 43 7.3.2 Maintenance . 43 7.3.3 Plated bits . 43 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 4 7.3.4 Tip in operation . 43 7.4 Maintenance of resistance-type soldering electrodes 44 7.5 Handling (work station) .

18、44 7.6 Storage (work station) . 44 7.6.1 Components 44 7.6.2 PCBs. 44 7.6.3 Materials requiring segregation . 44 7.7 Preparation of PCBs for soldering . 45 7.7.1 Process . 45 7.7.2 Demoisturization methods . 45 7.7.3 Storage of prepared PCBs 45 8 Mounting of components . 46 8.1 General requirements

19、. 46 8.1.1 Introduction . 46 8.1.2 Heavy components . 46 8.1.3 Metal-case components 46 8.1.4 Glass-encased components 47 8.1.5 Stress relief of components with bendable leads . 47 8.1.6 Stress relief of components with non-bendable leads 48 8.1.7 Reinforced plated-through holes . 50 8.1.8 Lead and

20、conductor cutting . 50 8.1.9 Solid hook-up wire. 50 8.1.10 Location 50 8.1.11 Conformal coating, cementing and encapsulation . 50 8.2 Lead bending requirements 51 8.2.1 General . 51 8.2.2 Conductors terminating on both sides of a non-plated-through hole 51 8.3 Mounting of terminals to PCBs 52 8.4 Le

21、ad attachment to PCBs . 53 8.4.1 General . 53 8.4.2 Clinched leads 53 8.4.3 Stud leads . 55 8.4.4 Lapped round leads 56 8.4.5 Lapped ribbon leads 56 8.5 Mounting of components to terminals . 56 8.6 Mounting of connectors to PCBs . 58 9 Attachment of conductors to terminals, solder cups and cables 59

22、 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 5 9.1 General . 59 9.1.1 Conductors . 59 9.1.2 Terminals 59 9.2 Wire termination . 59 9.2.1 Breakouts from cables 59 9.2.2 Insulation clearance 59 9.2.3 Solid hook-up wire. 60 9.2.4 Stress relief . 60 9.3 Turret and straight-pin terminals . 60 9.3.1 Sid

23、e route . 60 9.3.2 Bottom route . 60 9.4 Bifurcated terminals 61 9.4.1 General . 61 9.4.2 Bottom route . 61 9.4.3 Side route . 62 9.4.4 Top route 63 9.4.5 Combination of top and bottom routes. 64 9.4.6 Combination of side and bottom routes . 64 9.5 Hook terminals 64 9.6 Pierced terminals 65 9.7 Sold

24、er cups (connector type) 66 9.8 Insulation sleeving 66 9.9 Wire and cable interconnections . 67 9.9.1 General . 67 9.9.2 Preparation of wires 67 9.9.3 Preparation of shielded wires and cables 67 9.9.4 Pre-assembly 68 9.9.5 Soldering procedures 68 9.9.6 Cleaning 69 9.9.7 Inspection . 69 9.9.8 Workman

25、ship 69 9.9.9 Sleeving of interconnections . 69 9.10 Connection of stranded wires to PCBs 70 10 Soldering to terminals and PCBs 72 10.1 General . 72 10.1.1 Securing conductors . 72 10.1.2 Thermal shunts . 72 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 6 10.1.3 High-voltage connections 72 10.2 Sold

26、er application to terminals 73 10.2.1 Soldering of swaged terminals onto PCBs 73 10.2.2 Soldering of conductors onto terminals (except cup terminals) 73 10.2.3 Soldering of conductors onto cup terminals . 74 10.3 Solder application to PCBs . 74 10.3.1 Solder coverage 74 10.3.2 Solder fillets 74 10.3

27、.3 Soldering of component leads to plated-through holes 74 10.3.4 Solder application . 75 10.4 Wicking . 76 10.5 Solder rework . 76 10.6 Repair and modification 76 11 Cleaning of PCB assemblies . 77 11.1 General . 77 11.2 Ultrasonic cleaning . 77 11.3 Monitoring for cleanliness . 77 11.3.1 Cleanline

28、ss testing 77 11.3.2 Testing frequency . 78 11.3.3 Test limits 78 11.3.4 Test method 78 12 Final inspection 79 12.1 General . 79 12.2 Acceptance criteria . 79 12.3 Visual rejection criteria 80 13 Verification procedure 81 13.1 General . 81 13.2 Vibration . 81 13.3 Temperature cycling . 84 13.4 Micro

29、section . 84 14 Quality assurance . 85 14.1 General . 85 14.2 Data 85 14.3 Nonconformance 85 14.4 Calibration 85 14.5 Traceability . 86 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 7 14.6 Workmanship standards . 86 14.7 Inspection . 86 14.8 Operator and inspector training and certification . 86 15

30、Workmanship standards 88 15.1 Soldered clinched terminals 88 15.2 Soldered stud terminals 89 15.3 Soldered turret terminals. 90 15.4 Solder turret terminals 91 15.5 Soldered bifurcated terminals . 92 15.6 Soldered hook terminals . 93 15.7 Soldered cup terminals . 94 15.8 Soldered wire to shielded ca

31、ble interconnections . 95 Annex A (normative) Report on manual soldering of high-reliability electrical connections - DRD 98 Annex B (informative) Solder melting temperatures and choice 102 Bibliography . 103 Figures Figure 5-1: Profiles of correct and incorrect cutters for trimming leads . 27 Figur

32、e 5-2 Examples of non-approved types of mechanical strippers 28 Figure 8-1: Assembly of underfilled TO-39 and TO-59, and adhesively staked CKR06 . 48 Figure 8-2: Methods for incorporating stress relief with components having bendable leads 49 Figure 8-3: Methods for attaching wire extensions to non-

33、bendable leads 50 Figure 8-4: Minimum lead bend 51 Figure 8-5: Leads with solder termination on both sides . 52 Figure 8-6: Types of terminal swaging 53 Figure 8-7: Clinched-lead terminations - unsupported holes . 54 Figure 8-8: Clinched lead terminations - plated through-holes 54 Figure 8-9: Stud t

34、erminations . 55 Figure 8-10: Methods of through-hole lapped termination . 57 Figure 8-11: Method of stress relieving parts attached to terminals 57 Figure 9-1: Side- and bottom-route connections to turret terminals 61 Figure 9-2: Bottom-route connections to bifurcated terminal . 62 Figure 9-3: Side

35、-route connection to bifurcated terminal . 63 Figure 9-4: Top-route connection to bifurcated terminal 64 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 8 Figure 9-5: Connections to hook terminals . 65 Figure 9-6: Connections to pierced terminals . 65 Figure 9-7: Connections to solder cups (connector

36、type) 66 Figure 9-8: Methods for securing wires . 69 Figure 9-9: Connection of stranded wires to PCBs . 71 Figure 10-1: High voltage connection . 73 Figure 10-2:Minimum acceptable wetting on component side. 75 Figure 15-1:Soldered clinched terminals 88 Figure 15-2: Soldered stud terminals 89 Figure

37、15-3: Soldered turret terminals with twin conductors . 90 Figure 15-4: Soldered turret terminals with single conductors . 91 Figure 15-5: Soldered bifurcated terminals . 92 Figure 15-6 Soldered hook terminals . 93 Figure 15-7: Soldered cup terminals . 94 Figure 15-8: Hand-soldered wire to shielded c

38、able interconnections 95 Figure 15-9: Hand-soldered wire to shielded wire interconnections 96 Figure 15-10: Hand-soldered wire interconnections - details of defects 97 Tables Table 6-1: Chemical composition of spacecraft solders 32 Table 6-2: Fluxes 33 Table 7-1: Clearances for insulation . 39 Table

39、 7-2: Solder baths for degolding and pretinning . 41 Table 9-1: Dimensions for Figure 9-9 . 71 Table 13-1: Sine survey 82 Table 13-2: Minimum severity for sine vibration testing 83 Table 13-3: Minimum severity for random vibration testing for all applications except launchers . 83 Table 13-4: Minimu

40、m severity for random vibration testing for launcher . 83 Table B-1 : Guide to choice of solder types 102 BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 9 Foreword This document (EN 16602-70-08:2015) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DI

41、N. This standard (EN 16602-70-08:2015) originates from ECSS-Q-ST-70-08C. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by July 2015, and conflicting national standards shall be withdrawn at the lat

42、est by July 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the

43、European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regula

44、tions, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Ita

45、ly, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 10 Introduction The main part of this Standard is based on recommendations from the N

46、ational Aeronautics and Space Administration and European soldering technology experts. Modifications have been incorporated into the text to provide for the specific requirement of lowoutgassing electrical systems which are required by scientific and application satellites. Other additions have bee

47、n made in the light of recent technological advances and the results of verification test programmes. The methods and workmanship contained in this document are considered to be fully approved for normal spacecraft requirements. BS EN 16602-70-08:2015EN 16602-70-08:2015 (E) 11 1 Scope This Standard

48、defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections

49、intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibrat