EN 29455-11-1993 en Soft Soldering Fluxes - Test Methods - Part 11 Solubility of Flux Residues《软钎焊剂的试验方法 第11部分 钎焊剂残留物的可溶性(ISO 9455-11-1991)》.pdf

1、CEN EN*29455-33 93 = 3404589 0053032 Ob3 EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 29455-11 August 1993 UM: 621.791.36.048 : 620.1 : 543.72 Descriptors: Soldering, soldering fluxes, chemical residues, tests, solubility English version Soft soldering fluxes - Rst methods - Part 11 : Solubi

2、lity of flux residues (IS0 9455-11 : 1991) Flux de brasage tendre - Mthodes dessai - Partie 11 : Solubilit des rsidus de flux (IS0 9455-11 : 1991) Flufimittel zum Weichlten - Priifverfahren Ril 11 : Lslichkeit von FluBmittelrckstnden - (IS0 9455-11 : 1991) This European Standard was approved by CEN

3、on 1993-08-02. CEN members are bound to comply with the CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be

4、 obtained on application to the Central Secretariat or to any CEN member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the Central

5、 Secretariat has the same status as the official versions. CEN members are the national standards bodies of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. GEN European Com

6、mittee for Standardization Comit Europen de Normalisation Europisches Komitee fr Normung Central Secretariat: rue de Stassart 36, B-1050 Brussels O 1993 Copyright reserved to CEN members Ref. No. EN 29455-11 : 1993 E CEN EN*ZYSS-ll 93 3904589 0053033 TTT Page 2 EN 29466-11 : 1993 Foreword In 1991, I

7、S0 9465-11 : 1991 SOB SOMZWES - %t methods - RU? 11 : Solubility Of JUX resid= was submitted to the CEN Unique Acceptance Procedure. The result of the UAP was positive. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorseme

8、nt, at the latest by February 1994, and conflicting national standards shali be withdrawn at the latest by February 1994. According to the CENKENELEC Internai Regulations, the following countries are bound to implement this European Standard: Austria, Belgium, Denmark, Finland, France, Germany, Gree

9、ce, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CEN EN*29455-11 93 W 3404589 0053014 936 Page 3 EN 29466-11 : 1993 Soft soldering fluxes - Test methods - Part 11: Solubility of flux residues 1 Scope This pari of IS0 9455 specifie

10、s a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type I, as defined in IS0 9454-1. NOTE 1 This test gives no assurance that post-cleaning residues, which may be present in sufficiently small amounts to pass the test

11、, will not be detrimental to the soldered assembly in the long term. 2 Normative references The following standards contain provisions which, through reference in this text, constitute provisions of this part of IS0 9455. At the time of publication, the editions indicated were valid. All standards a

12、re subject to revision, and parties to agreements based on this part of IS0 9455 are encouraged to investi- gate the possibility of applying the most recent edi- tions of the standards indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IS0 1634-1:1

13、987, Wrought copper and copper alloy plate, sheet and strip - Part 1: Technical conditions of delivery for plate, sheet and strip for general pur- poses. IS0 9454-1:1990, Soft soldering fluxes - Classifica- ?ion and requirements - Part I: Classification, labelling and packaging. 3 Principle A brass

14、test plate is fluxed, heated to soldering temperature and, aner conditioning, is immersed in the selected solvent to dissolve the flux residue. The effectiveness of the flux residue removal is indicated by the presence of a current fiowing across the junction between the cleaned area and an electric

15、al probe tip. 4 Reagents and materials 4.1 General In the test use only reagents of recognized analytical quality and only distilled, or deionized, water. 4.2 Acid cleanlng solution Add cautiously. with stirring, 75 ml of sulfuric acid (Q 1,84 g/ml) to 210 ml of water and mix. Cool. add 15 ml of nil

16、ric acid (e 1,42 g/ml) and mix the solution thoroughly. 4.3 Solvent This is the solvent selected for the flux residue re- moval as recommended by the flux manufacturer or supplier. NOTE 2 composition. The solvent to be used will vary with the flux 4.4 Industrlal methylated spirits. 4.5 Oil crayon. 4

17、.6 Brass test plates, each 60 mm x 60 mm, cut from 0,5 mm thick brass sheet complying with IS0 1634-1, alloy CuZn 37, condition HA. A 3 mm deep depression shall be formed in the centre of each test plate by means of a 20 mm di- ameter steel ball. CEN EN*29455-lL 93 3404589 0053035 872 page 4 EN 2946

18、6-11 : 1993 5 Apparatus Usual laboratory apparatus and, in particular, the following. 5.1 Solder bath, containing not less than 4 kg of solder alloy, having a depth when molten of not less than 25 mm and capable of being maintained at a temperature of (300 f 10) “C. 5.2 Temperaturelhumidity oven, ca

19、pable of main- taining a temperature of (23 f 2) OC and a relative humidity (50 f 5) %. 5.3 Power source, 6 V d.c. 5.4 Varlable resistor, O to 100 R. 5.5 Milliammeter, 100 mA d.c. 5.6 Test probe, consisting of a copper rod, 4 mm diameter x 50 mm long, with a palladium/silver tip 4 mm radius, fitting

20、 into a guide sleeve of non- conducting material (see figure 1). lhe probe shall be capable of, pressing freely, .e. under its own weight, on to the surface of the brass test plate (4.6). 6 Procedure Carry out lhe following procedure, in triplicate, on the flux sample. Clean two brass test plates (4

21、.6) by immersion for 15 s in the acid cleaning solution (4.2). Rinse the test plates under running water, then in industrial methylated spirits (4.4) and dry with warm air. Draw a 30 mm diameter circle round the depression on each test plate with the oil crayon (4.5). in order to restrict the spread

22、 of the flux during the test. Place 0,l ml of the liquid flux sample, or 0,05 g of the solid or paste flux sample in the depression of both test plates. Float one of the test plates for 5 s on the surface of the solder bath (5.1), which is maintained at (300 f 10) OC. Remove the test plate (designat

23、ed “plate A“) and cool to room temperature. The other test plate (designated “plate B“), which is used as a control, is not subjected to this heating stage. Condition both the test plates in the humidity oven (5.2) at (23 f 2) “C and (50 I 5) % relative hu- midity, for 24 h. Within 1 h of removing t

24、he test plates from the oven, immerse them in the selected solvent (4.3) for either a) 1 min or b) 10 min. Dip the test plaies in clean solvent (4.3) for 2 s and then in industrial methylated spirits (4.4) for 2 s. Dry the test plates in warm air. Condition the test plates again at (23 f 2) “C and (

25、50 It 5) YO relative humidity in the oven (5.2) for 24 h. Varlable rerlstori O to 100 Si Mllllammetert 100 mA dx. - 6V Copper test probe: (4mm dlamter. 50 mm lonp wlth P-Ag tlp) - Epoxylptarc composite gulde sleeve Supporthg rleeve Chisrilatlng material) Figure 1 - Test apparatus for efficiency of f

26、lux residue removal CEN EN*29455-LL 93 m 3404589 00530Lb 709 m Page 6 EN 29466-11 : 1993 Connect the control test plate (?plate B?) into the circuit, as shown in figure 1. Place the test probe tip in the centre of the depression in the test plate, al- lowing it to rest under its own weight. Adjust t

27、he variable resistor to give full-scale deflection on the milliammeter. Remove the control test plate from the circuit and replace it with the other test plate (?plate A?) and observe the nature of the milliammeter reading. 7 Assessment of results If the heated and cleaned test plate (?plate A?), wh

28、en connected into the circuit, gives a steady, full- scale reading on the milliammeter, then the flux residue has been efficiently removed and the flux is deemed to have passed the test using the selected solvent. However, if an unsteady reading, or a current read- ing less than full-scale is obtain

29、ed, then the flux is deemed to have failed the test using the selected solven t. 8 Testreport The test report shall include the following informa- tion: identification of the test sample: test method used (Le. reference to this part of solvent selected for the test (see 4.3); whether the test plate was immersed in the sol- vent for l min or 10 min (see clause 6); the results obtained; any unusual features noted during the test; details of any operation not included in this part of IS0 9455, or regarded as optional. IS0 9455);