EN 60068-2-58-2015 en Environmental testing - Part 2-58 Tests - Test Td Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface m.pdf

1、BSI Standards PublicationEnvironmental testingPart 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)BS EN 60068-2-58:2015National forewordThis British Standard is the UK implementation of EN 60068-2-58:2

2、015. It isidentical to IEC 60068-2-58:2015. It supersedes BS EN 60068-2-58:2004which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its

3、 secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 74725 0ICS 19.040; 31.190Compliance with a British Standa

4、rd cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 May 2015. Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60068-2-58:2015EUROPEAN STANDARDNORME EUROPENNEE

5、UROPISCHE NORMEN 60068-2-58 May 2015 ICS 19.040; 31.190 Supersedes EN 60068-2-58:2004 English Version Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and tosoldering heat of surface mounting devices (SMD) (IEC 60068-2-58:

6、2015) Essais denvironnement - Partie 2-58: Essais - Essai Td:Mthodes dessai de la soudabilit, rsistance de lamtallisation la dissolution et rsistance la chaleur debrasage des composants pour montage en surface (CMS) (IEC 60068-2-58:2015) Umweltprfungen - Teil 2-58: Prfungen - Prfung Td:Prfverfahren

7、fr Ltbarkeit, Widerstandsfhigkeitgegenber Auflsen der Metallisierung und Ltwrmebestndigkeit bei oberflchenmontierbarenBauelementen (SMD) (IEC 60068-2-58:2015) This European Standard was approved by CENELEC on 2015-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations w

8、hich stipulate the conditions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. Th

9、is European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.CENE

10、LEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,Lithuania, Luxembourg, Malta, the Netherlan

11、ds, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre:

12、 Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60068-2-58:2015 E EN 60068-2-58:2015 - 2 - Foreword The text of document 91/1222/FDIS, future edition 4 of IEC 60068-2-58, prepared by IEC/TC 91

13、 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60068-2-58:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement

14、 (dop) 2016-02-01 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-05-01 This document supersedes EN 60068-2-58:2004. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC

15、 and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60068-2-58:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following not

16、es have to be added for the standards indicated: IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54. IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69. IEC 60749-20 NOTE Harmonized as EN 60749-20. IEC 61760-3 NOTE Harmonized as EN 61760-3. IEC 61760-4 NOTE Harmonized as EN 61760-4 1). 1) To be published.

17、 BS EN 60068-2-58:2015- 3 - EN 60068-2-58:2015 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. F

18、or dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up

19、-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60068-1 - Environmental testing - Part 1: General and guidance EN 60068-1 - IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests

20、 - Test T: Test methods for solderability and resistance to soldering heat of devices with leads EN 60068-2-20 2008 IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61190-1-1 - Attachment materials for electronic assembly - Part 1-1: Requirements for

21、soldering fluxes for high-quality interconnections in electronics assembly EN 61190-1-1 - IEC 61190-1-2 2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly EN 61190-1-2 2014 IEC 61190-1-3 + A1 2007 201

22、0 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 + A1 2007 2010 IEC 61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements

23、 for surface mount soldered assemblies EN 61191-2 - BS EN 60068-2-58:2015EN 60068-2-58:2015 - 4 - Publication Year Title EN/HD Year IEC 61249-2-22 - Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated ep

24、oxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad EN 61249-2-22 - IEC 61249-2-35 - Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheet

25、s of defined flammability (vertical burning test), copper-clad for lead-free assembly EN 61249-2-35 - IEC 61760-1 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 - ISO 9454-2 1998 Soft soldering fluxes - Classification an

26、d requirements - Part 2: Performance requirements EN ISO 9454-2 2000 BS EN 60068-2-58:2015 2 IEC 60068-2-58:2015 IEC 2015 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references. 7 3 Terms and definitions 8 4 Grouping of soldering processes and related test severities 9 5 Test equipment 10 5.1 Solder

27、 bath . 10 5.2 Reflow equipment . 10 6 Test Td1: Solderability of terminations . 11 6.1 Object and general description of the test 11 6.2 Specimen preparation . 11 6.3 Accelerated ageing . 11 6.4 Initial measurements . 11 6.5 Method 1: Solder bath . 11 Solder bath 11 6.5.1Solder and flux . 11 6.5.2T

28、est procedure and conditions 12 6.5.36.6 Method 2: Reflow 14 Reflow equipment 14 6.6.1Solder paste 14 6.6.2Test substrates 14 6.6.3Test procedure . 14 6.6.4Reflow temperature profile for Test Td115 6.6.5Test conditions 16 6.6.67 Test Td2: Resistance to soldering heat 16 7.1 Object and general descri

29、ption of the test 16 7.2 Specimen preparation . 16 7.3 Preconditioning . 16 7.4 Initial measurements . 16 7.5 Method 1: Solder bath . 17 Solder bath 17 7.5.1Solder and flux . 17 7.5.2Test procedure and conditions 17 7.5.37.6 Method 2: Reflow 19 Reflow equipment 19 7.6.1Solder paste 19 7.6.2Test subs

30、trates 19 7.6.3Test procedure and conditions 19 7.6.48 Test Td3: Dewetting and resistance to dissolution of metallization 21 8.1 Object and general description of the test 21 8.2 Specimen preparation . 21 8.3 Initial measurements . 22 8.4 Method 1: Solder bath . 22 Solder bath 22 8.4.1Solder and flu

31、x . 22 8.4.2BS EN 60068-2-58:2015IEC 60068-2-58:2015 IEC 2015 3 Test procedure and conditions 22 8.4.38.5 Method 2: Reflow 22 Reflow equipment 22 8.5.1Specimen. 22 8.5.2Solder paste 22 8.5.3Flux . 22 8.5.4Reflow profile . 22 8.5.5Placement of the specimen 23 8.5.6Application of the reflow profile. 2

32、3 8.5.7Evaluation 23 8.5.89 Final measurements 23 9.1 Flux removal . 23 9.2 Recovery conditions 23 9.3 Evaluation . 23 Wetting 23 9.3.1Dewetting 24 9.3.2Resistance to soldering heat 24 9.3.3Resistance to dissolution of metallization 24 9.3.410 Information to be given in the relevant specification 25

33、 10.1 General . 25 10.2 Solderability 25 10.3 Resistance to soldering heat, dewetting and resistance to dissolution of metallization 25 Annex A (normative) Criteria for visual examination 27 A.1 Wetting . 27 A.2 Evaluation of wetting . 27 A.3 Evaluation of method 2 (Td1) . 28 A.4 Evaluation of metho

34、d 2 (Td3) . 29 Annex B (informative) Guidance . 30 B.1 General . 30 B.2 Limitations 30 B.3 Choice of severity . 30 B.3.1 Test Td1: Solderability by solder bath method . 30 B.3.2 Test Td2: Resistance to soldering heat Solder bath method . 31 B.3.3 Test Td2: Resistance to soldering heat Reflow method

35、. 31 B.3.4 Immersion attitude . 32 B.3.5 Test Td3: Dewetting and resistance to dissolution of metallization for 30 s at 260 C 32 Annex C (normative) Application of the test methods to through hole reflow soldering components (THR) 33 C.1 Solderability 33 C.2 Resistance to soldering heat . 33 C.3 Dew

36、etting 33 C.4 Criteria for evaluation 33 Annex X (informative) Cross reference for references to the prior revision of this specification . 34 Bibliography . 36 BS EN 60068-2-58:2015 4 IEC 60068-2-58:2015 IEC 2015 Figure 1 Examples of immersion attitudes 13 Figure 2 Reflow temperature profile for so

37、lderability . 15 Figure 3 Examples of immersion attitude 18 Figure 4 Reflow temperature profile for resistance to soldering heat 20 Figure 5 Example for placement of a specimen to a test substrate 23 Figure 6 Identification of areas on metallic termination 24 Figure A.1 Evaluation of wetting . 28 Ta

38、ble 1 Grouping of soldering processes and typical test severities Overview 10 Table 2 Solder alloy and flux for test Td112 Table 3 Solderability Test conditions and severity, solder bath method . 14 Table 4 Solder paste specification 14 Table 5 Solderability Test conditions Method 2: Reflow . 16 Tab

39、le 6 Resistance to soldering heat Test conditions and severity, solder bath method . 19 Table 7 Resistance to soldering heat Test conditions and severity, reflow method 21 Table 8 Dewetting and resistance to dissolution of metallization Test conditions and severity, solder bath method . 22 Table B.1

40、 Test conditions . 31 Table C.1 Test conditions for solderability test 33 BS EN 60068-2-58:2015IEC 60068-2-58:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to

41、soldering heat of surface mounting devices (SMD) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation o

42、n all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC P

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44、. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus o

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