EN 60191-6-2009 en Mechanical standardization of semiconductor devices - Part 6 General rules for the preparation of outline drawings of surface mounted semiconductor device packag.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical standardization of semiconductor devicesPart 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packagesBS EN 60191-6:200

2、9National forewordThis British Standard is the UK implementation of EN 60191-6:2009. It isidentical to IEC 60191-6:2009. It supersedes BS EN 60191-6:2004 which iswithdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations repre

3、sented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 59338 3ICS 31.080.01Compliance with a British Standard cannot confer i

4、mmunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 April 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60191-6:2009EUROPEAN STANDARD EN 60191-6 NORME EUROPENNE EUROPISCHE

5、 NORM December 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by a

6、ny means reserved worldwide for CENELEC members. Ref. No. EN 60191-6:2009 E ICS 31.080.01 Supersedes EN 60191-6:2004English version Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IE

7、C 60191-6:2009) Normalisation mcanique des dispositifs semi-conducteurs - Partie 6: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semi-conducteurs pour montage en surface (CEI 60191-6:2009) Mechanische Normung von Halbleiterbauelementen - Teil 6: Allgemeine

8、Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen (IEC 60191-6:2009) This European Standard was approved by CENELEC on 2009-12-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the

9、 status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, Ger

10、man). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgari

11、a, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60191-6:2009EN 6

12、0191-6:2009 - 2 - Foreword The text of document 47D/736/CDV, future edition 3 of IEC 60191-6, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6 on 200

13、9-12-01. This European Standard supersedes EN 60191-6:2004. EN 60191-6:2009 includes the following significant changes with respect to EN 60191-6:2004: scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; editorial modifications on

14、several pages; and technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.) The following dates were fixed: latest date by which the EN has to be implemented at national level by

15、publication of an identical national standard or by endorsement (dop) 2010-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-12-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6:2009

16、was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191-3 NOTE Harmonized as EN 60191-3:1999 (not modified). ISO 2692 NOTE Harmonized as EN ISO 2692:2006 (not modif

17、ied). _ BS EN 60191-6:2009- 3 - EN 60191-6:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cit

18、ed applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191-1 2007 M

19、echanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices EN 60191-1 2007 IEC 60191-4 A1 A2 1999 2001 2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package

20、 outlines for semiconductor device packages EN 60191-4 A1 A2 1999 2002 2002 ISO 1101 2004 Geometrical Product Specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out EN ISO 1101 2005 BS EN 60191-6:2009 2 60191-6 IEC:2009 CONTENTS 1 Scope.6 2 Normative r

21、eferences .6 3 Terms and definitions .6 4 Design rules .7 5 Dimensions to be specified.8 6 Notes .8 Annex A (informative) Illustration of the rules.12 Annex B (informative) Optional table format.36 Bibliography38 Figure A.1 Illustrations of terminal projection zone.13 Figure A.2 Isometric view of an

22、 example of gauge .13 Figure A.3a Top view .14 Figure A.3b Side view 14 Figure A.3c Lead section .14 Figure A.3d Lead side view14 Figure A.4 Pattern of terminal position areas .14 Figure A.5a Top view .17 Figure A.5b Side view 17 Figure A.5c Lead section .17 Figure A.5d Lead side view17 Figure A.6 P

23、attern of terminal position areas .17 Figure A.7a Top view .20 Figure A.7b Side view 20 Figure A.7c Lead section .20 Figure A.7d Lead side view20 Figure A.8 Pattern of terminal position areas .20 Figure A.9a Top view .23 Figure A.9b Side view 23 Figure A.9c Side view 23 Figure A.9d Lead shape.23 Fig

24、ure A.9e Lead side view23 Figure A.9f Lead section 23 Figure A.10 Pattern of terminal position areas .23 Figure A.11a Top view .26 Figure A.11b Side view 26 Figure A.11c Side view 26 Figure A.11d Lead section .27 Figure A.11e Lead shape .27 Figure A.11f Lead side view.27 BS EN 60191-6:200960191-6 IE

25、C:2009 3 Figure A.12 Pattern of terminal position areas .27 Figure A.13a Top View.30 Figure A.13b Side View30 Figure A.13c Bottom view 30 Figure A.14 Pattern of terminal position areas .30 Figure A.15a Top view .33 Figure A.15b Side view 33 Figure A.15c Bottom view 33 Figure A.16 Pattern of terminal

26、 position areas .33 Table 1 Dimensions to be specified for Group 1 .9 Table 2 Dimensions to be specified for Group 2 .10 BS EN 60191-6:2009 6 60191-6 IEC:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6: General rules for the preparation of outline drawings of surface mounted semicond

27、uctor device packages 1 Scope This part of IEC 60191 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to

28、8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the

29、 referenced document (including any amendments) applies. IEC 60191-1:2007, Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices IEC 60191-4:2002, Mechanical standardization of semiconductor devices Part 4: Coding system

30、 and classification into forms of package outlines for semiconductor device packages ISO 1101:2004 Geometrical Product Specifications (GPS) Geometrical tolerancing Tolerances of form, orientation, location and run-out 3 Terms and definitions For the purposes of this document, the following terms and

31、 definitions apply. 3.1 seating plane plane which designates the plane of contact of the package, including any stand-off, with the surface on which it will be mounted NOTE This plane is often used as the reference plane. 3.2 reference plane plane parallel to the seating plane at a distance A3 above

32、 seating plane (does not apply to leadless package) NOTE 1 The distance A3 is known as the reference plane distance. It determines the terminal projection zone (see Figure 1). NOTE 2 This distance is a theoretical dimension which is not related to any feature of the package. Its value is chosen for

33、each package so the length of terminal projection zone Lpis a good approximation of the terminal length used for mounting, e.g. the length of the part of the terminal that is soldered to the substrate. BS EN 60191-6:200960191-6 IEC:2009 7 3.3 terminal position area maximum area on the seating plane

34、within which the terminal projection zone is located, taking into account the maximum values of Lpand bp NOTE 1 The surface of the terminal position area is equal to l1 b3with, generally l1= Lpmax. + (HDmax. HDmin.)/2 = Lpmax. + (HEmax. HEmin.)/2 and b3 = bpmax. + x NOTE 2 Checking can be carried ou

35、t by means of an appropriate gauge (see Figure 2) 3.4 pattern of terminal position areas group of all terminal position areas of a leaded package or folded lead package in the seating plane NOTE 1 For a leadless package, it is the projection of its metallized pads or terminals on the seating plane.

36、NOTE 2 The true positions of the centres of the terminal position areas are located on a grid with a modulus e / eD or e / eE NOTE 3 The pattern of terminal position areas does not include tolerances stemming from mounting substrates (printed board) design and placement machine accuracy. 3.5 coplana

37、rity of terminals profile tolerance controlling the location of the crowns of the bottom terminals with respect to the seating plane NOTE In all the other cases, the requirement for coplanarity of terminals is clarified by a note. 3.6 datum geometrical established planes for controlling the toleranc

38、e zone NOTE Datum S should be established by seating plane. 4 Design rules The outline drawing of a surface-mounted semiconductor device package shall comprise in the given sequence: the drawing (strictly speaking); the tables of dimensions; the notes to the tables and the drawings; the codification

39、. The drawing shall conform with the general rules for drawings laid down in IEC 60191-1, Clause 4 and Clause 5, as well as with the specific definitions of Clause 3 above. The following, Clause 5 and Clause 6 give, respectively, the tables of dimensions to be specified and the notes to be called, w

40、here relevant. Supplementary dimensions and notes may be added when required. BS EN 60191-6:2009 8 60191-6 IEC:2009 The codification of package outlines shall be in accordance with IEC 60191-4. 5 Dimensions to be specified Crosses in the Table 1 and Table 2 indicate where values have to be specified

41、. In the auxiliary right-hand column, a code indicates for which outline families each dimension is generally relevant, as follows: L: leaded packages packages with gull-wing leads for example; QFP, SOP,TSOP F: folded lead packages packages with J-bent leads for example; QFJ, SOJ P: leadless package

42、s packages with no leads for example; QFN B: ball grid array packages packages with ball leads for example; BGA 6 Notes Notes referred to in the tables and in the drawings appear after Table 2; in the auxiliary right-hand column, a code indicates for which outline families each note is generally rel

43、evant (with the same code as in Clause 5 above). For each particular outline package or package family, the applicable notes shall be numbered sequentially from 1 in the order they are in the tables and then on the drawing. BS EN 60191-6:200960191-6 IEC:2009 9 Table 1 Dimensions to be specified for

44、Group 1 Group 1 includes dimensions and numerals associated with mounting of packages and kinds of packages. The dimensions and numerals belonging to the group mean values guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized. Concerned family Ref. Min

45、. Nom. Max. Notes n - x - 2 LFPB nD - x - 3 LFP nE - x - 3 LFP A - - x LFPB A1 x - x LFB A2 - x - LF A3 - x() - 4 LF bp x - x 4 LFP bp x x x 4 B b x - x 4 BC x - x LF D x x x 4 LFPB E x x x 4 LFPB e - x() - 4 LFPB f - - x LF HD x x x 4 LF HE x x x 4 LF h x - x F k x - x Pk1 x - x P Lp x - x 4 LFP t

46、- - x LF v - - x B w - - x x - - x LFPB x1 - - x B y - - x LFPB y1 - - x B x - x L BS EN 60191-6:2009 10 60191-6 IEC:2009 Table 2 Dimensions to be specified for Group 2 Group 2 includes dimensions that do not belong to Group 1, but are associated with the fabrication of packages and dimensions of te

47、rminal position areas. The group is to achieve its own original purpose as an industry standard. The group belongs to the dimensions and numerals of external shapes of packages useful for design and manufacture and the dimensions of terminal position areas that can be referenced to in fabrications o

48、f mounting boards. Therefore, external dimensions of a package shall have nominal design values specified thereto. Concerned family Ref. Min. Nom. Max. Notes b1 - x - LF b2 x - x F b3 - - x 4 LFPB c1 - x - LF eD - x - 4 FP eE - x - 4 FP L - x - LF L1 - x - F L2 - x - F l1 - - x 4 LFP SD - x - B SE -

49、 x - B ZD - x - LFPB ZE - x - LFPB G1D - x - L G1E - x - L h - x - F BS EN 60191-6:200960191-6 IEC:2009 11 Explanation of the symbols and notes to the tables Explanation of the symbols () means true geometrical position values given within square brackets are calculated values means in this drawing that the distance from the seating plane to the neares