EN 60191-6-21-2010 en Mechanical standardization of semiconductor devices - Part 6-21 General rules for the preparation of outline drawings of surface mounted semiconductor device .pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical standardization of semiconductor devicesPart 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring met

2、hods for package dimensions of small outline packages (SOP)BS EN 60191-6-21:2010National forewordThis British Standard is the UK implementation of EN 60191-6-21:2010. It isidentical to IEC 60191-6-21:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconduct

3、ors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 64567 9ICS 31.080.01Compliance with a

4、 British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 December 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60191-6-21:2010EUROPEAN STANDAR

5、D EN 60191-6-21 NORME EUROPENNE EUROPISCHE NORM October 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All righ

6、ts of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-21:2010 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor

7、device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010) Normalisation mcanique des dispositifs semiconducteurs - Part 6-21: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semiconducteurs pour montage en

8、 surface - Mthodes de mesure pour les dimensions des botiers de faible encombrement (SOP) (CEI 60191-6-21:2010) Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Messverfahren fr Gehusemae von kleinen Geh

9、usen (SOP) (IEC 60191-6-21:2010) This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-t

10、o-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation u

11、nder the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, F

12、inland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60191-6-21:2010EN 60191-6-21:2010 - 2 - Foreword The text of docum

13、ent 47D/772/FDIS, future edition 1 of IEC 60191-6-21, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-21 on 2010-10-01. Attention is drawn to the po

14、ssibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of

15、 an identical national standard or by endorsement (dop) 2011-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-21:2010 was approve

16、d by CENELEC as a European Standard without any modification. _ BS EN 60191-6-21:2010- 3 - EN 60191-6-21:2010 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the applicatio

17、n of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

18、 applies. Publication Year Title EN/HD Year IEC 60191-4 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages EN 60191-4 - IEC 60191-6 - Mechanical standardization of semiconductor devices - P

19、art 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 60191-6-21:2010 4 60191-6-21 IEC:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-21: General rules for the preparation of outline drawings of surface mount

20、ed semiconductor device packages Measuring methods for package dimensions of small outline packages (SOP) 1 Scope This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. 2 Normative references The fo

21、llowing referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-4, Mechanical standardization of semiconducto

22、r devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms

23、and definitions For the purposes of this document the terms and definitions given in IEC 60191-6 apply. 4 Measuring methods 4.1 Description of measuring method The measuring methods described in this standard are for dimension values guaranteed to users on the basis of the following items. a) In gen

24、eral, measuring the dimensions shall be made with the semiconductor packages mounted on printed circuit-board as the guarantee is made to the user. b) In general, measurement may be made either by hand or automatically. c) The dimensions that cannot be measured unless the package is destroyed may be

25、 calculated from other dimensions or replaced by representative values. See 4.6.2.3. BS EN 60191-6-21:201060191-6-21 IEC:2010 5 4.2 Reference characters and drawing Thin small outline package TSOP (1) An outline drawing is given in Figure 1. Terminal 1 index area2 1 n/2 nBn-1n/2+1DHDA IEC 2248/09 Fi

26、gure 1a Top view ySeating planeZE ebpMx PSESA-BSIEC 2249/09 Figure 1b Side view cc1b1 bp IEC 2250/09 G1DLLpL1A3PA1A2AIEC 2251/09 Figure 1c Lead section Figure 1d Lead side view eb3l1HDmin-2LpmaxHDmaxIEC 2252/09 Figure 1e Pattern of terminal position areas Figure 1 TSOP(1) outline drawings BS EN 6019

27、1-6-21:2010 6 60191-6-21 IEC:2010 Shrink small outline package SSOP, TSOP(2) An outline drawing is given in Figure 2. Terminal 1 index area 21 n1n/2Bn2n4n n-1n/2-1n3EHEAIEC 2243/09 Figure 2a Top view ZD e PSeating planeSbpDMyA-BSSxIEC 2244/09 Figure 2b Side view cc1b1 bp IEC 2245/09 L1G1E PA3LLpAA2A

28、1IEC 2246/09 Figure 2c Lead section Figure 2d Lead side view eb3l1HEmin-2LpmaxHEmaxIEC 2247/09 Figure 2e Pattern of terminal position areas Figure 2 SSOP, TSOP(2) outline drawings BS EN 60191-6-21:201060191-6-21 IEC:2010 7 4.3 Mounting height A 4.3.1 Description Let the height of a package from the

29、seating plane to the top of the package be denoted as the mounting height. See Figure 3. A S S A IEC 2032/10 Figure 3 Mounting height 4.3.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the seating plane. b) From the side or top, meas

30、ure the distance to a highest point. Let the distance be denoted as the mounting height A. 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off. See Figure 4. BS EN 60191-6-21:2010 8 60191-6-21 IEC:2010 S A1 A1 S IEC 20

31、33/10 Figure 4 Stand-off 4.4.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure a distance from the reference surface (surface plate) to the lowest point of the package. 4.5 Body thicknes

32、s A2 4.5.1 Description The body thickness is defined as a distance between planes, parallel to the reference surface, tangent to the highest and lowest points of the body. See Figure 5. A2 A2 IEC 2034/10 Figure 5 Body thickness A2 4.5.2 Measuring method The measuring method shall be as follows. a) P

33、ut the package which is accurately dimensioned between surface plates which are larger than the package vertically in parallel. Never touch the leads. BS EN 60191-6-21:201060191-6-21 IEC:2010 9 b) Measure the total thickness including the surface plates with a micrometer and subtract the thickness o

34、f surface plates from the total thickness so as to obtain the thickness of package. 4.6 Lead widths bp and b1, lead thickness c and c1 4.6.1 Description The outmost width and outmost thickness in a range of 0,1 mm to 0,25 mm from the tip of the stable shape of the lead having little burrs and crushi

35、ng shall be defined as the lead width and lead thickness. The lead width and lead thickness are as shown on the right part of Figure 6. In this case, the outmost width and outmost thickness after surface plating shall be defined as bp and c, and the outmost width and outmost thickness before plating

36、 shall be defined as b1 and c1 respectively. 0,10,25XXc c1 Section X-X bp b1 IEC 2035/10 Figure 6 Lead widths bp and b1, lead thickness c and c1 4.6.2 Measuring method 4.6.2.1 Lead widths bp and b1 a) Put the package on the surface plate. b) Make the lead centre intersect perpendicularly to the meas

37、uring reference. c) Measure the lead width from the upper surface, as shown in Figure 6. 4.6.2.2 Lead thickness c and c1 a) Put the package on the surface plate. b) Measure the lead thickness from the side b1, and c1 may be measured before plating, as shown in Figure 6. 4.6.2.3 Remarks Remarks are a

38、s follows. a) b1 and c1 may be measured before the lead is processed. If this occurs, after processing, measure b1 and c1 at the position within the above range. b) The lead thickness may be measured at 8 points on the four corners of the package as representative values. BS EN 60191-6-21:2010 10 60

39、191-6-21 IEC:2010 4.7 Soldered portion length Lp 4.7.1 Description The distance in a mounting direction from a cross point (a) of a plane A3 from, and in parallel with, the seating plane with an inside surface of a descending portion of the lead to a tip (b) of the lead. See Figure 7. A3(b) Lp (a) I

40、EC 2036/10 Figure 7 Soldered portion length Lp 4.7.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate. b) Make the datum parallel with the measuring reference. c) Observe the lead toward the package side (in the seating plane direction). Measure posi

41、tions of points (a) and (b) as the soldered portion length. 4.7.3 Remarks As this measuring method can be done from the side, the values of the leads observable from the side are allowed as representative values. 4.8 Positional tolerance of terminal tips 4.8.1 Description Let S, A, and B denote datu

42、m as shown in the above figures. Obtain positions of tips of leads at the points of 0,1 mm inside from the tips. Obtain differences from the theoretical positions. Acceptable differences are defined as the tolerance at centre positions of terminal tips. See Figures 8, 9 and 10. BS EN 60191-6-21:2010

43、60191-6-21 IEC:2010 11 Terminal 1 index area2 1 n/2 nBn-1n/2+1DHDA IEC 2248/09 ySeating planeZE ebpMx PSESA-BSIEC 2249/09 Figure 8 TSOP(1) lead positional tolerance Terminal 1 index area 2 1 n1n/2Bn2n4n n-1 n/2-1n3EHEAIEC 2243/09 ZD e PSeating planeSbpDMyA-BSSxIEC 2244/09 Figure 9 SSOP and TSOP(2) l

44、ead positional tolerance 4.8.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate. b) Make the datum parallel with the measuring reference. BS EN 60191-6-21:2010 12 60191-6-21 IEC:2010 c) Obtain positions of the centres of leads at the points of 0,1 mm

45、 inside from the tips. d) Obtain the differences from the theoretical centres of the leads. e) Check the differences within the tolerance of lead centre position. f) The tolerance depends on the terminal width which is given as x (bmax- b + x) / 2 xTheoretical centre Actual lead centre 0,1 xIEC 2037

46、/10 Figure 10 Positional tolerance of terminals 4.9 Coplanarity y of lowest surfaces of leads 4.9.1 Description The vertical distance from the seating plane to the lowest point of each lead shall be referred to as coplanarity of the lowest surfaces of the leads. The distance up to the lowest point o

47、f the lead furthest from the seating plane shall be defined as y. See Figure 11. SySIEC 2038/10 Figure 11 Coplanarity 4.9.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate. b) Observe the lowest surfaces of all the leads from the front side of the l

48、eads to measure the vertical distances from the surface plate to the lowest surfaces. c) The maximum value of the distances shall be defined as the coplanarity y. d) Coplanarity may change because of the seesaw phenomenon. In the case of the seesaw, the larger y data shall be adopted. To avoid the s

49、eesaws case, the virtual plane method can be the measuring method. BS EN 60191-6-21:201060191-6-21 IEC:2010 13 4.9.3 Additional measuring method (virtual plane method) 4.9.3.1 Description of virtual plane Of the geometrical planes that pass the lowest points of the given 3 leads, the plane on which the lowest points of all the leads exist on the package body side shall be referred to as the