EN 60352-5-2012 en Solderless connections - Part 5 Press-in connections - General requirements test methods and practical guidance.pdf

1、BSI Standards PublicationSolderless connectionsPart 5: Press-in connections General requirements, test methods and practical guidanceBS EN 60352-5:2012BS EN 60352-5:2012Incorporating corrigendum September 2014BS EN 60352-5:2012 BRITISH STANDARDNational forewordThis British Standard is the UK impleme

2、ntation of EN 60352-5:2012. It is identical to IEC 60352-5:2012, incorporating corrigendum September 2014. It supersedes BS EN 60352-5:2008, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures

3、for electronic equipment.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 201

4、4. Published by BSI Standards Limited 2014ISBN 978 0 580 88056 8ICS 31.220.10Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 May 2012.Amendments/corrigenda is

5、sued since publicationDate Text affected30 September 2014 Implementation of IEC corrigendum September 2014: Table 5 and Figure 9 updatedEUROPEAN STANDARD EN 60352-5NORME EUROPENNE EUROPISCHE NORM May 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation

6、Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60352-5:2012 E ICS 31.220.10 Supersedes EN 60352-5:2008E

7、nglish version Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012) Connexions sans soudure - Partie 5: Connexions insres force - Exigences gnrales, mthodes dessai et guide pratique (CEI 60352-5:2012) Ltfreie Verbindunge

8、n - Teil 5: Einpressverbindungen - Allgemeine Anforderungen, Prfverfahren und Anwendungshinweise (IEC 60352-5:2012) This European Standard was approved by CENELEC on 2012-03-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving th

9、is European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three offic

10、ial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechn

11、ical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switz

12、erland, Turkey and the United Kingdom. EN 60352-5:2012 - 2 - Foreword The text of document 48B/2276/FDIS, future edition 4 of IEC 60352-5, prepared by SC 48B, “Connectors“, of IEC TC 48, “Electromechanical components and mechanical structures for electronic equipment“ was submitted to the IEC-CENELE

13、C parallel vote and approved by CENELEC as EN 60352-5:2012. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-12-28 latest date by which the national standards conflic

14、ting with the document have to be withdrawn (dow) 2015-03-28 This document supersedes EN 60352-5:2008 EN 60352-5:2012 includes the following significant technical changes with respect to EN 60352-5:2008: a) Enhancement of Annex A and further application remarks are added. b) Editorial changes throug

15、hout the standard to prevent the document from being misunderstood as specification for establishing press-in connection in total. c) Deletion of all tables with hole dimensions. Historically the hole dimensions were constrained because of the dimensions of the wire wrap and clip connections posts.

16、Since these connection technologies are no longer commonly used, the design requirements are no longer practical. d) Inclusion of additional figures and one table in 4.4.4 to define tolerance ranges for holes in test-boards and to illustrate them. e) Inclusion of a requirement for the thickness of t

17、he test-board in 4.4. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60

18、352-5:2012 was approved by CENELEC as a European Standard without any modification. BS EN 60352-5:2012- 3 - EN 60352-5:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normati

19、vely referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by comm

20、on modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050-581 2008 International Electrotechnical Vocabulary - Part 581: Electromechanical components for electronic equipment - - IEC 60068-1 + corr. October + A1 1988 1988 1992 Environmental testing

21、 - Part 1: General and guidance EN 60068-11)1994 IEC 60352-1 + corr. October 1997 1998 Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance EN 60352-1 1997 IEC 60512 Series Connectors for electronic equipment - Tests and measurements EN 605

22、12 Series IEC 60512-1-100 - Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications EN 60512-1-100 - IEC 61188-5-1 - Printed boards and printed board assemblies -Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requireme

23、nts EN 61188-5-1 - IEC 61249 Series Materials for printed boards and other interconnecting structures EN 61249 Series IEC 62326-4 1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specificationEN 62326-4 1997 1) EN 60068-1 includes A1 to IEC 60068-

24、1 + corr. October. BS EN 60352-5:2012 2 60352-5 IEC:2012 CONTENTS INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 8 4 Requirements . 9 4.1 General . 9 4.2 Tools . 9 4.2.1 General . 9 4.2.2 Tools evaluation 9 4.3 Press-in terminations. 9 4.3.1 Materials . 9

25、4.3.2 Dimensions of the press-in zone 9 4.3.3 Dimensions of the plated through hole . 9 4.3.4 Surface finishes . 9 4.4 Test boards . 10 4.4.1 General . 10 4.4.2 Materials . 10 4.4.3 Thickness of test boards 10 4.4.4 Plated-through hole . 10 4.5 Press-in connections . 12 4.6 Manufacturers specificati

26、on 12 5 Tests 13 5.1 General remarks 13 5.1.1 General . 13 5.1.2 Standard conditions for testing 13 5.1.3 Mounting of specimens 14 5.2 Test and measuring methods 14 5.2.1 General examination 14 5.2.2 Mechanical tests 14 5.2.3 Electrical tests . 18 5.2.4 Climatic tests . 19 5.3 Test schedules 20 5.3.

27、1 General . 20 5.3.2 Qualification test schedule . 20 5.3.3 Flow chart . 22 5.3.4 Application test schedule . 22 5.4 Test report 23 5.4.1 Qualification test report . 23 5.4.2 Application test report 24 Annex A (informative) Practical guidance . 25 Bibliography 32 Figure 1 Plated-through hole 10 Figu

28、re 2 Location and example of the transversal microsection for measuring the copper thickness . 11 BS EN 60352-5:2012 2 60352-5 IEC:2012 CONTENTS INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 8 4 Requirements . 9 4.1 General . 9 4.2 Tools . 9 4.2.1 General

29、 . 9 4.2.2 Tools evaluation 9 4.3 Press-in terminations. 9 4.3.1 Materials . 9 4.3.2 Dimensions of the press-in zone 9 4.3.3 Dimensions of the plated through hole . 9 4.3.4 Surface finishes . 9 4.4 Test boards . 10 4.4.1 General . 10 4.4.2 Materials . 10 4.4.3 Thickness of test boards 10 4.4.4 Plate

30、d-through hole . 10 4.5 Press-in connections . 12 4.6 Manufacturers specification 12 5 Tests 13 5.1 General remarks 13 5.1.1 General . 13 5.1.2 Standard conditions for testing 13 5.1.3 Mounting of specimens 14 5.2 Test and measuring methods 14 5.2.1 General examination 14 5.2.2 Mechanical tests 14 5

31、.2.3 Electrical tests . 18 5.2.4 Climatic tests . 19 5.3 Test schedules 20 5.3.1 General . 20 5.3.2 Qualification test schedule . 20 5.3.3 Flow chart . 22 5.3.4 Application test schedule . 22 5.4 Test report 23 5.4.1 Qualification test report . 23 5.4.2 Application test report 24 Annex A (informativ

32、e) Practical guidance . 25 Bibliography 32 Figure 1 Plated-through hole 10 Figure 2 Location and example of the transversal microsection for measuring the copper thickness . 11 BS EN 60352-5:201260352-5 IEC:2012 3 Figure 3 Example of hole ranges 12 Figure 4 Test arrangement, bending 15 Figure 5 Test

33、 arrangement push-out force 16 Figure 6 Transverse section of a press-in connection . 17 Figure 7 Longitudinal section of a press-in connection . 18 Figure 8 Test arrangement for contact resistance 19 Figure 9 Qualification test schedule . 22 Figure A.1 Example of a termination removal tool 29 Figur

34、e A.2 Conceptual composition of a four-layer printed circuit-board . 30 Table 1 Plated-through hole requirements for test boards 11 Table 2 Vibration, preferred test severities . 17 Table 3 Qualification test schedule Test group A. 20 Table 4 Qualification test schedule Test group B. 21 Table 5 Qual

35、ification test schedule Test group C 21 Table 6 Application test schedule Test group D . 23 Table A.1 Example for dimensioning the hole . 31 BS EN 60352-5:2012 6 60352-5 IEC:2012 INTRODUCTION This part of IEC 60352 includes requirements, tests and practical guidance information. Two test schedules a

36、re provided. a) The qualification test schedule applies to individual press-in connections (press-in zone). They are tested to the specification provided by the manufacturer of the press-in termination (see 4.6) taking into account the requirements of Clause 4. The qualification is independent of th

37、e application of the press-in zone in a component. b) The application test schedule applies to press-in connections which are part of a component and are already qualified to the qualification test schedule. Test sequences focus on the performance of the press-in connection which is affected by the

38、implementation in a component. As the manufacturer of the press-in termination has to provide the main part of the information needed for qualification, the word “manufacturer“ is used throughout this standard for simplicity. IEC Guide 109 advocates the need to minimise the impact of a product on th

39、e natural environment throughout the product life cycle. BS EN 60352-5:2012 6 60352-5 IEC:2012 INTRODUCTION This part of IEC 60352 includes requirements, tests and practical guidance information. Two test schedules are provided. a) The qualification test schedule applies to individual press-in conne

40、ctions (press-in zone). They are tested to the specification provided by the manufacturer of the press-in termination (see 4.6) taking into account the requirements of Clause 4. The qualification is independent of the application of the press-in zone in a component. b) The application test schedule

41、applies to press-in connections which are part of a component and are already qualified to the qualification test schedule. Test sequences focus on the performance of the press-in connection which is affected by the implementation in a component. As the manufacturer of the press-in termination has t

42、o provide the main part of the information needed for qualification, the word “manufacturer“ is used throughout this standard for simplicity. IEC Guide 109 advocates the need to minimise the impact of a product on the natural environment throughout the product life cycle. BS EN 60352-5:201260352-5 I

43、EC:2012 7 SOLDERLESS CONNECTIONS Part 5: Press-in connections General requirements, test methods and practical guidance 1 Scope and object This part of IEC 60352 is applicable to solderless press-in connections for use in tele-communication equipment and in electronic devices employing similar techn

44、iques. The press-in connection consists of a termination having a suitable press-in zone which is inserted into a plated-through hole of a double-sided or multilayer printed board. Information on materials and data from industrial experience is included in addition to the test procedures to provide

45、electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of press-in connections under mechanical, electrical and atmospheric conditions as specified by the manufacturer of the press-in termination and to provide

46、a means of comparing test results when the tools used to make the connections are of different designs or manufacture. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, onl

47、y the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(581):2008, International Electrotechnical Vocabulary (IEV) Part 581: Electromechanical components for electronic equipment IEC 60068-1:1988, Environmental

48、testing Part 1: General and guidance Amendment 1 (1992) IEC 60352-1:1997, Solderless connections Part 1: Wrapped connections General require-ments, test methods and practical guidance IEC 60512 (all parts), Connectors for electronic equipment Tests and measurements IEC 60512-1-100, Connectors for el

49、ectronic equipment Tests and measurements Part 1-100: General Applicable publications IEC 61188-5-1: Printed boards and printed board assemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements IEC 61249 (all parts), Materials for printed boards and other interconnecting structures IEC 62326-4:1996, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification BS EN 60352-5