EN 60749-1-2003 en Semiconductor devices - Mechanical and climatic test methods Part 1 General《半导体器件 机械和气候试验方法 第1部分 总则 IEC 60749-1-2002 替代EN 60749 1999+A1+A2-2001》.pdf

1、BRITISH STANDARD BS EN 60749-1:2003 Semiconductor devices Mechanical and climatic test methods Part 1: General The European Standard EN 60749-1:2003 has the status of a British Standard ICS 31.080.01 BS EN 60749-1:2003 This British Standard was published under the authority of the Standards Policy a

2、nd Strategy Committee on 7 July 2003 BSI 7 July 2003 ISBN 0 580 42198 8 National foreword This British Standard is the official English language version of EN 60749-1:2003. It is identical with IEC 60749-1:2002. It partially supersedes BS EN 60749:1999 which will be withdrawn on 2005-10-01. The UK p

3、articipation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or Eur

4、opean publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include

5、all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries

6、 on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 8, an inside back c

7、over and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60749-1 NORME EUROPENNE EUROPISCHE NORM June 2003 CENELEC European Committee for Electrotechnical Stand

8、ardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-1:20

9、03 E ICS 31.080.01 Supersedes EN 60749:1999 + A1:2000 + A2:2001English version Semiconductor devices - Mechanical and climatic test methods Part 1: General (IEC 60749-1:2002) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques Partie 1: Gnralits (CEI 60749-1:2002) Halbleiterbauele

10、mente - Mechanische und klimatische Prfverfahren Teil 1: Allgemeines (IEC 60749-1:2002) This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the sta

11、tus of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German)

12、. A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Repub

13、lic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 47/1638/FDIS, future edition 1 of IEC 60749-1, prepared by IEC TC 47, Semiconduct

14、or devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-1 on 2002-09-24. This European Standard, together with the other parts of the series EN 60749, supersedes EN 60749:1999 + A1:2000 + A2:2001, in which the test methods were contained in one standard whi

15、ch was subdivided into chapters relating to mechanical test methods, climatic test methods and miscellaneous test methods. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004

16、-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-10-01 Each test method governed by this standard and which is part of the series is a stand-alone document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is sequenti

17、al, and there is no relationship between the number and the test method (i.e. no grouping of test methods). The list of these tests will be available in the CENELEC internet site and in the catalogue. Updating of any of the individual test methods is independent of any other part. Annexes designated

18、 “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60749-1:2002 was approved by CENELEC as a European Standard without any modification. _ Page2 EN607491:2003C

19、ONTENTS INTRODUCTION.4 1 Scope.5 2 Normative references.5 3 Terms, definitions and letter symbols .5 4 Standard atmospheric conditions5 5 Electrical measurements6 6 Use of electrically defective devices .6 Annex ZA (normative) Normative references to international publications with their correspondi

20、ng European publications .8 Page3 EN607491:2003INTRODUCTION Activity within IEC technical committee 47, working group 2, includes the generation, coordination and review of climatic, electrical (of which only ESD, latch-up and electrical conditions for life tests are considered), mechanical test met

21、hods, and associated inspection techniques needed to assess the quality and reliability of the design and manufacture of semiconductor products and processes. Page4 EN607491:2003SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 1: General 1 Scope This part of IEC 60749 is applicable to

22、 semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series. In the case of contradiction between this standard and a relevant procurement specification, the latter should govern. 2 Normative references The following refere

23、nced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary (IEV

24、) IEC 60747 (all parts), Semiconductor devices Discrete devices IEC 60748 (all parts), Semiconductor devices Integrated circuits 3 Terms, definitions and letter symbols The terms, definitions and symbols used in IEC 60747 and IEC 60748 apply. For general terminology readers are referred to IEC 60050

25、 (VEI) series. 4 Standard atmospheric conditions 4.1 All tests and recoveries, unless otherwise specified, shall be carried out under standard atmospheric conditions for testing: temperature: 15 C to 35 C; relative humidity: 45 % to 75 %, where appropriate; air pressure: 86 kPa to 106 kPa. 4.2 All e

26、lectrical measurements, as well as recoveries followed by measurements, shall however, be carried out under the atmospheric conditions: temperature: (25 5) C; relative humidity: 45 % to 75 %, where appropriate; air pressure: 86 kPa to 106 kPa. Page5 EN607491:20034.3 Before the measurements are made

27、, the specimens shall be stored until temperature equilibrium is reached with a view to stabilization. The ambient temperature during the measurements shall be stated in the test report. 4.4 During measurements, the specimens shall not be exposed to draughts, illumination or other influences likely

28、to cause error. 5 Electrical measurements 5.1 For environmental testing, the characteristics to be checked shall be selected from the “Acceptance and reliability” clause of the relevant part of the IEC 60747 or the IEC 60748 series; they are specified for each device category . 5.2 Measurement condi

29、tions: refer to the table “Conditions for the endurance tests” in the “Acceptance and reliability” clause of the relevant part of the IEC 60747 or the IEC 60748 series. 5.3 Initial measurements If upper specification limit and/or lower specification limit criteria are required only, it is left to th

30、e discretion of the manufacturer whether initial measurements are made or not. Initial measurements shall be made where individual values for an individual device are a criterion. 5.4 Measurements monitored during environmental testing To be stated, where appropriate. 5.5 Final measurements When the

31、 test is called for in the relevant specification as part of a sequence (sub-group) of tests, measurements are required only at the end of the sequence. 6 Use of electrically defective devices For certain tests, such as solderability or lead fatigue, electrically defective devices may be used. Page6

32、 EN607491:2003Annex A (informative) Cross-references index 60749 IEC 60749-xx Title Chapter Clause number -1 -3 -1 General External visual examination General 1 1 1 1 to 4 5 6 -14 -21 -15 -20 -12 -10 -36 -22 -19 Robustness of terminations (lead integrity) 1Solderability 1Resistance to soldering temp

33、erature for through-hole mounted devices 1Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat Vibration, variable frequency Mechanical shock Acceleration, steady state 1Bond strength Die shear strength 12 2 2 2 2 2 2 2 2 1 2.1 2.2 2.3 3 4 5 6 7 -25 -11 -6 -2

34、 -5 -4 -8 -13 -7 Rapid change of temperature (air, air) 1Rapid change of temperature Two-fluid-bath method Storage at high temperature Low air pressure Under consideration Steady state temperature humidity bias life test 1Damp heat, steady state, highly accelerated test (HAST) Sealing Salt atmospher

35、e Under consideration Internal moisture content measurement and the analysis of other residual gases 3 3 3 3 3 3 3 3 3 3 3 1.1 1.2 2 3 4A 4B 4C 5 6 7 8 -31 -32 -9 Flammability of plastic-encapsulated devices (internally induced) Flammability of plastic-encapsulated devices (externally induced) Perma

36、nence of marking 4 4 4 1.1 1.2 2 _ 1To be published. Page7 EN607491:2003 Annex ZA (normative) Normative references to international publications with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These

37、 normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated

38、 references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050 Series International Electrotech

39、nical Vocabulary (IEV) - - IEC 60747 Series Semiconductor devices - Discrete devices EN 60747 Series IEC 60748 Series Semiconductor devices - Integrated circuits - - Page8 EN607491:2003blankBS EN 60749-1:2003 BSI 389 Chiswick High Road London W4 4AL BSI British Standards Institution BSI is the indep

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