EN 60749-11-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 11 Rapid Change of Temperature Two-Fluid-Bath Method《半导体器件 机械和气候试验方法 第11部分 温度的急速变化 双液电镀槽法 IEC 60.pdf

1、BRITISH STANDARD BS EN 60749-11:2002 Incorporating Corrigendum No. 1 Semiconductor devices Mechanical and climatic test methods Part 11: Rapid change of temperature Two-fluid-bath method The European Standard EN 60749-11:2002 has the status of a British Standard ICS 31.080.01 BS EN 60749-11:2002 Thi

2、s British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 24 September 2002 BSI 24 October 2003 ISBN 0 580 40395 5 National foreword This British Stand

3、ard is the official English language version of EN 60749-11:2002. It is identical with IEC 60749-11:2002, including Corrigendum 1:2003 and Corrigendum 2:2003. It partially supersedes BS EN 60749:1999. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors

4、, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the

5、 section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct applicati

6、on. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monito

7、r related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 8, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the

8、 document was last issued. Amendments issued since publication Amd. No. Date Comments 14681 24 October 2003 Incorporating IEC Corrigenda Nos. 1 and 2EUROPEAN STANDARD EN 60749-11 NORME EUROPENNE EUROPISCHE NORM August 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen

9、 de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-11:2002 E ICS 31.080.01 Part

10、ly supersedes EN 60749:1999 + A1:2000 + A2:2001 English version Semiconductor devices - Mechanical and climatic test methods Part 11: Rapid change of temperature - Two-fluid-bath method (IEC 60749-11:2002) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques Partie 11: Variations r

11、apides de temprature - Mthode des deux bains (CEI 60749-11:2002) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren Teil 11: Rascher Temperaturwechsel - Zweibderverfahren (IEC 60749-11:2002) This European Standard was approved by CENELEC on 2002-07-02. CENELEC members are bound to comp

12、ly with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Sec

13、retariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as

14、 the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kin

15、gdom.NE 067-9411:2002 -2 - Foreword The text of document 47/1605/FDIS, future edition 1 of IEC 60749-11, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-11 on 2002-07-02. This mechanical and climatic test method, as

16、 it relates to rapid change of temperature and two-fluid-bath method, is a complete rewrite of the test contained in 1.2, chapter 3 of EN 60749:1999. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard o

17、r by endorsement (dop) 2003-04-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-07-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement

18、notice The text of the International Standard IEC 60749-11:2002 was approved by CENELEC as a European Standard without any modification. _ Page2 BSEN6074911:2002067-9411 CEI:0220 3 INTRODUCTION This test is conducted to determine the resistance of a device to sudden exposure to extreme or rapid chan

19、ges in temperature and to the effect of alternate exposure to these extremes. Exposure to this test may not induce the same failure mechanisms as exposure to air to air temperature cycling. Page3 BSEN6074911:2002067-9411 CEI:0220 4 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 11:

20、Rapid change of temperature Two-fluid-bath method 1 Scope This part of IEC 60749 defines the rapid change of temperature test method and the two-fluid- bath method. When both test methods are performed as part of a device qualification, results of air to air temperature cycling take priority over th

21、is two-fluid-bath test method. This test method may also be used, employing fewer cycles (e.g. 5 to 10 cycles), to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unle

22、ss otherwise detailed in the relevant specification. In general, this rapid change of temperature and two-fluid bath method test is in conformity with IEC 60068-2-14 but, due to specific requirements of semiconductors, the clauses of this standard apply. 2 Normative references The following referenc

23、ed documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-3, Semiconductor devices Mechanical and climatic test methods

24、 Part 3: External visual methods IEC 60068-2-14:1984, Environmental testing Part 2: Tests Test N: Change of temperature 3 Terms and definitions For the purpose of this part of IEC 60749, the following terms and definitions apply. 3.1 load load composed of the specimens under test and the fixtures ho

25、lding those specimens during test NOTE The maximum load is the maximum mass of specimens and fixtures that can be placed in the working zone of the bath while maintaining specified temperature and times. 3.2 monitoring sensor temperature sensor that is located and calibrated so as to indicate the sa

26、me temperature as at the worst-case indicator specimen location NOTE The worst-case indicator specimen location is identified during the periodic characterization of the worst- case load temperature. Page4 BSEN6074911:2002067-9411 CEI:0220 5 3.3 worst-case load temperature temperature of a specific

27、specimen as indicated by a thermocouple embedded in the body and located at the centre of the load 3.4 specimen device or individual part being tested 3.5 transfer time elapsed time measured from removal of the load from one bath until insertion in the other bath 3.6 maximum load largest load for wh

28、ich the worst-case load temperature meets the timing requirements (see 5.1) 3.7 dwell time the total time the load is immersed in the bath 4 Test apparatus The bath(s) used shall be capable of providing and controlling the specified temperatures in the working zone(s) when the bath is loaded with a

29、maximum load. The thermal capacity and liquid circulation shall enable the working zone and loads to meet the specified conditions and timing (see 5.1). The worst-case load temperature shall be continually monitored during the test by indicators or recorders reading the monitoring sensor(s). The wor

30、st-case load temperature under maximum load conditions and configuration shall be verified as needed to validate bath performance. Perfluorocarbons that meet the physical property requirements of table 2 shall be used for conditions B, C and D. 5 Procedure Specimens shall be placed in the bath in a

31、position so that the flow of liquid across and around them is substantially unobstructed. The load shall then be subjected to condition C or as otherwise specified in table 1 for a duration of 15 cycles (for cleaning simulation the duration shall be 10 cycles). Completion of the total number of cycl

32、es specified for the test may be interrupted for the purpose of loading or unloading of device lots or as the result of power or equipment failure. However, if the number of interruptions for any given test exceeds 10 % of the specified number of cycles, the test shall be restarted from the beginnin

33、g. 5.1 Timing The total transfer time from hot to cold or from cold to hot shall not exceed 10 s. The load may be transferred when the worst-case load temperature is within the limits specified in table 1. However, the dwell time shall be not less than 2 min and the load shall reach the specified te

34、mperature within 5 min. Page5 BSEN6074911:2002067-9411 CEI:0220 6 Table 1 Thermal shock temperature tolerances and suggested fluids 1 ABCD Test conditions Temperature C Temperature C Temperature C Temperature C Temperature tolerance 10 0 85 10 2 100 10 0 125 10 0 150 Step 1 Recommended fluid Perfluo

35、rocarbon 2,3 Perfluorocarbon 3 Perfluorocarbon 3 Perfluorocarbon 3 Temperature tolerance 0 30 40 2 10 0 0 10 55 0 10 65 Step 2 Recommended fluid Perfluorocarbon 3 Perfluorocarbon 3 Perfluorocarbon 3 Perfluorocarbon 3 1 Ethylene glycol shall not be used as a thermal shock test fluid. 2 Water is indic

36、ated as an acceptable fluid for this temperature range. 3 Perfluorocarbons contain no chlorine or hydrogen. NOTE Device chemical resistance to the thermal shock liquids should be established prior to running the test. 5.2 Test measurement Hermeticity tests, for hermetic devices, visual examination,

37、and electrical measurements that consist of parametric and functional tests, shall be taken as specified in the applicable procurement document. 5.3 Failure criteria After exposure to the test, a device shall be defined as a failure if hermeticity, for hermetic devices, cannot be demonstrated, if pa

38、rametric limits are exceeded, or if device functionality cannot be demonstrated under nominal and worst-case conditions specified in the applicable procurement document. Mechanical damage, such as cracking, chipping, or breaking of the package (as defined in IEC 60749-3) shall be considered a failur

39、e, provided that such damage was not induced by fixing or handling. Table 2 Physical property requirements of perfluorocarbon fluids 1 Test condition B C D Boiling point ( C) 100 125 150 Step 1 Density at 25 C g/cm 3 Dielectric strength V/mm Residue ( 10 6 ) Appearance 1,6 12 000 1,6 12 000 0 215 51

40、0 tSep 1 sneDitta y 52 /g Ccm 3 Dielecrtrts cienght mm/V seRid( eu 01 6 ) Aaepparcne ,16 0 2100 056 0 2100 05 lCae,r cololruess liiuqd 1p ehTefrluorcoarobsu ned slahl aha ev ivscosity less than or qelau to the tmrehal scohk uqeipmtne mfunacaturers recommiv dednescosity ta the miinmum temtarepru.e 6e

41、gaP 2002:1194706NESB067-9411 CEI:0220 7 6 Summary The following details shall be specified in the applicable procurement document: a) Special mounting, if applicable. b) Temperature extremes (see Table 1), number of cycles, or specific component require- ments (see clause 5). c) Interim measurement

42、intervals, when required (see 5.2). d) Electrical measurements (see 5.2). e) Special acceptance criteria for examinations, seal tests (for hermetic packages), and electrical tests (see 5.2). f) For qualification testing, sample size and quality level. _ Page7 BSEN6074911:2002- 3 E N64709-1102:02 Ann

43、ex ZA (normative) Normative references to international publications with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and th

44、e publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (inclu

45、ding amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60749-3 - 1) Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination EN 6

46、0749-3 2002 2) IEC 60068-2-14 1984 Environmental testing Part 2: Tests - Test N: Change of temperature EN 60068-2-14 3) 19991)Undated reference. 2)Valid edition at date of issue. 3)EN 60068-2-14 includes A1:1986 to IEC 60068-2-14. Page8 BSEN6074911:2002BS EN 60749-11:2002 BSI 389 Chiswick High Road

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