EN 60749-15-2010 en Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (Incorporating corri.pdf

1、raising standards worldwide NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BSI Standards Publication Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices BS EN 60749-15:2010 Incorporating corr

2、igendum February 2011 National foreword This British Standard is the UK implementation of EN 60749-15:2010, withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request

3、 to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2011 ISBN 978 0 580 74712 0 ICS 31.080.01 Compliance with a British Standard cannot confer immunity from legal obligations. This British

4、Standard was published under the authority of the Standards Policy and Strategy Committee on 28 February 2011. Amendments corrigenda issued since publicationDate T ext affected BRITISH STANDARD BS EN 60749-15:2010It supersedes BS EN 60749-15:2003, which is incorporating corrigendum February 2011. It

5、 is identical to IEC 60749-15:2010. / 30 June 2011 Incorporation of CENELEC corrigendum February 2011:Modification of CENELEC Foreword EUROPEAN STANDARD EN 60749-15 NORME EUROPENNE EUROPISCHE NORM December 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalis

6、ation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-15:2010 E ICS 31.080.01 Supersedes EN 60749-

7、15:2003 English version Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010) Dispositifs semiconducteurs - Mthodes dessai mcaniques et climatiques - Partie 15: Rsistance la temprature de souda

8、ge pour dispositifs par trous traversants (CEI 60749-15:2010) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 15: Bestndigkeit gegen Lttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2010) This European Standard was approved by CENELEC on 2010-12-10. CENELEC m

9、embers are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applic

10、ation to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretaria

11、t has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta,

12、 the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Incorporating corrigendum February 2011EN 60749-15:2010 (E) - 3 - Foreword The text of document 47/2067/FDIS, future edition 2 of IEC 60749-15, prepared by IEC TC 47, Semicondu

13、ctor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-15 on 2010-12-01. This European Standard supersedes EN 60749-15:2003. The significant changes with respect from EN 60749-15:2003 include: editorial change in the scope, addition of lead-free solder c

14、hemical composition specification. Attention is drawn to the possibility that some of the elements of this document may be the subject of pat- ent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which

15、 the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-12-01 _ Endorsement notice The text of the International Standard IE

16、C 60749-15:2010 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. _ BS EN 60749-15:2010 4 IEC:2010 SEMICONDUCTOR DEVICES M

17、ECHANICAL AND CLIMATIC TEST METHODS Part 15: Resistance to soldering temperature for through-hole mounted devices 1 Scope This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to

18、which they are subjected during soldering of their leads by using wave soldering or a soldering iron. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether device

19、s are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. This test

20、is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of semiconductors, the clauses of this standard apply. 2 General The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wav

21、e soldering or reflow heat exposure on the same side of the board as the package body. 3 Test apparatus 3.1 3.2 3.3 Solder pot A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot dimensions shall allow full immersion of the leads without touching the bott

22、om. The apparatus shall be capable of maintaining the solder at the temperature specified in Table 1. Dipping device A mechanical dipping device shall be used that is capable of controlling the rates of immersion and emersion of the leads and providing the dwell time as specified in Table 1. Heatsin

23、ks or shielding If applicable, heatsinks or shielding shall be attached to the devices prior to the test and shall be as specified in the relevant specification. BS EN 60749-15:2010 EN 60749-15:2010 (E) 5 Table 1 Parameters for solder dipping Parameter Condition A (for wave solder) Condition B (for

24、soldering iron) Temperature of molten solder C 260 5 350 5 Number of immersions 2 2 Immersion rate mm s 1 25 5 25 5 Dwell time s 10 5 10 5 Emersion rate mm s 1 25 5 25 5 Distance between solder bath and device body mm 1,5 0,5 1,5 0,5 4 Materials 4.1 4.2 5.1 5.2 Solder The solder specification shall

25、be as follows. Chemical composition for SnPb solder the composition in percentage by weight shall be as follows: Tin: 59 % to 65 %; Lead: the remainder. Chemical composition for Pb-free solder the composition in percentage by weight shall be as follows: Silver: 3 % to 4 %; Copper: 0.5 % to 1 %; Tin:

26、 the remainder. The solder shall not contain impurities which will adversely affect its properties. Other solders and their applicable bath temperatures may be used as specified in the relevant specification. Flux If flux is applied prior to solder dipping, the flux shall consist of 25 % by weight o

27、f colophony in 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification. 5 Procedure Pre-conditioning of specimens Any special pre-conditioning of the specimens prior to testing shall be as specified in the relevant specification. This preparation may include oper

28、ations such as bending or other relocation of leads, and the attachment of heat sinks or protective shielding prior to solder dipping. Preparation of the solder bath The molten solder shall be stirred to assure that the temperature is uniform. The dross shall be skimmed from the surface of the molte

29、n solder just prior to dipping the part. BS EN 60749-15:2010 EN 60749-15:2010 (E) 6 5.3 5.4 5.5 5.6 5.7 Use of flux Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux prior to solder dip; excess flux shall be removed by draining for a suitable time. Solde

30、r dip The part shall be attached to the dipping device (see 3.2) and the leads immersed in the molten solder until the body of the device under test reaches the dimensions specified in Table 1. The parameters for solder temperature, dwell time, number of immersions and rates of immersion and emersio

31、n are defined in Table 1. Unless otherwise detailed in the procurement specification, Condition A shall be used. After the dipping process, the part shall be allowed to cool in air and, if flux has been used, residues shall be removed with isopropanol or ethanol. Precautions Prior to and after the s

32、older immersion, precautionary measures shall be taken to prevent undue exposure of the part to the heat radiated by the solder bath. Measurements Hermeticity tests for hermetic devices, visual examination and electrical measurements that consist of parametric and functional tests, shall be made as

33、specified in the relevant specification. Failure criteria A device shall be defined as a failure if hermeticity for hermetic devices cannot be demonstrated, if parametric limits are exceeded or if functionality cannot be demonstrated under nominal and worst-case conditions specified in the relevant

34、specification. Mechanical damage such as cracking, chipping or breaking of the package (10 20 magnification) will also be considered a failure, provided such damage was not induced by fixturing or handling. 6 Summary The following details shall be specified in the relevant specification: a) use of h

35、eatsinks or shielding, if applicable (see 3.3); b) flux composition if applicable (see 5.3); c) older composition if other than detailed in this standard (see 4.1); d) pre-conditioning of specimens, if applicable (see 5.1); e) condition (A or B), time and depth of immersion, if other than as specifi

36、ed in Table 1; f) method of hermeticity tests, visual examination and electrical measurements (see 5.6); g) failure criteria of hermeticity tests, visual examination and electrical measurements (see 5.7); h) sample size. BS EN 60749-15:2010 EN 60749-15:2010 (E) 7 Bibliography IEC 60068-2-20, Environ

37、mental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads _ BS EN 60749-15:2010 EN 60749-15:2010 (E) This page deliberately left blankBSI is the independent national body responsible for preparing British Standards and other standar

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