EN 60749-19-2003 en Semiconductor devices C Mechanical and climatic test methods Part 19 Die shear strength (Incorporating Corrigendum June 2003 Incorporates Amendment A1 2010)《半导体.pdf

1、BRITISH STANDARDBS EN 60749-19:2003Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strengthICS 31.080.01g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g

2、50g51g60g53g44g42g43g55g3g47g36g58+A1:2010National forewordThis British Standard is the UK implementation of EN 60749-19:2003+A1:2010. It is identical with IEC 60749-19:2003, incorporating corrigendum June 2003 and amendment 1:2010. It supersedes BS EN 60749-19:2003 which is withdrawn.The UK partici

3、pation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for i

4、ts correct application.Compliance with a British Standard cannot confer immunity from legal obligations.BS EN 60749-19:2003+A1:2010This British Standard was published under the authority of the Standards Policy and Strategy Committee on 20 June 2003 BSI 2010Amendments/corrigenda issued since publica

5、tionDate Comments 31 October 2010 Implementation of IEC amendment 1:2010 with CENELEC endorsement A1:2010. Addition of Note 2 in the Scope.ISBN 978 0 580 68745 7EUROPEAN STANDARD EN 60749-19NORME EUROPENNE EUROPISCHE NORM CENELEC European Committee for Electrotechnical Standardization Comit Europen

6、de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-19:2003 E ICS 31.080.01 Incor

7、porates Corrigendum June 2003English version Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength (IEC 60749-19:2003) Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 19: Rsistance de la pastille au cisaillement (CEI 60749-19:2003) Halblei

8、terbauelemente Mechanische und klimatische Prfverfahren Teil 19: Prfung der Chip-Bondfestigkeit (IEC 60749-19:2003) This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving th

9、is European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versio

10、ns (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of A

11、ustria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. :2003+A1 September 2010 Foreword The text of document 47/1664/FDIS, future edition

12、1 of IEC 60749-19, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-19 on 2003-04-01. This mechanical and climatic test method, as it relates to die shear strength, is a complete rewrite of the test contained in Clau

13、se 7, Chapter 2 of EN 60749:1999. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-01-01 latest date by which the national standards conflicting with the EN have to be wit

14、hdrawn (dow) 2006-04-01 The contents of the corrigendum of March 2003 have been included in this copy. _ Endorsement notice The text of the International Standard IEC 60749-19:2003 was approved by CENELEC as a European Standard without any modification. _ Page 2Foreword to amendment A1 The text of d

15、ocument 47/2016/CDV, future amendment 1 to IEC 60749-19:2003, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 60749-19:2003 on 2010-09-01. Attention is drawn to the possibility that some of the elements of

16、 this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard

17、 or by endorsement (dop) 2011-06-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2013-09-01 _ Endorsement notice The text of amendment 1:2010 to the International Standard IEC 60749-19:2003 was approved by CENELEC as an amendment to the Europe

18、an Standard without any modification. _ BS EN 60749-19:2003+A1:2010EN 60749-19:2003+A1:2010 (E)SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 19: Die shear strength 1 Scope This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semicond

19、uctor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than

20、10 mm2. It is also not applicable to flip chip technology or to flexible substrates. NOTE 1occurs, the type of failure resulting from the application of force and the visual appearance of the residual die attach medium and the header/substrate metallization. 2 Description of the test apparatus The a

21、pparatus for this test shall consist of a load applying instrument in the form of a linear motion force-applying instrument or a circular dynamometer with a lever arm. In addition it shall have the following: a) a contact tool which applies a uniform load to the edge of the die, perpendicular to the

22、 die mounting plane of the package or substrate (see Figure 3). A compliant material on the contact tool may be used to ensure that the load is applied uniformly (see Figure 1); b) an accuracy of 5 % of full scale or 0,5 N, whichever is the greater tolerance; c) a means of indicating the load applie

23、d; d) a facility, fitted with suitable light source, to allow visual observation (e.g. at 10 magnification) of the die and contact tool during testing; e) a fixture with rotational capability relative to the die contact tool and package/substrate holding fixture to allow line contact of the tool alo

24、ng the whole edge of the die from end to end (see Figure 2). NOTE Many measuring equipments are graduated in kilogram-force (kgf) (1 kgf = 9,8 N). Page 3NOTE 2 In cavity packages, die shear strength is measured in order to assure the strength of the die attachment within the cavity. In non-cavity pa

25、ckages, such as plastic encapsulated packages, die bonding is used to prevent die movement until the resin mould is completely cured. Normally, specification of the die shear strength and the minimum adhesion area of die bond after moulding are unnecessary, except in the following circumstances: whe

26、n the die needs to be electrically connected to die pad; when heat from the die needs to be diffused through the die bond.This determination is based on a measure of the force applied to the die or to the element, and, if a failure BS EN 60749-19:2003+A1:2010EN 60749-19:2003+A1:2010 (E)3 Test method

27、 A force sufficient to shear the die from its mounting, or equal to twice the minimum specified shear strength (see Clause 4), whichever is the smaller, shall be applied to the die using the apparatus of Clause 2, with the following provisions. a) When a linear motion force-applying instrument is us

28、ed, the direction of the applied force shall be parallel with the plane of the header or substrate and perpendicular to the die being tested. b) When a circular dynamometer with a lever arm is employed to apply the force required for testing, it shall be pivoted about the lever arm axis and the moti

29、on shall be parallel with the plane of the header or substrate and perpendicular to the edge of the die being tested. The contact tooling attached to the lever arm shall be at a proper distance to ensure an accurate value of applied force. c) The die contact tool shall load against an edge of the di

30、e which most closely approximates a 90 angle with the base of the header or substrate to which it is bonded (see Figure 3). d) After initial contact with the die edge and during the application of force, the contact tool shall not move vertically with respect to the die such that contact is made wit

31、h the header/substrate or die attach medium. If the tool rides over the die, a new die may be substituted or the die may be repositioned, provided that the requirements of item c) of Clause 3 are met. 4 Failure criteria The strength of attachment of a die shall be considered to have failed the test

32、if any of the following criteria exists: a) Unless otherwise specified in the relevant specification, die separation at a force not greater than the following: 1) 4,1 mm2 die area 10 mm2: 25 N, 2) die area 10 mm2: not applicable (see clause 1); b) die separation at a force less than 1,25 times that

33、in item a) above and evidence of less than 50 % adhesion of the die attach medium to the die (as determined by visual inspection); c) die separation at a force less than 2 times that in item a) above and evidence of less than 10 % adhesion of the die attach medium to the die (as determined by visual

34、 inspection). NOTE Residual die material attached in discrete areas of the die attach medium should be considered as evidence of such adhesion. 5 Requirements When specified, the force required to achieve separation and the category of the separation shall be recorded. Page 4BS EN 60749-19:2003+A1:2

35、010EN 60749-19:2003+A1:2010 (E)6 Categories of separation a) Shearing of die with residual die material remaining. b) Separation of die from die attach medium. c) Separation of die and die attach medium from package. 7 Summary When this test is required in the relevant specification, the following d

36、etails shall be given: a) Minimum die attach strength if other than that given by the expressions in item a) of Clause 4. b) The number of devices to be tested and acceptance criteria. c) Requirements for data recording, when applicable (see Clauses 5 and 6). ContacttoolDirectionof forceContacttoolD

37、ieDieIEC 285/03NOTE A compliant interface on the contact tool distributes the load to the irregular edge of the die. Figure 1 Compliant interface on contact tool (plane view) ContacttoolDirectionof forceContacttoolDie DieIEC 286/03NOTE The die contact tool or the device may be rotated to ensure para

38、llel alignment. Figure 2 Alignment of tool with die (plane view) Page 5BS EN 60749-19:2003+A1:2010EN 60749-19:2003+A1:2010 (E)Die90Directionof forceContacttoolIEC 287/03NOTE The contact tool is loaded against the edge of the die which is perpendicular to the header/substrate. Figure 3 Choice of die

39、edge for application of contact tool (elevation) _ Page 6BS EN 60749-19:2003+A1:2010EN 60749-19:2003+A1:2010 (E)blankBSI GroupHeadquarters 389 Chiswick High Road, London, W4 4AL, UK Tel +44 (0)20 8996 9001 Fax +44 (0)20 8996 7001 standardsBSI - British Standards InstitutionBSI is the independent na

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