EN 60749-28-2017 en Semiconductor devices - Mechanical and climatic test methods - Part 28 Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device l.pdf

1、Semiconductor devices Mechanical and climatic test methodsPart 28: Electrostatic discharge (ESD) sensitivity testing Charged device model (CDM) device level (IEC 60749-28:2017)BS EN 60749-28:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME

2、EUROPENNE EUROPISCHE NORM EN 60749-28 June 2017 ICS 31.080.01 English Version Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017) Dispositifs semiconducteurs - Mthode

3、s dessai mcaniques et climatiques - Partie 28: Essai de sensibilit aux dcharges lectrostatiques (DES) - Modle de dispositif charg par contact direct (DC-CDM) (IEC 60749-28:2017) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 28: Prfung der Empfindlichkeit gegen elektrostatis

4、che Entladungen (ESD) - Charged Device Model (CDM) - Device Level (IEC 60749-28:2017) This European Standard was approved by CENELEC on 2017-05-02. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the statu

5、s of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French,

6、 German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Be

7、lgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spa

8、in, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of

9、 exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60749-28:2017 E National forewordThis British Standard is the UK implementation of EN 60749-28:2017. It is identical to IEC 60749-28:2017.The UK participation in its preparation was entrusted to Technical

10、Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institu

11、tion 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 53678 6ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2017.Amendments/corri

12、genda issued since publicationDate Text affectedBRITISH STANDARDBS EN 6074928:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-28 June 2017 ICS 31.080.01 English Version Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity te

13、sting - Charged device model (CDM) - device level (IEC 60749-28:2017) Dispositifs semiconducteurs - Mthodes dessai mcaniques et climatiques - Partie 28: Essai de sensibilit aux dcharges lectrostatiques (DES) - Modle de dispositif charg par contact direct (DC-CDM) (IEC 60749-28:2017) Halbleiterbauele

14、mente - Mechanische und klimatische Prfverfahren - Teil 28: Prfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Charged Device Model (CDM) - Device Level (IEC 60749-28:2017) This European Standard was approved by CENELEC on 2017-05-02. CENELEC members are bound to comply with the C

15、EN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management C

16、entre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same st

17、atus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuan

18、ia, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotech

19、nische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60749-28:2017 E BS EN 6074928:2017EN 60749-28:2017 2 European foreword The text of document 47/2362

20、/FDIS, future edition 1 of IEC 60749-28, prepared by IEC/TC 47 “Semiconductor devices“ in collaboration with IEC/TC 101 “Electrostatics“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-28:2017. The following dates are fixed: latest date by which the document has to

21、 be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-02-02 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-05-02 Attention is drawn to the possibility that some of the elements of thi

22、s document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-28:2017 was approved by CENELEC as a European Standard without any modification. In the official ve

23、rsion, for Bibliography, the following note has to be added for the standard indicated: IEC 60749-26 NOTE Harmonized as EN 60749-26. 2 IEC 60749-28:2017 IEC 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 8 4 Required equipment 9 4.1 CDM ESD tes

24、ter . 9 4.1.1 General . 9 4.1.2 Current-sensing element 10 4.1.3 Ground plane . 10 4.1.4 Field plate/field plate dielectric layer 10 4.1.5 Charging resistor . 11 4.2 Waveform measurement equipment 11 4.2.1 General . 11 4.2.2 Cable assemblies 11 4.2.3 Equipment for high-bandwidth waveform measurement

25、 . 11 4.2.4 Equipment for 1,0 GHz waveform measurement 11 4.3 Verification modules (metal discs) . 11 4.4 Capacitance meter 11 4.5 Ohmmeter . 12 5 Periodic tester qualification, waveform records, and waveform verification requirements . 12 5.1 Overview of required CDM tester evaluations 12 5.2 Wavef

26、orm capture hardware . 12 5.3 Waveform capture setup . 12 5.4 Waveform capture procedure 12 5.5 CDM tester qualification/requalification procedure 13 5.5.1 CDM tester qualification/requalification procedure . 13 5.5.2 Conditions requiring CDM tester qualification/requalification 13 5.5.3 1 GHz oscil

27、loscope correlation with high bandwidth oscilloscope . 14 5.6 CDM tester quarterly and routine waveform verification procedure 14 5.6.1 Quarterly waveform verification procedure . 14 5.6.2 Routine waveform verification procedure . 14 5.7 Waveform characteristics 14 5.8 Documentation 16 5.9 Procedure

28、 for evaluating full CDM tester charging of a device 16 6 CDM ESD testing requirements and procedures 17 6.1 Device handling 17 6.2 Test requirements . 17 6.2.1 Test temperature and humidity 17 6.2.2 Device test 17 6.3 Test procedures 17 6.4 CDM test recording / reporting guidelines . 18 7 CDM class

29、ification criteria . 18 Annex A (normative) Verification module (metal disc) specifications and cleaning guidelines for verification modules and testers 19 BS EN 6074928:2017EN 60749-28:2017 2 European foreword The text of document 47/2362/FDIS, future edition 1 of IEC 60749-28, prepared by IEC/TC 4

30、7 “Semiconductor devices“ in collaboration with IEC/TC 101 “Electrostatics“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-28:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identi

31、cal national standard or by endorsement (dop) 2018-02-02 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-05-02 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall

32、 not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-28:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added f

33、or the standard indicated: IEC 60749-26 NOTE Harmonized as EN 60749-26. 2 IEC 60749-28:2017 IEC 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 8 4 Required equipment 9 4.1 CDM ESD tester . 9 4.1.1 General . 9 4.1.2 Current-sensing element 10 4.

34、1.3 Ground plane . 10 4.1.4 Field plate/field plate dielectric layer 10 4.1.5 Charging resistor . 11 4.2 Waveform measurement equipment 11 4.2.1 General . 11 4.2.2 Cable assemblies 11 4.2.3 Equipment for high-bandwidth waveform measurement . 11 4.2.4 Equipment for 1,0 GHz waveform measurement 11 4.3

35、 Verification modules (metal discs) . 11 4.4 Capacitance meter 11 4.5 Ohmmeter . 12 5 Periodic tester qualification, waveform records, and waveform verification requirements . 12 5.1 Overview of required CDM tester evaluations 12 5.2 Waveform capture hardware . 12 5.3 Waveform capture setup . 12 5.4

36、 Waveform capture procedure 12 5.5 CDM tester qualification/requalification procedure 13 5.5.1 CDM tester qualification/requalification procedure . 13 5.5.2 Conditions requiring CDM tester qualification/requalification 13 5.5.3 1 GHz oscilloscope correlation with high bandwidth oscilloscope . 14 5.6

37、 CDM tester quarterly and routine waveform verification procedure 14 5.6.1 Quarterly waveform verification procedure . 14 5.6.2 Routine waveform verification procedure . 14 5.7 Waveform characteristics 14 5.8 Documentation 16 5.9 Procedure for evaluating full CDM tester charging of a device 16 6 CDM

38、 ESD testing requirements and procedures 17 6.1 Device handling 17 6.2 Test requirements . 17 6.2.1 Test temperature and humidity 17 6.2.2 Device test 17 6.3 Test procedures 17 6.4 CDM test recording / reporting guidelines . 18 7 CDM classification criteria . 18 Annex A (normative) Verification modu

39、le (metal disc) specifications and cleaning guidelines for verification modules and testers 19 BS EN 6074928:2017IEC 60749-28:2017 IEC 2017 3 A.1 Tester verification modules and field plate dielectric . 19 A.2 Care of verification modules 19 Annex B (normative) Capacitance measurement of verificatio

40、n modules (metal discs) sitting on a tester field plate dielectric . 20 Annex C (informative) CDM test hardware and metrology improvements 21 Annex D (informative) CDM tester electrical schematic 23 Annex E (informative) Sample oscilloscope setup and waveform . 24 E.1 General . 24 E.2 Settings for t

41、he 1 GHz bandwidth oscilloscope 24 E.3 Settings for the high-bandwidth oscilloscope . 24 E.4 Setup 24 E.5 Sample waveforms from a 1 GHz oscilloscope 24 E.6 Sample waveforms from an 8 GHz oscilloscope 25 Annex F (informative) Field-induced CDM tester discharge procedures 27 F.1 General . 27 F.2 Singl

42、e discharge procedure . 27 F.3 Dual discharge procedure . 27 Annex G (informative) Waveform verification procedures . 29 G.1 Factor/offset adjustment method . 29 G.2 Software voltage adjustment method. 32 G.3 Example parameter recording tables . 34 Annex H (informative) Determining the appropriate c

43、harge delay for full charging of a large module or device 36 H.1 General . 36 H.2 Procedure for charge delay determination . 36 Annex I (informative) Electrostatic discharge (ESD) sensitivity testing direct contact charged device model (DC-CDM) 38 I.1 General . 38 I.2 Standard test module 38 I.3 Tes

44、t equipment (CDM simulator) . 38 I.3.1 Test equipment design. 38 I.3.2 DUT (device under test) support 38 I.3.3 Metal bar/board . 39 I.3.4 Equipment setup 39 I.4 Verification of test equipment 39 I.4.1 General description of verification test equipment 39 I.4.2 Instruments for measurement 41 I.4.3 V

45、erification of test equipment, using a current probe . 41 I.5 Test procedure 42 I.5.1 Initial measurement . 42 I.5.2 Tests . 42 I.5.3 Intermediate and final measurement 43 I.6 Failure criteria . 43 I.7 Classification criteria . 43 I.8 Summary 43 Bibliography 44 Figure 1 Simplified CDM tester hardwar

46、e schematic 10 BS EN 6074928:2017IEC 60749-28:2017 IEC 2017 3 A.1 Tester verification modules and field plate dielectric . 19 A.2 Care of verification modules 19 Annex B (normative) Capacitance measurement of verification modules (metal discs) sitting on a tester field plate dielectric . 20 Annex C

47、(informative) CDM test hardware and metrology improvements 21 Annex D (informative) CDM tester electrical schematic 23 Annex E (informative) Sample oscilloscope setup and waveform . 24 E.1 General . 24 E.2 Settings for the 1 GHz bandwidth oscilloscope 24 E.3 Settings for the high-bandwidth oscillosc

48、ope . 24 E.4 Setup 24 E.5 Sample waveforms from a 1 GHz oscilloscope 24 E.6 Sample waveforms from an 8 GHz oscilloscope 25 Annex F (informative) Field-induced CDM tester discharge procedures 27 F.1 General . 27 F.2 Single discharge procedure . 27 F.3 Dual discharge procedure . 27 Annex G (informativ

49、e) Waveform verification procedures . 29 G.1 Factor/offset adjustment method . 29 G.2 Software voltage adjustment method. 32 G.3 Example parameter recording tables . 34 Annex H (informative) Determining the appropriate charge delay for full charging of a large module or device 36 H.1 General . 36 H.2 Procedure for charge delay determination . 36 Annex I (informative) Electrostatic discharge (ESD) sensitivity testing direct contact charged device model (DC-CDM) 38 I.1 General . 38 I.2 Standard test modul