1、BRITISH STANDARD BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies Part 1: General The European Standard EN 61192-1:2003 has the status of a British Standard ICS 31.190 BS EN 61192-1:2003 This British Standard was published under the authority of the Standards Policy and
2、 Strategy Committee on 26 June 2003 BSI 26 June 2003 ISBN 0 580 42112 0 National foreword This British Standard is the official English language version of EN 61192-1:2003. It is identical with IEC 61192-1:2003. The UK participation in its preparation was entrusted to Technical Committee EPL/501, El
3、ectronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in
4、 the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsib
5、le for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the U
6、K interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 75 and a back cover. The BSI copyright date displayed in this document indicates w
7、hen the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 61192-1 NORME EUROPENNE EUROPISCHE NORM March 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr E
8、lektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-1:2003 E ICS 31.190 English version Workmanship requirements for soldered electronic as
9、semblies Part 1: General (IEC 61192-1:2003) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 1: Gnralits (CEI 61192-1:2003) A nforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 1: Allgemeines (IEC 61192-1:2003) This European Standard was approved by CENELEC
10、on 2003-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards m
11、ay be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified t
12、o the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slo
13、vakia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 91/345/FDIS, future edition 1 of IEC 61192-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-1 on 2003-03-01. The follow
14、ing dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-12-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2006-03-01 This standard should
15、 be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 2: Surface-mount assemblies Part 3: Through-hole mount assemblies Part 4: Terminal assemblies Annexes designated “normative“ are part of the body of
16、 the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-1:2003 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following n
17、otes have to be added for the standards indicated: IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58:1999 (not modified). IEC 60326 NOTE Related but not equivalent to EN 123600:1996, EN 123700:1996 and EN 123800:1996. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1:2002 (not modified). IEC 61189-2 NOTE
18、Harmonized as EN 61189-2:1997 (not modified). IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified). IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified). ISO 9453 NOTE Harmonized as EN ISO 29453:1993 (not modified
19、). _ 2egaP 3002:129116NE Page2 EN611921:2003 CONTENTS INTRODUCTION.6 1 Scope and object7 2 Normative references7 3 Terms and definitions .8 4 General requirements .8 4.1 Order of precedence8 4.2 Process control11 4.3 Facilities12 4.4 Process identification.13 5 Pre-process activities15 5.1 Design ch
20、ecks.15 5.2 Specification and procurement of components .17 5.3 Specification and procurement of printed boards17 5.4 Specification and procurement of process materials.18 5.5 Inspection plan, inspection facilities and handling.19 5.6 Storage and kitting of components, boards and materials.20 5.7 Ha
21、ndling during assembly, packaging and shipping21 5.8 Electrical testing 21 6 Component preparation22 6.1 Lead and termination solderability22 6.2 Lead forming .24 6.3 Lead flattening.25 6.4 Lead cropping25 6.5 Lead coplanarity26 6.6 Thermal shock during re-tinning.26 6.7 Moisture and gas traps 26 7
22、Mounting structure and printed board preparation26 7.1 Surface preparation .26 7.2 Temporary masking requirements26 7.3 Gold on printed board surface-mount lands27 7.4 Printed board condition27 8 Surface-mount solder paste deposition .27 8.1 Description of process .27 8.2 Storage and handling of sol
23、der paste .28 8.3 Screen (off-contact) printing.29 8.4 Stencil (in-contact) printing 30 8.5 Syringe dispensing 31 8.6 Transfer deposition of solder preforms.31 9 Non-conductive adhesive deposition and curing 32 9.1 Stencil printing.32 9.2 Syringe dispensing 32 9.3 Pin transfer printing .33 9.4 Adhes
24、ive curing.33 Page3 EN611921:2003 10 Surface-mounted component placement .34 10.1 Leadless discrete components with metallized terminations34 10.2 Leadless circular cylinder components, for example, metal electrode leadless faces (MELFs).34 10.3 Leaded discrete small component packages 34 10.4 Leade
25、d integrated circuit packages36 10.5 Leaded fine-pitch integrated circuit packages .37 10.6 Modified leaded through-hole packages .37 10.7 Leadless chip carrier packages37 10.8 Placement equipment 37 11 Through-hole component insertion 39 11.1 General.39 11.2 Axial lead components (two leads).40 11.
26、3 Radial lead components (two leads).40 11.4 Radial lead components (three or more leads) .41 11.5 Multilead integrated circuit packages .41 11.6 Pin grid array (PGA) components.42 11.7 Surface-mount packages modified for insertion42 11.8 Large components.42 11.9 Insertion methods and equipment 42 1
27、1.10 Cutting and clinching leads 43 12 Placement of terminals and press-fit pins44 12.1 Attachment of terminals to printed boards 44 12.2 Soldering wires and component leads to terminals .44 13 Reflow soldering .45 13.1 Infrared reflow soldering in pass-through equipment.46 13.2 Convection reflow so
28、ldering in pass-through equipment .47 13.3 Mixed infrared and convection reflow soldering in pass-through equipment.47 13.4 Vapour phase reflow soldering.47 13.5 Laser scan reflow soldering .48 13.6 Thermode (hot bar) reflow soldering 49 13.7 Hot gas multijet reflow soldering 49 13.8 Focused infrare
29、d multi-point reflow soldering .50 14 Immersion soldering .50 14.1 General requirements 51 14.2 Wave soldering52 14.3 Drag soldering.53 14.4 Hot dip soldering .53 15 Individual point soldering 53 15.1 Manual soldering with an iron.53 15.2 Hot gas pencil reflow soldering 55 16 Cleanliness/cleaning.56
30、 16.1 Use of no clean fluxes57 16.2 Cleaning materials.57 16.3 Cleaning processes .57 16.4 Cleanliness assessment 58 Page4 EN611921:2003 17 Electrical test59 17.1 In-circuit test .60 17.2 Functional test.60 17.3 Test probes and probe lands60 18 Rework and repair 60 18.1 General.60 18.2 Unmarked comp
31、onents61 18.3 Pre-heating printed boards and sensitive components61 18.4 Re-use of removed components.61 18.5 Selection of rework tools and equipment 62 18.6 Surface-mounted component realignment 64 18.7 Adding solder to existing joints.64 18.8 Removing excess solder65 18.9 Component removal.65 18.1
32、0 Component replacement65 18.11 Repair of assemblies returned from the field 66 19 Conformal coatings, including solder resist .66 19.1 General.66 19.2 Conformal protective coating .66 19.3 Solder mask coating 69 20 Packaging and shipping 70 20.1 Materials.70 20.2 Mechanical protection71 20.3 Markin
33、g/labelling .71 20.4 Handling71 21 Training71 21.1 Training of designers, engineers and senior line management71 21.2 Training production line personnel .71 Annex ZA (normative) Normative references to international publications with their corresponding European publications 73 Bibliography75 Figure
34、 1 SM single-sided surface-mount assembly, reflow only.13 Figure 2 SM single-sided assembly, immersion only .13 Figure 3 Mixed technology assembly, double-sided: reflow and immersion, flow or wave solder .14 Figure 4 Mixed technology assembly, double-sided reflow and manual14 Figure 5 Mixed technolo
35、gy assembly, double-sided, immersion only14 Figure 6 Typical passive surface-mounted component package styles 35 Figure 7 Typical semiconductor surface-mounted component package styles36 Figure 8 Typical axial-lead components 39 Figure 9 Typical radial dual-lead components .39 Figure 10 Radial lead
36、component with shaped lead stand-off 39 Figure 11 Typical radial lead transistor, with spacer40 Figure 12 Typical multilead integrated circuit package types .41 Figure 13 Typical pin grid array package.42 Figure 14 Examples of anchored terminals .44 Figure 15 Types of wire attachment45 Table 1 Recom
37、mended rework equipment for common component types62 Table 2 Limits of conformal coating defects (percentage of one side of board area) 67 Page5 EN611921:2003 INTRODUCTION This part of IEC 61192 covers general workmanship requirements for the manufacture of soldered electronic assemblies that can en
38、able the requirements of IEC 61191-1 and its related sectional standards to be met. The requirements for surface-mount assemblies as well as through-hole mount assemblies and terminal assemblies are given in IEC 61192-2, IEC 61192-3 and IEC 61192-4, which are separate but related standards. Page6 EN
39、611921:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 1: General 1 Scope and object This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrat
40、es. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrat
41、e surfaces such as ceramic or silicon. The purpose of this standards is: a) to define requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies; b) to enable achievement of high yields and high product
42、quality through process control in production: c) to enable the suppliers and users of electronic assemblies to specify good manufacturing practice as part of a contract. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated refer
43、ences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61188-1-1, Printed boards and printed board assemblies Design and use P
44、art 1-1: Generic requirements Flatness considerations for electronic assemblies IEC 61188-5-2, Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components 1)IEC 61189-3, Test methods for electrical materials, interconnection structu
45、res and assemblies Part 3: Test methods for interconnection structures (printed boards) IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly _ 1)To be published. Page7 EN611921:2003 IEC 61191
46、-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC
47、 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-2, Workmanship requirements for soldered electronic assem
48、blies Part 2: Surface- mount assemblies IEC 61192-3, Workmanship requirements for soldered electronic assemblies Part 3: Through- hole mount assemblies IEC 61192-4, Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies IEC 61249-8 (all parts), Materials for intercon
49、nection structures Part 8: Sectional specifi- cation set for non-conductive films and coatings IEC 61340-5-1, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC 61340-5-2, Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide IEC 61760-2, Surface mount
copyright@ 2008-2019 麦多课文库（www.mydoc123.com）网站版权所有
备案/许可证编号：苏ICP备17064731号-1