EN 61192-4-2003 en Workmanship requirements for soldered electronic assemblies Part 4 Terminal assemblies《钎焊电子组件的工艺要求 第4部分 终端组件 IEC 61192-4 2002》.pdf

1、BRITISH STANDARD BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies The European Standard EN 61192-4:2003 has the status of a British Standard ICS 31.190 BS EN 61192-4:2003 This British Standard was published under the authority of the Standard

2、s Policy and Strategy Committee on 30 June 2003 BSI 30 June 2003 ISBN 0 580 42111 2 National foreword This British Standard is the official English language version of EN 61192-4:2003. It is identical with IEC 61192-4:2003. The UK participation in its preparation was entrusted to Technical Committee

3、 EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may

4、 be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users a

5、re responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, an

6、d keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 30, an inside back cover and a back cover. The BSI copyright date disp

7、layed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 61192-4 NORME EUROPENNE EUROPISCHE NORM March 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electro

8、technique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-4:2003 E ICS 31.190 English version Workmanship requi

9、rements for soldered electronic assemblies Part 4: Terminal assemblies (IEC 61192-4:2002) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 4: Assemblage au moyen de bornes (CEI 61192-4:2002) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 4: Baugruppen m

10、it Ltsttzpunkten (IEC 61192-4:2002) This European Standard was approved by CENELEC on 2003-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. U

11、p-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translatio

12、n under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hung

13、ary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 91/335/FDIS, future edition 1 of IEC 61192-4, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELE

14、C parallel vote and was approved by CENELEC as EN 61192-4 on 2003-03-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-12-01 latest date by which the national standards

15、 conflicting with the EN have to be withdrawn (dow) 2006-03-01 This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount assemblies Part 4: Terminal asse

16、mblies Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-4:2002 was approved by CENELEC as a European Standard without any modificatio

17、n. _ Page2 EN611924:2003 CONTENTS INTRODUCTION.5 1 Scope.6 2 Normative references6 3 Terms and definitions .7 4 General requirements .7 4.1 Classification.7 4.2 Conflict7 4.3 Inspection technique7 4.4 Interpretation of requirements7 5 Process characterization.8 5.1 Wire preparation processes .8 5.2

18、Terminal mounting processes 8 5.3 Soldering terminal10 5.4 Solderability.10 5.5 Preconditioning11 5.6 Mechanical securing 11 6 Wire preparation attributes16 6.1 Insulation stripping 16 6.2 Twisted strands .17 7 Connector pins and terminals18 7.1 Soldered connector pins 18 8 Discrete wiring (jumper w

19、ires).20 8.1 Wire selection20 8.2 Wire routing.20 8.3 Staking21 8.4 Termination .21 9 Discrete wiring (jumper wires) attributes22 10 Solder joint acceptance.25 10.1 Post terminations.26 Annex ZA (normative) Normative references to international publications with their corresponding European publicat

20、ions 30 Figure 1 Funnel flange, controlled split .9 Figure 2 Funnel flange, funnel set 10 Figure 3 Wire and lead wrap-around.12 Figure 4 Minimum lead wrap-around.12 Figure 5 Side route connection, bifurcated terminal Target.12 Figure 6 Side route connection, bifurcated terminal Acceptable13 Figure 7

21、 Side route connection, bifurcated terminal Nonconforming .13 Figure 8 Straight-through insertion in bifurcated terminals Acceptable13 Figure 9 Bottom-route terminal connection14 Page3 EN611924:2003 Figure 10 Continuous run wire wraps Acceptable.14 Figure 11 Stress relief for lead wiring .15 Figure

22、12 Insulation clearance measurement15 Figure 13 Wire lead insulation 16 Figure 14 Damaged insulation Acceptable .16 Figure 15 Damaged insulation Nonconforming.16 Figure 16a Untouched wires .17 Figure 16b Retwisted wires.17 Figure 16c Birdcaged wires 17 Figure 16d Cut-wire strands .17 Figure 16 Wire

23、lead conductor17 Figure 17a Wire tinning 18 Figure 17b Excessive wire tinning.18 Figure 17 Solder tinning .18 Figure 18 Acceptable fillets for levels A, B, and C.18 Figure 19 Acceptable solder fillets for levels A and B19 Figure 20 Nonconforming solder coverage for levels A, B, and C 19 Figure 21 So

24、lder wicking conditions for levels A, B, and C 19 Figure 22 Termination, surface mount, leaded 22 Figure 23 Termination, surface mount, leadless22 Figure 24 Wire routing23 Figure 25 Wire routed under or over components .23 Figure 26 Routing near lands24 Figure 27 Wire in component area24 Figure 28 W

25、ire staking .24 Figure 29 Unsecured wire.25 Figure 30 Termination to projecting component leads and plated holes .25 Figure 31 Acceptable solder joint25 Figure 32 Acceptable solder joint26 Figure 33 Nonconforming fractured solder joint.26 Figure 34 Acceptable post termination26 Figure 35 Acceptable

26、bifurcated terminal27 Figure 36 Nonconforming post termination27 Figure 37 Acceptable wire strip gap27 Figure 38 Insulation damage 28 Figure 39 Zero and near zero strip gap conditions 28 Figure 40 Excessive strip gap conditions 29 Figure 41 Excessive insulation damage 29 Table 1 Nicked or broken str

27、and limits8 Page4 EN611924:2003 INTRODUCTION This part of IEC 61192, combined with IEC 61192-1, is used to meet the end-product requirements defined in IEC 61191-1 and IEC 61191-4. This standard may be used to enable the suppliers and users of terminal electronic assemblies to specify good manufactu

28、ring practices as part of a contract. The respective requirements and guidelines for surface-mount assemblies, and through-hole attachment, are included in separate but related standards. Page5 EN611924:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 4: Terminal assemblies 1 Sc

29、ope This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies tha

30、t include surface- mounting or other related assembly technologies, for example through-hole, wires. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the lat

31、est edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 60749:1996, Semiconductor devices Mechanical and climatic test methods Amendment 2:2001 IEC 61189-3, Test methods for electrical materials, i

32、nterconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IEC 6

33、1191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61192-2, Workmanship requirements for soldered electronic assemblies Part 2: Surface- mount asse

34、mblies IEC 61192-3, Workmanship requirements for soldered electronic assemblies Part 3: Through- hole mount assemblies Page6 EN611924:2003 3 Terms and definitions For the purposes of this part of IEC 61192, the definitions of IEC 60194 apply. 4 General requirements The requirements of IEC 61192-1 ar

35、e mandatory for this standard. 4.1 Classification The classification of assemblies is divided into three levels, levels A, B, and C. Definitions of the classification categories and the status of product for each level are given in IEC 61192-1. In general, status is divided into three workmanship co

36、nditions as follows: a) Target b) Acceptable c) Nonconforming 4.2 Conflict Accept and/or reject decisions shall be based on applicable documentation such as contracts, drawings, specifications and reference documents. In the event of conflict, the following order of precedence shall apply: a) procur

37、ement documents as agreed between user and supplier; b) master assembly drawing; c) IEC 61191-1 and IEC 61192-1; d) this standard; e) other documents to the extent that they are specified in this standard. 4.3 Inspection technique For visual inspection, individual specifications may call for magnifi

38、cation aids for examining printed-board assemblies. Binocular vision should be used, and may be accomplished with a single large field magnifier. Magnification of at least 3 shall be used for conventional inserted printed board assemblies. Higher magnifications than 10 will not be found practicable

39、for routine high-speed scanning inspection but will be needed sometimes for detailed diagnosis or referee purposes. 4.4 Interpretation of requirements Unless otherwise specified by the user, the word “shall“, signifies that the requirement is mandatory. Deviation from any “shall“ requirement require

40、s written acceptance by the user, for example via assembly drawing, specification or contract provision. The words “should“ and “may“ reflect recommendations and guidance, respectively, and are used whenever it is intended to express non-mandatory provisions. Page7 EN611924:2003 5 Process characteri

41、zation 5.1 Wire preparation processes Sufficient insulation shall be stripped from the wire or leads to provide for insulation clearances as specified. Chemical stripping agents shall be used for solid wire only and shall be neutralized or removed prior to soldering. After insulation removal, deform

42、ation of remaining insulation shall not exceed 20 % of the insulation thickness. In stripping insulation, care should be taken to avoid nicking or otherwise damaging the wire or the remaining insulation. For level A or B assemblies, the number of damaged or severed strands in a single wire shall not

43、 exceed the limits given in Table 1. For wires used at a potential of 6 kV, or greater, or for level C assemblies, there shall be no broken strands; nicked strands shall be according to Table 1. Insulation discoloration resulting from thermal stripping is permissible. Table 1 Nicked or broken strand

44、 limits Maximum allowable nicked or broken strands Number of strand Level A and B Level C Less than 7 0 0 7-15 1 0 16-18 2 0 19-25 3 0 26-36 4 0 37-40 5 0 41 or more 6 0 Portions of stranded wire which will be soldered shall be tinned prior to mounting. The solder shall penetrate to the inner strand

45、s of the wire and shall wet the tinned portion of the wire. Wicking of solder under the insulation shall be minimized. 5.2 Terminal mounting processes Terminals not connected to printed wiring or ground planes shall be of the rolled flange configuration (see Figure 1). A printed foil land may be use

46、d as a seating surface for a rolled flange provided that the land is isolated and not connected to active printed wiring or ground plane. The shank of the terminal shall be neither perforated nor split, cracked, or otherwise discontinuous to the extent that oils, flux, inks, or other substances util

47、ized for processing the printed board can be entrapped. Circumferential cracks or splits in the shank are not acceptable regardless of extent. The rolled flange shall not be split, cracked, or otherwise discontinuous to the extent that flux, oils, inks, or other liquid substances utilized for proces

48、sing the printed board can be entrapped within the mounting hole. After rolling, the rolled area shall be free of circumferential splits or cracks, but may have a maximum of three radial splits or cracks provided that the splits or cracks are separated by at least 90 and do not extend into the barre

49、l of the terminal (see Figure 1). Page8 EN611924:2003 Flared flange terminals shall be mounted in non-interfacial plated through-holes provided the mounting is in conjunction with a land or ground plane on the flared side as shown in Figure 2; they shall not be flared to the base material of the printed board.