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本文(EN 61340-3-2-2007 en Electrostatics - Part 3-2 Methods for simulation of electrostatic effects - Machine model (MM) electrostatic discharge test waveforms《静电 第3-2部分 静电感应模拟方法 机器模型(M.pdf)为本站会员(fuellot230)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

EN 61340-3-2-2007 en Electrostatics - Part 3-2 Methods for simulation of electrostatic effects - Machine model (MM) electrostatic discharge test waveforms《静电 第3-2部分 静电感应模拟方法 机器模型(M.pdf

1、BRITISH STANDARDBS EN 61340-3-2:2007Electrostatics Part 3-2: Methods for simulation of electrostatic effects Machine model (MM) electrostatic discharge test waveforms The European Standard EN 61340-3-2:2007 has the status of a British StandardICS 17.220.99; 29.020g49g50g3g38g50g51g60g44g49g42g3g58g4

2、4g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61340-3-2:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2

3、007 BSI 2007ISBN 978 0 580 50470 9National forewordThis British Standard was published by BSI. It is the UK implementation of EN 61340-3-2:2007. It is identical with IEC 61340-3-2:2006. It supersedes BS EN 61340-3-2:2002 which is withdrawn.The UK participation in its preparation was entrusted to Tec

4、hnical Committee GEL/101, Electrostatics.A list of organizations represented on GEL/101 can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Sta

5、ndard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61340-3-2 NORME EUROPENNE EUROPISCHE NORM March 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europ

6、isches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61340-3-2:2007 E ICS 17.220.99; 29.020 Supersedes EN 61340-3-2:2002English

7、 version Electrostatics - Part 3-2: Methods for simulation of electrostatic effects - Machine model (MM) electrostatic discharge test waveforms (IEC 61340-3-2:2006) lectrostatique - Partie 3-2: Mthodes pour la simulation des effets lectrostatiques - Formes donde dessai des dcharges lectrostatiques p

8、our les modles de machine (MM) (CEI 61340-3-2:2006) Elektrostatik - Teil 3-2: Verfahren zur Simulation elektrostatischer Effekte - Prfwellenformen der elektrostatischen Entladung fr das Machine Model (MM) (IEC 61340-3-2:2006) This European Standard was approved by CENELEC on 2007-02-01. CENELEC memb

9、ers are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applicati

10、on to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat h

11、as the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherl

12、ands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 61340-3-2:2007 2 Foreword The text of document 101/237/FDIS, future edition 2 of IEC 61340-3-2, prepared by IEC TC 101, Electrostatics, was submitted to the IEC-CENELEC parallel vote an

13、d was approved by CENELEC as EN 61340-3-2 on 2007-02-01. This European Standard supersedes EN 61340-3-2:2002. The major change of EN 61340-3-2:2007 is that it no longer contains the application to semiconductor devices. It recognizes the direction of the IEC SMB (Standardization Management Board) in

14、 terms of considering inputs from TC 47 documents with regard to ESD test methods. TC 101 has revised this IEC 61340-3-2, concerning the machine model, in collaboration with the JWG of TC 47/TC 101. IEC 61340-3-2 incorporates TC 47 input, based on the corresponding TC 47 IEC 60749-27. The following

15、dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-02-01 _ Endorsement notice The

16、 text of the International Standard IEC 61340-3-2:2006 was approved by CENELEC as a European Standard without any modification. _ 3 EN 61340-3-2:2007 ELECTROSTATICS Part 3-2: Methods for simulation of electrostatic effects Machine model (MM) electrostatic discharge test waveforms 1 Scope This part o

17、f IEC 61340 describes the discharge current waveforms used to simulate machine model (MM) electrostatic discharges (ESD) and the basic requirements for equipment used to develop and verify these waveforms. This standard covers MM ESD waveforms for use in general test methods and for application to m

18、aterials or objects, electronic components and other items for ESD withstand test or performance evaluation purposes. The specific application of these MM ESD waveforms to non-powered semiconductor devices is covered in IEC 60749-27. 2 Terms and definitions For the purposes of this document, the fol

19、lowing terms and definitions apply. 2.1 unit under test UUT material, object, item or product to be subjected to the MM ESD test 2.2 UUT failure condition in which a UUT does not meet one or more specified parameters as a result of the ESD test 2.3 ESD withstand voltage maximum applied ESD voltage l

20、evel that does not cause failure parameter limits to be exceeded provided that all UUTs stressed at lower levels have also passed 3 Equipment 3.1 MM ESD waveform generator This equipment produces an electrostatic discharge current pulse simulating a MM ESD event for application to the UUT. The equiv

21、alent waveform generator circuit and tester evaluation loads are illustrated in Figure 1. 3.2 Waveform verification equipment Equipment capable of verifying the MM current waveform is defined in this standard. This equipment includes, but is not limited to, a waveform recording system, a high-voltag

22、e resistor and a current transducer. EN 61340-3-2:2007 4 3.2.1 Waveform recording system The waveform recording system shall have a minimum single shot bandwidth of 350 MHz. 3.2.2 Evaluation loads Two evaluation loads are necessary to verify the functionality of the waveform generator: a) load 1: a

23、shorting wire; b) load 2: a 500 low-inductance resistor with a tolerance of 1 % appropriately rated for the voltages that will be used for waveform qualification. The lead length of the evaluation loads (shorting wire or resistor) shall be as short as possible consistent with connecting the evaluati

24、on load to the appropriate reference terminals (A and B in Figure 1) while passing through the current transducer. 3.2.3 Current transducer The current transducer shall have a minimum bandwidth of 350 MHz. 4 MM current waveform requirements 4.1 General Prior to UUT testing, the MM ESD waveform gener

25、ator qualification shall ensure the waveform integrity of the discharge current through both a shorting wire and a resistive load. The shorting wire waveform requirements are specified in Figure 2 for all positive and negative voltages defined in Table 1, while the resistive load waveform requiremen

26、ts for 400 V are shown in Figure 3 and Table 1. 4.2 Waveform qualification and verification Equipment qualification shall be performed during initial acceptance testing. Re-qualification is required whenever equipment repairs are made that may affect the waveform. Additionally, the waveforms shall b

27、e verified periodically. If a test fixture or circuit-board is used to perform UUT testing, the test fixture (board) shall also be used during equipment qualification tests. In case the waveform no longer meets the waveform parameters described in Table 1 and Figures 2 and 3, all ESD testing perform

28、ed after the previous satisfactory waveform check shall be considered invalid. 5 EN 61340-3-2:2007 Key 1 MM ESD waveform generator (nominally 200 pF) 2 terminal A 3 switch 4 terminal B 5 UUT 6 evaluation load 7 shorting wire 8 resistance R = 500 9 current transducer Figure 1 MM ESD waveform generato

29、r equivalent Requirements for Figure 1: a) The evaluation loads (7 and 8) are specified in 3.2.2. b) The current transducer (9) is specified in 3.2.3. c) The reversal of terminals A (2) and B (4) to achieve dual polarity is not permitted. d) The switch (3) is closed 10 ms to 100 ms after the pulse d

30、elivery period of each single MM pulse to ensure that the UUT and any test fixture are not left in a charged state. NOTE 1 The performance of the waveform generator is strongly influenced by parasitic capacitance and inductance. NOTE 2 Precautions should be taken in the design of the waveform genera

31、tor to avoid recharge transients and double pulses. NOTE 3 A resistance in series with the switch ensures a slow discharge of the UUT. IEC 678/02 EN 61340-3-2:2007 6 Table 1 Waveform specification Level Equivalent voltage V Ip1 peak current through a shorting wireA (15 %) IPR peak current through a

32、500 resistorA I100 current through a 500 resistor at 100 nsA (15 %) 1 100 1,7 - - 2 200 3,5 - - 3 400 7,0I100 4,5 0,29 4 800 14,0 - - 20 ns per divisionIp1tpmt1t0t2t3Ip2IEC 682/02Figure 2 Typical current waveform through a shorting wire Requirements for Figure 2: The current pulse shall meet the fol

33、lowing requirements. Ip1the maximum peak current is specified in Table 1. Ip2the second peak current shall be between 67 % and 90 % of the absolute value obtained for Ip1 for each level. tpmthe period of the major pulse shall be between 63 ns and 91 ns. The measurement shall be made between the firs

34、t zero crossing point, t1, and the third zero crossing point, t3. 7 EN 61340-3-2:2007 20 ns per divisionIPRI100IEC 683/02Figure 3 Typical current waveform through a 500 resistor Requirements for Figure 3. The current pulse through a 500 resistor shall meet the following characteristics: IPRis the ma

35、ximum peak current shall be within the range specified in Table 1; I100is the current at 100 ns is defined in Table 1. 5 Evaluation of ESD robustness of the UUT 5.1 General Application conditions appropriate to the UUT shall be established for the following parameters: sample size; pulse count; puls

36、e interval; stress voltage levels; test temperature and humidity; relevant parameter specification limits indicating ESD test failure. 5.2 Evaluation of UUTs that have electrical terminals Evaluation of the ESD robustness of a UUT that has electrical terminals will often require that the terminals a

37、re classified into different types, for example, input, output, power supply or ground. EN 61340-3-2:2007 8 Each non-power supply terminal shall then be tested (one at a time) with respect to power supply or ground terminals. In the case of evaluation of UUTs that have electrical terminals, the weak

38、est pin combination and the failure threshold for MM should be found. Thus, UUTs that do not have many electrical terminals, generally are tested for MM on all pin combination, but, in the case of UUTs having many electrical terminals, it is possible to select the test pin combination as the pin gro

39、uping. The specific application of the MM waveform to determine the ESD robustness of semiconductor devices is given in IEC 60749-27. 5.3 Evaluation of UUTs that do not have electrical terminals In the case where the UUT is a material or object that does not have electrical terminals (for example, p

40、ackaging materials), it may be necessary to apply the waveform to the UUT via applied electrodes or other appropriate means. 6 Test procedure An appropriate test procedure shall be defined according to the specific application. NOTE 1 The specific application of the MM waveform to determine the ESD

41、robustness of semiconductor devices is given in IEC 60749-27. It is permitted to use any voltage level as the starting stress level. One pulse of both polarities shall be applied for all UUT terminal or electrode combinations and stress levels. NOTE 2 Some types of UUT may have “fail windows” in whi

42、ch no failures are sustained over a range of applied ESD stress levels (for example, no fail at 100 V, fail at 200 V, no fail at 300 V and fail again from 400 V upwards). It is recommended that no stress level should be missed in order to detect such fail windows. It is permitted to use separate sam

43、ples for each UUT stress combination and/or polarity. It is permitted to use the same samples at the next higher voltage level if all UUT samples pass the failure criteria at testing after stressing at the lower level. If a different UUT sample is stressed at each level and/or combination and/or pol

44、arity, it is permitted to perform UUT testing after all samples have been stressed. 7 Failure criteria A UUT is considered to have experienced an ESD failure if it does not meet all the relevant parameter specifications following the ESD test. 8 MM ESD withstand classification An appropriate classif

45、ication system for the application shall be established if required. NOTE The ESD withstand voltage will normally be an appropriate basis for classification, but, in some cases, other bases may be used. In many cases, it will be sufficient to refer to the UUT ESD withstand voltage without the need f

46、or an additional classification system. The basic MM ESD withstands classification applicable to semiconductor devices is given in IEC 60749-27. 9 EN 61340-3-2:2007 Bibliography IEC 60749-27, Semiconductor devices Mechanical and climatic test methods Part 27: Electrostatic discharge (ESD) sensitivit

47、y testing Machine model (MM) NOTE Harmonized as EN 60749-27:2006 (not modified). _ BS EN 61340-3-2:2007BSI389 Chiswick High RoadLondonW4 4ALBSI British Standards InstitutionBSI is the independent national body responsible for preparing British Standards. It presents the UK view on standards in Europ

48、e and at the international level. It is incorporated by Royal Charter.RevisionsBritish Standards are updated by amendment or revision. Users of British Standards should make sure that they possess the latest amendments or editions.It is the constant aim of BSI to improve the quality of our products

49、and services. We would be grateful if anyone finding an inaccuracy or ambiguity while using this British Standard would inform the Secretary of the technical committee responsible, the identity of which can be found on the inside front cover. Tel: +44 (0)20 8996 9000. Fax: +44 (0)20 8996 7400.BSI offers members an individual updating service called PLUS which ensures that subscribers automatically receive the latest editions of standards.Buying standardsOr

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